SCHEMBL6764853

SCHEMBL6764853

C[SiH](C)OO[Si](C)(C)O[SiH](C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6764852 0.85
SCHEMBL4570327 0.85
SCHEMBL12869963 0.85
SCHEMBL15025642 0.85
SCHEMBL10018790 0.85
SCHEMBL4570329 0.85
SCHEMBL12573973 0.85
SCHEMBL6764850 0.85
SCHEMBL4570330 0.85
SCHEMBL12203028 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170137583-A1 METHOD FOR PRODUCING A CURED PRODUCT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-18 US disclosed
US-20160222170-A1 PHOTO-CURABLE FLUOROPOLYETHER-BASED RUBBER COMPOSITION, CURING METHOD THEREOF AND CURED PRODUCT OBTAINED BY THE CURING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-04 US disclosed
US-9093625-B2 Curable composition for encapsulating optical semiconductor and optical semiconductor apparatus using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-07-28 US disclosed
US-9023927-B2 Adhesive composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-05-05 US disclosed
US-8952077-B2 Silicone rubber composition, silicone rubber molded article, and production method thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-02-10 US disclosed
US-8883913-B2 Resin composition, resin film, semiconductor device, and production method thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-11-11 US disclosed
US-8865820-B2 Fluorine-containing curable composition and rubber article SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-10-21 US disclosed
US-8860076-B2 Optical semiconductor sealing curable composition and optical semiconductor apparatus using this SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-10-14 US disclosed
US-8796410-B2 Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-08-05 US disclosed
US-20140135416-A1 SILICONE RUBBER COMPOSITION, SILICONE RUBBER MOLDED ARTICLE, AND PRODUCTION METHOD THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-05-15 US disclosed
US-20120277362-A1 METHOD FOR PRODUCING SILICONE RUBBER COMPOUND AND SILICONE RUBBER COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-11-01 US disclosed
US-8299196-B2 Adhesive composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-10-30 US disclosed
US-20120123049-A1 THERMOSETTING FLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESION METHOD SHIN-ETSU CHEMICAL CO., LTD (JP) 2012-05-17 US disclosed
US-8110065-B2 Heat-curable fluoropolyether adhesive composition and bonding method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-02-07 US disclosed
US-20120016081-A1 CURABLE PERFLUOROPOLYETHER GEL COMPOSITION AND GEL PRODUCT PRODUCED BY USING CURED PERFLUOROPOLYETHER GEL COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-01-19 US disclosed
US-20110257315-A1 ADHESIVE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-10-20 US disclosed
US-20110251311-A1 ADDITION CURABLE SELF-ADHESIVE SILICONE RUBBER COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-10-13 US disclosed
US-20110237732-A1 FLUORINE-CONTAINING CURABLE COMPOSITION AND RUBBER ARTICLE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-09-29 US disclosed
US-7972759-B2 Electrophotographic image-receiving sheet, method for producing the same and image forming method FUJIFILM CORPORATION (JP) 2011-07-05 US disclosed
US-20110059274-A1 METHOD OF PRODUCING RECORDING MEDIUM AND INKJET RECORDING MEDIUM FUJIFILM CORPORATION (JP) 2011-03-10 US disclosed