Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Betaine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | APEX1 | P27695 | 1/20 | 0.39 |
| ▸ | CHRNA7 | P36544 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6810216 | 0.84 | CHRNA7 (0.42) | APEX1CHRNA7 | |
| Water SCHEMBL29558726 | 0.83 | CHRNA7 (0.41) | APEX1CHRNA7 | |
| Betaine SCHEMBL9760152 | 0.79 | TSHR (0.42) | TSHRALDH1A1LMNAAPEX1 | |
| Betaine SCHEMBL7046211 | 0.76 | TSHR (0.45) | TSHRALDH1A1LMNAAPEX1 | |
| Betaine SCHEMBL9761399 | 0.75 | TSHR (0.38) | TSHRALDH1A1LMNAAPEX1 | |
| Betaine SCHEMBL1628919 | 0.74 | TSHR (0.42) | TSHRALDH1A1LMNAAPEX1 | |
| Betaine SCHEMBL3642873 | 0.71 | TSHR (0.56) | TSHRALDH1A1LMNAAPEX1MAPT | |
| Betaine SCHEMBL7554854 | 0.70 | TSHR (0.45) | TSHRALDH1A1LMNAAPEX1 | |
| Water SCHEMBL6929997 | 0.70 | KMT2A (0.32) | CHRNA7 | |
| SCHEMBL29558436 | 0.70 | CHRNA7 (0.41) | CHRNA7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10666004-B2 | Slipring with reduced contact noise | SCHLEIFRING GMBH (DE) | 2020-05-26 | — | — | US | claimed |
| EP-3084042-B1 | DEPOSITION OF COPPER-TIN AND COPPER-TIN-ZINC ALLOYS FROM AN ELECTROLYTE | UMICORE GALVANOTECHNIK GMBH (DE) | 2018-11-07 | — | — | EP | claimed |
| US-20170346250-A1 | SLIPRING WITH REDUCED CONTACT NOISE | SCHLEIFRING GMBH (DE) | 2017-11-30 | — | — | US | claimed |
| US-20160348259-A1 | DEPOSITION OF COPPER-TIN AND COPPER-TIN-ZINC ALLOYS FROM AN ELECTROLYTE | UMICORE GALVANOTECHNIK GMBH (DE) | 2016-12-01 | — | — | US | claimed |
| EP-3084042-A1 | DEPOSITION OF COPPER-TIN AND COPPER-TIN-ZINC ALLOYS FROM AN ELECTROLYTE | Umicore Galvanotechnik GmbH (DE) | 2016-10-26 | — | — | EP | claimed |
| US-8900436-B2 | Pd and Pd-Ni electrolyte baths | UMICORE GALVANOTECHNIK GMBH (DE) | 2014-12-02 | — | — | US | claimed |
| EP-2283170-B1 | PD AND PD-NI ELECTROLYTE BATHS | UMICORE GALVANOTECHNIK GMBH (DE) | 2012-04-25 | — | — | EP | claimed |
| US-20110168566-A1 | PD and Pd-Ni Electrolyte Baths | UMICORE GALVANOTECHNIK GMBH (DE) | 2011-07-14 | — | — | US | claimed |
| US-6039793-A | FIRST INK MIXTURE CONTAINING WATER, COLORANT AND ZWITTERIONIC COMPOUND, SECOND INK DARKER THAN THE FIRST CONTAINING WATER AND PIGMENT | XEROX CORPORATION (US) | 2000-03-21 | — | — | US | claimed |
| US-5563644-A | Ink jet printing processes with microwave drying | XEROX CORPORATION (US) | 1996-10-08 | — | — | US | claimed |
| EP-0559324-B1 | Ink jet printing processes with microwave drying | XEROX CORP (US) | 1995-10-18 | — | — | EP | claimed |
| EP-0559324-A1 | Ink jet printing processes with microwave drying | XEROX CORPORATION (US) | 1993-09-08 | — | — | EP | claimed |
| US-5169514-A | Gold or gold alloy depositions containing gold compound, alloying metal compounds and imines speed promoters | ENTHONE-OMI, INC. (US) | 1992-12-08 | — | — | US | claimed |
| WO-2024068552-A1 | POROUS METAL PLATE MATERIAL | VECO B.V. (NL) | 2024-04-04 | — | — | WO | disclosed |
| CN-112176366-B | Electrolyte of high-ductility electrolytic copper foil and application | 浙江花园新能源股份有限公司 | 2022-05-31 | — | — | CN | disclosed |
| CN-112301382-B | Preparation method of high-ductility low-profile electrolytic copper foil | 浙江花园新能源股份有限公司 | 2021-11-26 | — | — | CN | disclosed |
| US-5049286-A | Process for purification of nickel plating baths | OMI INTERNATIONAL CORPORATION (US) | 1991-09-17 | — | — | US | disclosed |
| EP-0256776-B1 | METHOD OF COATING A SUBSTRATE BY ELECTRODEPOSITION | Nippon Paint Co., Ltd. (JP) | 1991-05-08 | — | — | EP | disclosed |
| US-4869796-A | Electrodeposition coating composition | NIPPON PAINT CO., LTD. (JP) | 1989-09-26 | — | — | US | disclosed |
| EP-0256776-A2 | Method of coating a substrate by electrodeposition | Nippon Paint Co., Ltd. (JP) | 1988-02-24 | — | — | EP | disclosed |