SCHEMBL680005

SCHEMBL680005

NCCCCCNN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11131645 1.00 CA12 (0.53)
SCHEMBL6016766 1.00 CA12 (0.53)
SCHEMBL16616240 1.00 CA12 (0.53)
SCHEMBL8852303 1.00
SCHEMBL4377417 0.97
Hydrochloric Acid SCHEMBL28872771 0.93
SCHEMBL8065129 0.91 CA12 (0.68)
SCHEMBL5048294 0.86
SCHEMBL21357769 0.86 ALOX15 (0.41)
SCHEMBL20515421 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107635917-B Modified amines useful as scale inhibitors in wet-process phosphoric acid production 塞特工业公司 2021-04-30 CN claimed
CN-104195602-B Tight submicrometer structure filling metal plating compositions comprising inhibitor 巴斯夫欧洲公司 2017-05-31 CN claimed
CN-106572963-A Phosphonic copolymer and use thereof in cosmetics field 莱雅公司 2017-04-19 CN claimed
CN-103547631-B Comprise the composition for metal electroplating for the perforation of bottom-up filling silicon and the additive of interconnection part feature 巴斯夫欧洲公司 2016-07-06 CN claimed
CN-102365395-B Metal plating compositions for void-free sub-micron structure fill comprising suppressants BASF SE 2015-04-29 CN claimed
CN-102365396-B Composition for metal plating comprising suppressing agent for void free submicron feature filling BASF SE 2014-12-31 CN claimed
CN-102037051-B Water-dilutable amines and their use SIKA TECHNOLOGY AG 2014-12-24 CN claimed
CN-104195602-A COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING BASF SE 2014-12-10 CN claimed
CN-102369315-B Metal plating compositions for void-free sub-micron structure fill comprising suppressants BASF SE 2014-08-13 CN claimed
CN-103547631-A Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features BASF SE 2014-01-29 CN claimed
CN-118253469-A Laminate and method for producing same 株式会社东进世美肯 2024-06-28 CN disclosed
CN-114867794-B Water-repellent coating composition for wet coating comprising silsesquioxane oligomer 株式会社东进世美肯 2023-10-27 CN disclosed
US-11761091-B2 Surface activated polymers SRG GLOBAL LIRIA, S.L. (ES) 2023-09-19 US disclosed
CN-111511962-B Surface-activated polymers SRG利里亚全球有限公司 2023-02-28 CN disclosed
CN-114867794-A Water-repellent coating composition for wet coating comprising silsesquioxane oligomer 株式会社东进世美肯 2022-08-05 CN disclosed
WO-2010060901-A1 PEPTIDES FOR TREATMENT OF OBESITY NOVO NORDISK A/S (DK) 2010-06-03 WO disclosed
CN-101400442-A Mixed oxide catalysts BASF SE (DE) 2009-04-01 CN disclosed
CN-101107284-A Composition comprising hydrogenated bisglycidyl ether and a crosslinker BASF AG (DE) 2008-01-16 CN disclosed
EP-0003246-B1 POLYAMIDES AND THEIR USE UNILEVER N.V. (NL) 1981-12-23 EP disclosed
US-4247426-A Polyamides EMERY INDUSTRIES, INC. (US) 1981-01-27 US disclosed