SCHEMBL68446

SCHEMBL68446

C=CC(=O)OCC1c2ccccc2-c2ccccc21

nearest known ligand 0.51

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.51
FABP5 Q01469 3/20 0.50
FABP7 O15540 2/20 0.50
EPHX2 P34913 1/20 0.48
CA1 P00915 1/20 0.46
CA2 P00918 1/20 0.46
THRB P10828 1/20 0.45
CASP3 P42574 2/20 0.43
HTR2A P28223 1/20 0.40
POLB P06746 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26518052 0.86 KMT2A (0.54) KMT2AFABP5FABP7EPHX2CASP3
SCHEMBL4839883 0.85 EPHX2 (0.43) KMT2AFABP5FABP7EPHX2CA1
SCHEMBL28090508 0.85 KMT2A (0.52) KMT2AFABP5FABP7EPHX2CA1
SCHEMBL67486 0.84 HTR2A (0.43) KMT2AFABP5FABP7EPHX2THRB
SCHEMBL10018066 0.84 KMT2A (0.58) KMT2AFABP5FABP7EPHX2THRB
SCHEMBL27794412 0.83 KMT2A (0.55) KMT2AFABP5FABP7EPHX2CA1
SCHEMBL30792907 0.83 KMT2A (0.48) KMT2AFABP5FABP7EPHX2CA1
SCHEMBL27895930 0.82 KMT2A (0.50) KMT2AFABP5FABP7EPHX2CA1
SCHEMBL7139454 0.81 KMT2A (0.55) KMT2AFABP5FABP7EPHX2CA1
SCHEMBL24616691 0.81 HCAR2 (0.53) KMT2AFABP5FABP7EPHX2CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023162519-A1 PATTERN FORMING METHOD AND METHOD FOR PRODUCING ARTICLE キヤノン株式会社 2023-08-31 WO disclosed
WO-2022259748-A1 CURABLE COMPOSITION, FILM FORMATION METHOD, AND ARTICLE MANUFACTURING METHOD キヤノン株式会社 2022-12-15 WO disclosed
EP-1964893-B2 Ink composition, inkjet recording method, printed material, and ink set FUJIFILM CORP (JP) 2021-11-24 EP disclosed
WO-2020195889-A1 PYRROLE IMIDAZOLE POLY(AMIDE) PRODUCTION METHOD 株式会社カネカ 2020-10-01 WO disclosed
EP-2389190-B1 FGF21 DERIVATIVES WITH ALBUMIN BINDER A-B-C-D-E- AND THEIR USE NOVO NORDISK AS (DK) 2018-09-19 EP disclosed
EP-2105478-B1 Inkjet recording method and inkjet recording system FUJIFILM CORP (JP) 2018-02-28 EP disclosed
EP-1964893-B1 Ink composition, inkjet recording method, printed material, and ink set FUJIFILM CORP (JP) 2018-01-24 EP disclosed
EP-2568020-B1 Ink set for forming multiple layers, ink jet recording method, and printed material FUJIFILM CORP (JP) 2017-02-01 EP disclosed
EP-2412765-B1 Inkjet recording method, and printed material FUJIFILM CORP (JP) 2017-01-18 EP disclosed
US-8932687-B2 Process for producing molded printed material, and molded printed material FUJIFILM CORPORATION (JP) 2015-01-13 US disclosed
EP-1964893-A1 Ink composition, inkjet recording method, printed material, and ink set FUJIFILM Corporation (JP) 2008-09-03 EP disclosed
US-20080206527-A1 INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND INK SET FUJIFILM CORPORATION (JP) 2008-08-28 US disclosed
US-20080206527-A1 INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND INK SET FUJIFILM CORPORATION (JP) 2008-08-28 US disclosed
US-20080075882-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080075882-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080075884-A1 radiation curing ink cures with high sensitivity to form a high quality, durable image resistant to cracking, peeling and has excellent impact resistance, flexibility, and adhesion; a polymerizable monomer and a polymerization initiator and comprising substantially no colorant FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080075884-A1 radiation curing ink cures with high sensitivity to form a high quality, durable image resistant to cracking, peeling and has excellent impact resistance, flexibility, and adhesion; a polymerizable monomer and a polymerization initiator and comprising substantially no colorant FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
JP-2000319544-A COATING COMPOSITION FOR ABRASION RESISTANT PLASTIC NIPPON KAYAKU CO LTD 2000-11-21 JP disclosed
JP-2000319545-A RESIN COMPOSITION FOR OPTICAL DISC AND ITS CURED MATERIAL NIPPON KAYAKU CO LTD 2000-11-21 JP disclosed
JP-2000319336-A (METH)ACRYLIC ACID ESTER, RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON KAYAKU CO LTD 2000-11-21 JP disclosed