SCHEMBL6847401

SCHEMBL6847401

O=C(c1cc(C(=O)c2ccc(O)c(O)c2O)cc(C(=O)c2ccc(O)c(O)c2O)c1)c1ccc(O)c(O)c1O

nearest known ligand 0.84

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.84
SELL P14151 1/20 0.58
SELP P16109 1/20 0.58
KDM4E B2RXH2 4/20 0.54
MAPT P10636 4/20 0.54
HSD17B10 Q99714 4/20 0.54
ALDH1A1 P00352 3/20 0.54
HPGD P15428 3/20 0.54
ALOX15 P16050 3/20 0.54
RECQL P46063 3/20 0.54
MEN1 O00255 2/20 0.53
KMT2A Q03164 2/20 0.53
ALOX12 P18054 1/20 0.53
TERT O14746 1/20 0.44
PIK3CA P42336 4/20 0.43
HSD17B14 Q9BPX1 1/20 0.42
USP2 O75604 1/20 0.42
GAA P10253 1/20 0.42
KEAP1 Q14145 1/20 0.42
NFE2L2 Q16236 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30669853 1.00 HDAC1 (0.84) HDAC1SELLSELPKDM4EMAPT
Exifone SCHEMBL29375026 0.91 HDAC1 (1.00) HDAC1SELLSELPKDM4EMAPT
Exifone SCHEMBL273096 0.91 HDAC1 (1.00) HDAC1SELLSELPKDM4EMAPT
SCHEMBL7156512 0.90 HDAC1 (0.75) HDAC1SELLSELPKDM4EMAPT
Exifone SCHEMBL27795679 0.90 HDAC1 (0.96) HDAC1SELLSELPKDM4EMAPT
SCHEMBL6842062 0.90 HDAC1 (0.69) HDAC1SELLSELPKDM4EMAPT
SCHEMBL30669855 0.90 HDAC1 (0.69) HDAC1SELLSELPKDM4EMAPT
SCHEMBL3656665 0.88 HDAC1 (0.73) HDAC1SELLSELPKDM4EMAPT
SCHEMBL8655190 0.86 HDAC1 (0.70) HDAC1SELLSELPKDM4EMAPT
SCHEMBL19763340 0.86 HDAC1 (0.76) HDAC1SELLSELPKDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250376552-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-12-11 US disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250236697-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-24 US disclosed
US-20250230283-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-17 US disclosed
WO-2024185652-A1 RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2024-09-12 WO disclosed
WO-2024150700-A1 RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2024-07-18 WO disclosed
WO-2024143209-A1 METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
WO-2024143212-A1 METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION 富士フイルム株式会社 2024-07-04 WO disclosed
US-5529881-A ALKALI-SOLUBLE RESIN AND 1,2-NAPHTHOQUINONEDIAZIDE SULFONIC ACID ESTER OF SPECIFIED POLYHYDROXY COMPOUND AS PHOTOSENSITIVE COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1996-06-25 US disclosed
US-5523396-A ESTERIFICATION OF POLYHYDROXY COMPOUND WITH 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONYL CHLORIDE IN THE PRESENCE OF A BASIC CATALYST FUJI PHOTO FILM CO., LTD. (JP) 1996-06-04 US disclosed
EP-0706089-A2 Process for synthesizing quinonediazide ester and positive working photoresist containing the same FUJI PHOTO FILM CO., LTD. (JP) 1996-04-10 EP disclosed
US-5494773-A MIXTURE WITH A 1,2-QUINONEDIAZIDE COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1996-02-27 US disclosed
EP-0684521-A1 Positive working photosensitive compositions FUJI PHOTO FILM CO., LTD. (JP) 1995-11-29 EP disclosed
EP-0677789-A1 Positive photoresist composition Fuji Photo Film Co., Ltd. (JP) 1995-10-18 EP disclosed
EP-0672952-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-09-20 EP disclosed
EP-0658807-A1 Positive-working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-06-21 EP disclosed
EP-0644460-A1 Positive working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-03-22 EP disclosed
EP-0445819-A2 Positive type photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1991-09-11 EP disclosed