Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PIK3CA | P42336 | 5/20 | 0.82 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.58 |
| ▸ | ESR1 | P03372 | 1/20 | 0.58 |
| ▸ | SHBG | P04278 | 1/20 | 0.58 |
| ▸ | SELL | P14151 | 1/20 | 0.56 |
| ▸ | SELP | P16109 | 1/20 | 0.56 |
| ▸ | MAPT | P10636 | 4/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.54 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.54 |
| ▸ | POLB | P06746 | 2/20 | 0.54 |
| ▸ | MPI | P34949 | 2/20 | 0.54 |
| ▸ | RECQL | P46063 | 2/20 | 0.54 |
| ▸ | TLR2 | O60603 | 1/20 | 0.54 |
| ▸ | NSD2 | O96028 | 1/20 | 0.54 |
| ▸ | PKM | P14618 | 1/20 | 0.54 |
| ▸ | GRK6 | P43250 | 1/20 | 0.54 |
| ▸ | TLR1 | Q15399 | 1/20 | 0.54 |
| ▸ | TLR6 | Q9Y2C9 | 1/20 | 0.54 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.54 |
| ▸ | LMNA | P02545 | 4/20 | 0.53 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27700015 | 0.94 | PIK3CA (0.74) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL10558859 | 0.91 | PIK3CA (0.70) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL8703963 | 0.91 | PIK3CA (0.70) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL32667709 | 0.91 | PIK3CA (0.70) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL29457583 | 0.90 | PIK3CA (0.69) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL3459589 | 0.90 | PIK3CA (0.69) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL8041510 | 0.89 | PIK3CA (0.68) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL27666164 | 0.88 | PIK3CA (0.67) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL10561810 | 0.88 | PIK3CA (0.66) | PIK3CAESR2ESR1SHBGSELL | |
| SCHEMBL10560532 | 0.83 | PIK3CA (0.60) | PIK3CAESR2ESR1SHBGMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024150700-A1 | RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024143211-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143210-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024101295-A1 | PRODUCTION METHOD FOR CURED PRODUCT, PRODUCTION METHOD FOR LAMINATE, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-16 | — | — | WO | disclosed |
| WO-2024101266-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-16 | — | — | WO | disclosed |
| WO-2024095885-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED OBJECT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED OBJECT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-10 | — | — | WO | disclosed |
| WO-2024095884-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-10 | — | — | WO | disclosed |
| WO-2024090460-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, PRODUCTION METHOD FOR CURED PRODUCT, PRODUCTION METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-02 | — | — | WO | disclosed |
| US-5523396-A | ESTERIFICATION OF POLYHYDROXY COMPOUND WITH 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONYL CHLORIDE IN THE PRESENCE OF A BASIC CATALYST | FUJI PHOTO FILM CO., LTD. (JP) | 1996-06-04 | — | — | US | disclosed |
| EP-0710886-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1996-05-08 | — | — | EP | disclosed |
| EP-0706089-A2 | Process for synthesizing quinonediazide ester and positive working photoresist containing the same | FUJI PHOTO FILM CO., LTD. (JP) | 1996-04-10 | — | — | EP | disclosed |
| US-5494773-A | MIXTURE WITH A 1,2-QUINONEDIAZIDE COMPOUND | FUJI PHOTO FILM CO., LTD. (JP) | 1996-02-27 | — | — | US | disclosed |
| EP-0684521-A1 | Positive working photosensitive compositions | FUJI PHOTO FILM CO., LTD. (JP) | 1995-11-29 | — | — | EP | disclosed |
| EP-0677789-A1 | Positive photoresist composition | Fuji Photo Film Co., Ltd. (JP) | 1995-10-18 | — | — | EP | disclosed |
| EP-0672952-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-09-20 | — | — | EP | disclosed |
| EP-0658807-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-06-21 | — | — | EP | disclosed |
| EP-0644460-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-03-22 | — | — | EP | disclosed |
| EP-0445819-A2 | Positive type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-09-11 | — | — | EP | disclosed |