SCHEMBL677406

SCHEMBL677406

CNc1ccc(C2(c3ccc(NC(=O)c4ccc(C5(c6ccc(C(C)=O)cc6)c6ccccc6-c6ccccc65)cc4)c(O)c3)c3ccccc3-c3ccccc32)cc1O

nearest known ligand 0.42

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.42
ESR2 Q92731 1/20 0.42
HDAC2 Q92769 1/20 0.39
KMT2A Q03164 6/20 0.38
MEN1 O00255 4/20 0.37
POLB P06746 3/20 0.37
F10 P00742 1/20 0.37
NPC1 O15118 1/20 0.37
TP53 P04637 1/20 0.37
RAB9A P51151 1/20 0.37
GAA P10253 1/20 0.37
MAPT P10636 1/20 0.37
PDK2 Q15119 1/20 0.36
PRKCI P41743 1/20 0.36
TERT O14746 1/20 0.36
TOP1 P11387 1/20 0.36
KCNMA1 Q12791 1/20 0.36
HDAC1 Q13547 1/20 0.35
RXFP1 Q9HBX9 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL676655 0.90 ESR1 (0.41) ESR1ESR2HDAC2KMT2AMEN1
SCHEMBL1108319 0.80 ESR1 (0.44) ESR1ESR2HDAC2KMT2AMEN1
SCHEMBL13668345 0.79 KMT2A (0.50) KMT2AMEN1POLBNPC1RAB9A
SCHEMBL13967733 0.79 KMT2A (0.50) KMT2AMEN1POLBNPC1RAB9A
SCHEMBL13668348 0.79 KMT2A (0.50) KMT2AMEN1POLBNPC1RAB9A
SCHEMBL14190766 0.78 KMT2A (0.42) HDAC2KMT2AMEN1POLBNPC1
SCHEMBL8984549 0.77 MAPT (0.53) ESR1ESR2KMT2AMEN1POLB
SCHEMBL13967734 0.76 PTPN1 (0.48) KMT2AMEN1POLBNPC1RAB9A
SCHEMBL13668346 0.76 PTPN1 (0.48) KMT2AMEN1POLBNPC1RAB9A
SCHEMBL14190765 0.76 KMT2A (0.43) KMT2AMEN1POLBNPC1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1995271-B1 EPOXY RESIN CURABLE COMPOSITION FOR PREPREG ADEKA CORP (JP) 2013-07-24 EP disclosed
US-7906213-B2 Epoxy resin curable composition for prepreg ADEKA CORPORATION (JP) 2011-03-15 US disclosed
US-20090030147-A1 Epoxy Resin Curable Composition For Prepreg ADEKA CORPORATION (JP) 2009-01-29 US disclosed