Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 14/20 | 0.61 |
| ▸ | ESR2 | Q92731 | 12/20 | 0.61 |
| ▸ | ABAT | P80404 | 1/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | TYR | P14679 | 1/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.44 |
| ▸ | AR | P10275 | 1/20 | 0.44 |
| ▸ | HPGD | P15428 | 1/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.44 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.44 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.44 |
| ▸ | HTR6 | P50406 | 1/20 | 0.44 |
| ▸ | ESRRG | P62508 | 1/20 | 0.44 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.44 |
| ▸ | BLM | P54132 | 1/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL68967 | 0.89 | KIF11 (0.51) | ESR1ESR2LMNACYP3A4SLC6A2 | |
| SCHEMBL9415525 | 0.88 | ESR1 (0.52) | ESR1ESR2SLC6A2BLMMEN1 | |
| SCHEMBL13410361 | 0.84 | ESR1 (0.45) | ESR1ESR2BLMMEN1KMT2A | |
| SCHEMBL2861814 | 0.80 | ESR1 (0.47) | ESR1ESR2 | |
| SCHEMBL9240840 | 0.80 | ESR1 (0.57) | ESR1ESR2LMNATYRCYP3A4 | |
| SCHEMBL2014096 | 0.80 | ESR1 (0.62) | ESR1ESR2CYP3A4BLM | |
| SCHEMBL156830 | 0.80 | ESR1 (0.61) | ESR1ESR2ABATLMNATYR | |
| SCHEMBL6037693 | 0.79 | ESR1 (0.67) | ESR1ESR2LMNATYRCYP3A4 | |
| SCHEMBL311875 | 0.78 | ESR1 (0.64) | ESR1ESR2CYP3A4 | |
| SCHEMBL10770441 | 0.76 | ESR1 (0.57) | ESR1ESR2ABATLMNATYR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5650262-A | High-resolution negative photoresist with wide process latitude | OLIN MICROELECTRONIC CHEMICALS, INC. | 1997-07-22 | — | — | US | claimed |
| EP-0599779-A1 | High-resolution negative photoresist having extended processing latitude | OCG Microelectronic Materials AG (CH) | 1994-06-01 | — | — | EP | claimed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| WO-2024185652-A1 | RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-09-12 | — | — | WO | disclosed |
| WO-2024150700-A1 | RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2024-07-18 | — | — | WO | disclosed |
| US-5620828-A | Positive photoresist composition containing quinonediazide esterification product, novolak resin and pocyhydroxy alkali dissolution accelerator | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-15 | — | — | US | disclosed |
| EP-0766139-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-02 | — | — | EP | disclosed |
| EP-0745575-A1 | Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound | FUJI PHOTO FILM CO., LTD. (JP) | 1996-12-04 | — | — | EP | disclosed |
| US-5340688-A | Containing mixture of 1,2-naphthoquinonediazidosulfonate esters of polyhydroxy compounds and alkali soluble resin | FUJI PHOTO FILM CO., LTD. (JP) | 1994-08-23 | — | — | US | disclosed |
| US-5340683-A | Lithographic printing plate comprising a photosensitive 2-naphthoquinonediazide-5-sulfonic acid ester of polyhydroxyphenyl/p-/alkyl; erasing | FUJI PHOTO FILM CO., LTD. (JP) | 1994-08-23 | — | — | US | disclosed |
| US-5318875-A | Resolution; heat resistance; photosensitivity; developability; integrated circuits; semiconductors | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-07 | — | — | US | disclosed |
| EP-0599779-A1 | High-resolution negative photoresist having extended processing latitude | OCG Microelectronic Materials AG (CH) | 1994-06-01 | — | — | EP | disclosed |
| EP-0555861-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1993-08-18 | — | — | EP | disclosed |
| US-4394496-A | POLYEPOXEDES WITH GOOD HIGH TEMPERATURE PROPERTIES | THE DOW CHEMICAL COMPANY (US) | 1983-07-19 | — | — | US | disclosed |