Butyric Acid

Butyric Acid

SCHEMBL6847594

CCCC(=O)O.[GaH3]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Butyric Acid SCHEMBL320515 0.96 FFAR3 (1.00)
Butyric Acid SCHEMBL4441285 0.96 FFAR3 (1.00)
Butyric Acid SCHEMBL991717 0.96 FFAR3 (1.00)
Butyric Acid SCHEMBL1332215 0.96
Butyric Acid SCHEMBL339305 0.96 FFAR3 (1.00)
Butyric Acid SCHEMBL5703921 0.96 FFAR3 (1.00)
Butyric Acid SCHEMBL8458708 0.96 FFAR3 (1.00)
Butyric Acid SCHEMBL8457839 0.96 FFAR3 (1.00)
Butyric Acid SCHEMBL20678495 0.96
Butyric Acid SCHEMBL4446516 0.96 FFAR3 (1.00)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230257651-A1 METHOD OF PREPARING QUANTUM DOT, QUANTUM DOT PREPARED THEREBY, AND ELECTRONIC APPARATUS INCLUDING THE QUANTUM DOT SAMSUNG DISPLAY CO., LTD. (KR) 2023-08-17 US disclosed
CN-116590017-A Quantum dot preparation method, quantum dot and electronic device comprising quantum dot 三星显示有限公司 2023-08-15 CN disclosed
WO-2014099171-A1 PREPARATION OF TRIALKYLINDIUM COMPOUNDS AND TRIALKYLGALLIUM COMPOUNDS ALBEMARLE CORPORATION (US) 2014-06-26 WO disclosed
US-6830704-B2 Contains a Lewis acid metal salt and a compound having clathrating ability. TOAGOSEI CO., LTD. (JP) 2004-12-14 US disclosed
US-6770131-B2 PREFERABLY THIN FILMS OF GALLIUM NITRIDE; DIRECT DEPOSITION OF AN AMORPHOUS LAYER OF A III-V COMPOUND PRECURSOR ON A SINGLE CRYSTAL SUBSTRATE; REACTION, CRYSTALLIZATION AND FORMATION OF FILMS BY PYROLYSIS. THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 2004-08-03 US disclosed
US-20030135016-A1 Contains a Lewis acid metal salt and a compound having clathrating ability. TOAGOSEI CO., LTD. 2003-07-17 US disclosed
US-6547985-B1 Adhesive mixture TOGOSEI CO., LTD. (JP) 2003-04-15 US disclosed
US-20030012874-A1 III-V compound films using chemical deposition REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE 2003-01-16 US disclosed
WO-2002040752-A2 PROCESS FOR PRODUCING III-V COMPOUND FILMS BY CHEMICAL DEPOSITION THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2002-05-23 WO disclosed
US-4415440-A PASSIVATION OF ZEOLITES POLLUTED BY METALS, E.G. NICKEL, VANADIUM, IRON PHILLIPS PETROLEUM COMPANY (US) 1983-11-15 US disclosed
US-4377504-A Cracking catalyst improvement with gallium compounds PHILLIPS PETROLEUM COMPANY (US) 1983-03-22 US disclosed