⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16605560 | 0.97 | — | — | |
| SCHEMBL12387101 | 0.97 | — | — | |
| SCHEMBL19497424 | 0.97 | — | — | |
| SCHEMBL1700048 | 0.97 | — | — | |
| SCHEMBL1700006 | 0.97 | — | — | |
| SCHEMBL12387096 | 0.97 | — | — | |
| SCHEMBL1700008 | 0.97 | — | — | |
| SCHEMBL12387175 | 0.97 | — | — | |
| SCHEMBL12387145 | 0.97 | — | — | |
| SCHEMBL31511887 | 0.97 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250215210-A1 | DIENE RUBBER COMPOSITION AND METHOD FOR PRODUCING SAME | ETIC INC. (JP) | 2025-07-03 | — | — | US | disclosed |
| EP-4502015-A1 | DIENE RUBBER COMPOSITION AND METHOD FOR PRODUCING SAME | Etic Inc. (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-12037460-B2 | Multi-component type thermally conductive silicone-gel composition, thermally conductive material and heat-emission structure | DOW TORAY CO., LTD. (JP) | 2024-07-16 | — | — | US | disclosed |
| WO-2023190934-A1 | DIENE RUBBER COMPOSITION AND METHOD FOR PRODUCING SAME | 有限会社ETIC | 2023-10-05 | — | — | WO | disclosed |
| US-20230242766-A1 | THERMALLY-CONDUCTIVE TWO-PART ADDITION-CURABLE SILICONE COMPOSITION AND METHOD FOR PRODUCING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-08-03 | — | — | US | disclosed |
| US-20230212396-A1 | THERMALLY CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND METHOD FOR PRODUCING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-06 | — | — | US | disclosed |
| US-20230183483-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD FOR SAME, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-06-15 | — | — | US | disclosed |
| US-20230167347-A1 | THERMAL CONDUCTIVE SILICONE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-06-01 | — | — | US | disclosed |
| US-10030184-B2 | Addition one part curing type heat-conductive silicone grease composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-07-24 | — | — | US | disclosed |
| US-20180022977-A1 | THERMAL CONDUCTIVE SILICONE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-25 | — | — | US | disclosed |
| EP-2439241-B1 | Moisture-thickening heat-conductive silicone grease composition | SHINETSU CHEMICAL CO (JP) | 2013-04-03 | — | — | EP | disclosed |
| US-20110272119-A1 | Thermally Conductive Grease and Methods and Devices in Which Said Grease is Used | DOW SILICONES CORPORATION | 2011-11-10 | — | — | US | disclosed |
| US-20110188213-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRONIC DEVICE | DOW TORAY CO., LTD. (JP) | 2011-08-04 | — | — | US | disclosed |
| US-20110097669-A1 | PHOTOCURABLE COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2011-04-28 | — | — | US | disclosed |
| US-7786056-B2 | silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360 degrees C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-08-31 | — | — | US | disclosed |
| US-20080269084-A1 | silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360 degrees C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable | SHIN -ETSU CHEMICAL CO., LTD. (JP) | 2008-10-30 | — | — | US | disclosed |
| US-7312013-B2 | Photoreactive composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-12-25 | — | — | US | disclosed |
| US-7291671-B2 | Thermoconductive silicone composition | DOW CORNING TORAY COMPANY, LTD. (JP) | 2007-11-06 | — | — | US | disclosed |
| US-20040202956-A1 | a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-10-14 | — | — | US | disclosed |
| EP-1391476-A1 | PHOTOREACTIVE COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-02-25 | — | — | EP | disclosed |