SCHEMBL683179

SCHEMBL683179

COC(C)OCC1CCCCC1

nearest known ligand 0.41

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
SLC1A3 P43003 4/20 0.41
SLC1A2 P43004 4/20 0.41
SLC1A1 P43005 4/20 0.41
CTSL P07711 1/20 0.32
CTSB P07858 1/20 0.32
CTSK P43235 1/20 0.32
LMNA P02545 1/20 0.32
CYP1A2 P05177 1/20 0.32
CDK1 P06493 1/20 0.31
CCNB1 P14635 1/20 0.31
CCNA2 P20248 1/20 0.31
CDK2 P24941 1/20 0.31
FFAR1 O14842 1/20 0.31
HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2739854 0.98 SLC1A3 (0.39) SLC1A3SLC1A2SLC1A1
SCHEMBL28728706 0.85 SLC1A3 (0.40) SLC1A3SLC1A2SLC1A1CTSLCTSB
SCHEMBL2739864 0.81 LMNA (0.50) SLC1A3SLC1A2SLC1A1CTSLCTSB
SCHEMBL682729 0.81 SLC1A3 (0.32) SLC1A3SLC1A2SLC1A1
SCHEMBL15384165 0.81 SLC1A3 (0.32) SLC1A3SLC1A2SLC1A1
SCHEMBL11225908 0.79 SLC1A3 (0.44) SLC1A3SLC1A2SLC1A1CTSLCTSB
SCHEMBL10274539 0.79 SLC1A3 (0.44) SLC1A3SLC1A2SLC1A1CTSLCTSB
SCHEMBL2760452 0.79 SLC1A3 (0.39) SLC1A3SLC1A2SLC1A1CTSLCTSB
SCHEMBL682100 0.79 SLC1A3 (0.31) SLC1A3SLC1A2SLC1A1
SCHEMBL683184 0.79 CYP1A2 (0.39) CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2090932-B1 Positive resist composition for use with electron beam, X-ray or EUV and pattern forming method using the same FUJIFILM CORP (JP) 2017-05-31 EP disclosed
US-9090722-B2 Chemical amplification resist composition, and mold preparation method and resist film using the same FUJIFILM CORPORATION (JP) 2015-07-28 US disclosed
US-9090722-B2 Chemical amplification resist composition, and mold preparation method and resist film using the same FUJIFILM CORPORATION (JP) 2015-07-28 US disclosed
US-8426103-B2 Positive resist composition for use with electron beam, X-ray or EUV and pattern forming method using the same FUJIFILM CORPORATION (JP) 2013-04-23 US disclosed
US-8426103-B2 Positive resist composition for use with electron beam, X-ray or EUV and pattern forming method using the same FUJIFILM CORPORATION (JP) 2013-04-23 US disclosed
EP-1367439-B1 Radiation-sensitive composition FUJIFILM CORP (JP) 2012-08-01 EP disclosed
US-8114949-B2 (Meth)acrylate, polymer and resist composition MITSUBISHI RAYON CO., LTD. (JP) 2012-02-14 US disclosed
US-8110333-B2 Resist composition containing novel sulfonium compound, pattern-forming method using the resist composition, and novel sulfonium compound FUJIFILM CORPORATION (JP) 2012-02-07 US disclosed
US-8110333-B2 Resist composition containing novel sulfonium compound, pattern-forming method using the resist composition, and novel sulfonium compound FUJIFILM CORPORATION (JP) 2012-02-07 US disclosed
US-20120006788-A1 CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
US-7361446-B2 Sensitivity, high resolution, good pattern profile, used for super-microlithography FUJIFILM CORPORATION (JP) 2008-04-22 US disclosed
US-20080085468-A1 microlithography; ultrafine processing of semiconductor using electron beam, X-ray or deep UV; high sensitivity, high resolution and good line edge roughness; suppression of vaporized outgas; a polystyrene with an acid-decomposable group; 10-tolyl-9-oxothioxanthenium nonafluorobutanesulfonate FUJIFILM CORPORATION (JP) 2008-04-10 US disclosed
US-20080085468-A1 microlithography; ultrafine processing of semiconductor using electron beam, X-ray or deep UV; high sensitivity, high resolution and good line edge roughness; suppression of vaporized outgas; a polystyrene with an acid-decomposable group; 10-tolyl-9-oxothioxanthenium nonafluorobutanesulfonate FUJIFILM CORPORATION (JP) 2008-04-10 US disclosed
US-20080081282-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
US-20080081282-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
EP-1906248-A1 Resist composition and pattern forming method using the same FUJIFILM Corporation (JP) 2008-04-02 EP disclosed
EP-1906241-A1 Resist composition and pattern forming method using the same FUJIFILM Corporation (JP) 2008-04-02 EP disclosed
US-20080003529-A1 (Meth)Acrylate, Polymer and Resist Composition MITSUBISHI RAYON CO., LTD. (JP) 2008-01-03 US disclosed
US-7179579-B2 Radiation-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed
US-7179579-B2 Radiation-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed