SCHEMBL680421

SCHEMBL680421

CC[SiH](CC)O[SiH2][Si](C)(C)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8853383 0.80
SCHEMBL16486567 0.68
SCHEMBL14751817 0.66
SCHEMBL1932416 0.65
SCHEMBL19926835 0.63
SCHEMBL722575 0.61
SCHEMBL28307258 0.60
SCHEMBL7927127 0.60
SCHEMBL170177 0.60
Butane SCHEMBL19927243 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 144 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12606731-B2 Resin composition and heat-dissipating member SEKISUI CHEMICAL CO., LTD. (JP) 2026-04-21 US disclosed
US-12559626-B2 Resin composition, heat-radiating member, and electronic apparatus SEKISUI CHEMICAL CO., LTD. (JP) 2026-02-24 US disclosed
EP-4692414-A1 DIAMOND COMPOSITE PARTICLE AND RESIN COMPOSITION Sekisui Chemical Co., Ltd. (JP) 2026-02-11 EP disclosed
US-20260022036-A1 PERVAPORATION MEMBRANE NITTO DENKO CORP (JP) 2026-01-22 US disclosed
US-20260021456-A1 PERVAPORATION MEMBRANE NITTO DENKO CORP (JP) 2026-01-22 US disclosed
US-20260021455-A1 PERVAPORATION MEMBRANE NITTO DENKO CORP (JP) 2026-01-22 US disclosed
US-20260008017-A1 PERVAPORATION MEMBRANE NITTO DENKO CORP (JP) 2026-01-08 US disclosed
EP-4660249-A1 SILICONE COMPOSITION Sekisui Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
EP-4660248-A1 SILICONE RESIN COMPOSITION Sekisui Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
EP-4656687-A1 RESIN COMPOSITION AND HEAT-DISSIPATING MEMBER Sekisui Chemical Co., Ltd. (JP) 2025-12-03 EP disclosed
WO-2012027377-A2 DOUBLE-SIDED MULTI-LAYER ADHESIVE 3M INNOVATIVE PROPERTIES COMPANY (US) 2012-03-01 WO disclosed
US-20120009399-A1 Double-sided pressure-sensitive adhesive sheet for fixing flexible printed circuit board and method for manufacturing the same NITTO DENKO CORPORATION (JP) 2012-01-12 US disclosed
EP-2374847-A1 Silicone resin sheet Nitto Denko Corporation (JP) 2011-10-12 EP disclosed
EP-1922374-B1 CURABLE COMPOSITIONS, METHODS OF MAKING AND USING THE SAME, AND ARTICLES THEREFROM 3M INNOVATIVE PROPERTIES CO (US) 2010-08-04 EP disclosed
EP-1922374-A1 CURABLE COMPOSITIONS, METHODS OF MAKING AND USING THE SAME, AND ARTICLES THEREFROM 3M Innovative Properties Company (US) 2008-05-21 EP disclosed
US-7279210-B2 Blend of a copolymer of a polyfunctional (meth)acrylate and a fluoroacrylate containing two carbamate groups; vinyl silicone, silicone with H groups and a hydrosilation catalyst; reaction products are used as release materials for release liners and adhesive articles. 3M INNOVATIVE PROPERTIES COMPANY (US) 2007-10-09 US disclosed
WO-2007030319-A1 CURABLE COMPOSITIONS, METHODS OF MAKING AND USING THE SAME, AND ARTICLES THEREFROM 3M INNOVATIVE PROPERTIES COMPANY (US) 2007-03-15 WO disclosed
US-20070054080-A1 Curable compositions, methods of making and using the same, and articles therefrom 3M INNOVATIVE PROPERTIES COMPANY 2007-03-08 US disclosed
EP-0326728-A2 Diorganopolysiloxane-azobenzene alternating copolymers and methods for their preparation Toray Silicone Company, Ltd. (JP) 1989-08-09 EP disclosed
US-4826954-A Diorganopolysiloxane-azobenzene alternating copolymers and methods for their preparation TORAY SILICONE CO., LTD. (JP) 1989-05-02 US disclosed