SCHEMBL6810216

SCHEMBL6810216

O=S(=O)(O)CC(O)C[n+]1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
CHRNA7 P36544 1/20 0.42
CYP1A2 P05177 1/20 0.36
CYP2D6 P10635 1/20 0.36
APEX1 P27695 1/20 0.32
GGPS1 O95749 1/20 0.30
SLC22A6 Q4U2R8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL29558726 0.98 CHRNA7 (0.41) CHRNA7CYP1A2CYP2D6APEX1
Betaine SCHEMBL2129189 0.84 TSHR (0.40) CHRNA7APEX1
SCHEMBL29558436 0.82 CHRNA7 (0.41) CHRNA7CYP1A2CYP2D6GGPS1
SCHEMBL9074655 0.82 CHRNA7 (0.41) CHRNA7CYP1A2CYP2D6GGPS1
Sulfuric Acid SCHEMBL11346791 0.80 CHRNA7 (0.42) CHRNA7CYP1A2CYP2D6GGPS1
Water SCHEMBL6929997 0.78 KMT2A (0.32) CHRNA7
Sulfuric Acid SCHEMBL11383711 0.78 CHRNA7 (0.41) CHRNA7CYP1A2CYP2D6
SCHEMBL28671148 0.78 HTT (0.34) APEX1GGPS1
SCHEMBL28672835 0.78 GGPS1 (0.50) GGPS1
SCHEMBL29558794 0.78 GGPS1 (0.50) GGPS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115161725-A Semi-bright electro-acidic tinning additive, preparation method and application 南通赛可特电子有限公司 2022-10-11 CN claimed
CN-114262917-A Electrolytic nickel (alloy) plating solution 日本高纯度化学株式会社 2022-04-01 CN claimed
EP-3252187-A1 SLIPRING WITH REDUCED CONTACT NOISE Schleifring und Apparatebau GmbH (DE) 2017-12-06 EP claimed
CN-118727074-B Densification agent for improving grain fineness of tin plating layer, tin plating electrolyte prepared by densification agent and preparation method of tin plating electrolyte 中山市康迪斯威科技有限公司 2025-01-28 CN disclosed
CN-118727074-A Densification agent for improving grain fineness of tin plating layer, tin plating electrolyte prepared by densification agent and preparation method of tin plating electrolyte 中山市康迪斯威科技有限公司 2024-10-01 CN disclosed
WO-2024068552-A1 POROUS METAL PLATE MATERIAL VECO B.V. (NL) 2024-04-04 WO disclosed
CN-115161725-A Semi-bright electro-acidic tinning additive, preparation method and application 南通赛可特电子有限公司 2022-10-11 CN disclosed
CN-114262917-A Electrolytic nickel (alloy) plating solution 日本高纯度化学株式会社 2022-04-01 CN disclosed
CN-109996907-B Electrolytic nickel (alloy) plating solution 日本高纯度化学株式会社 2022-01-11 CN disclosed
EP-3252187-A1 SLIPRING WITH REDUCED CONTACT NOISE Schleifring und Apparatebau GmbH (DE) 2017-12-06 EP disclosed
EP-3252187-A1 SLIPRING WITH REDUCED CONTACT NOISE Schleifring und Apparatebau GmbH (DE) 2017-12-06 EP disclosed
EP-1489201-A2 Propanesulfonated or 2-hydroxy-propanesulfonated alkylamine alkoxylates, their preparation and use as additives for the electrolytic deposition of metallic layers Raschig GmbH (DE) 2004-12-22 EP disclosed
EP-0341167-B1 Process for manufacturing a perforated nickel frame by electroforming PIOLAT IND (FR) 1995-06-28 EP disclosed
US-4913783-A Process for the manufacture of a perforated nickel frame by electroforming PIOLAT INDUSTRIE (FR) 1990-04-03 US disclosed
EP-0341167-A1 Process for manufacturing a perforated nickel frame by electroforming PIOLAT INDUSTRIE (FR) 1989-11-08 EP disclosed