SCHEMBL6853633

SCHEMBL6853633

O=Cc1ccc(Oc2cccc(C=O)c2)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SRC P12931 1/20 0.53
ALDH1A1 P00352 5/20 0.52
LMNA P02545 2/20 0.52
SMN1; SMN2 Q16637 2/20 0.52
KDM4E B2RXH2 1/20 0.52
MAOA P21397 6/20 0.50
MAOB P27338 6/20 0.50
PARP10 Q53GL7 1/20 0.50
PARP3 Q9Y6F1 1/20 0.50
NPC1 O15118 1/20 0.49
RAB9A P51151 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
TTR P02766 1/20 0.49
MEN1 O00255 2/20 0.48
MAPT P10636 2/20 0.48
KMT2A Q03164 2/20 0.48
TLR4 O00206 1/20 0.47
TLR2 O60603 1/20 0.47
CYP2A6 P11509 1/20 0.47
AKR1B1 P15121 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31599170 1.00 SRC (0.53) SRCALDH1A1LMNASMN1; SMN2KDM4E
SCHEMBL6856729 0.96 SRC (0.56) SRCALDH1A1LMNASMN1; SMN2KDM4E
SCHEMBL5806680 0.94 MAOB (0.57) SRCALDH1A1LMNASMN1; SMN2KDM4E
SCHEMBL11222905 0.92 MAOB (0.59) SRCALDH1A1LMNAMAOAMAOB
SCHEMBL8546955 0.92 ALDH1A1 (0.55) SRCALDH1A1LMNASMN1; SMN2KDM4E
SCHEMBL6849018 0.92 SRC (0.60) SRCALDH1A1LMNASMN1; SMN2MAOA
SCHEMBL30631693 0.92 SRC (0.60) SRCALDH1A1LMNASMN1; SMN2MAOA
SCHEMBL11482497 0.90 MAOB (0.61) SRCALDH1A1LMNAMAOAMAOB
SCHEMBL29484309 0.90 MAOB (0.61) SRCALDH1A1LMNAMAOAMAOB
SCHEMBL98478 0.90 MAOB (0.61) SRCALDH1A1LMNAMAOAMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025110215-A1 CURABLE COMPOSITION, COMPOUND, HEAT-RESISTANT RESIN MATERIAL, ADHESIVE, SEALING MATERIAL, POTTING AGENT, ENCAPSULANT, CARBON MATERIAL, AND PREPREG セメダイン株式会社 2025-05-30 WO disclosed
US-9585850-B2 Methods of treatment using arylcyclopropylamine compounds DUKE UNIVERSITY (US) 2017-03-07 US disclosed
US-6780561-B2 FOR FORMING PROTECTIVE FILM OR AN INSULATING FILM FOR A SEMICONDUCTOR ELEMENT OR A CIRCUIT BOARD SUCH AS A PRINTED BOARD KANSAI PAINT CO., LTD. (JP) 2004-08-24 US disclosed
US-20030143480-A1 For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board KANSAI PAINT CO., LTD. (JP) 2003-07-31 US disclosed