⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9538288 | 0.81 | — | — | |
| SCHEMBL2141279 | 0.81 | — | — | |
| SCHEMBL16190059 | 0.81 | — | — | |
| SCHEMBL13108291 | 0.79 | — | — | |
| SCHEMBL2703784 | 0.79 | — | — | |
| SCHEMBL16523557 | 0.75 | LMNA (0.39) | — | |
| SCHEMBL6854259 | 0.75 | — | — | |
| SCHEMBL2760000 | 0.75 | — | — | |
| SCHEMBL9311855 | 0.74 | — | — | |
| SCHEMBL6854748 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-20210309866-A1 | LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LIGHT-EMITTING DISPLAY ELEMENT PANEL, AND LIGHT-EMITTING DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-10-07 | — | — | US | disclosed |
| EP-3812805-A1 | LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LUMINESCENT DISPLAY ELEMENT PANEL, AND LUMINESCENT DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-04-28 | — | — | EP | disclosed |
| US-10696845-B2 | Energy-sensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-06-30 | — | — | US | disclosed |
| US-10570269-B2 | Composition containing microparticles | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-02-25 | — | — | US | disclosed |
| EP-3275940-B1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2019-12-18 | — | — | EP | disclosed |
| US-20190225804-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-07-25 | — | — | US | disclosed |
| US-10023540-B2 | Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-17 | — | — | US | disclosed |
| US-20180194930-A1 | COMPOSITION CONTAINING MICROPARTICLES | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-12 | — | — | US | disclosed |
| US-9981914-B2 | — | — | 2018-05-29 | — | — | US | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| US-20150337084-A1 | METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-11-26 | — | — | US | disclosed |
| EP-2947112-A1 | METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-11-25 | — | — | EP | disclosed |
| EP-2461214-B1 | Resist underlayer film composition and patterning process using the same | SHINETSU CHEMICAL CO (JP) | 2013-08-28 | — | — | EP | disclosed |
| US-20120142193-A1 | RESIST UNDERLAYER FILM COMPOSITION AND PATTERNING PROCESS USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| US-20120142193-A1 | RESIST UNDERLAYER FILM COMPOSITION AND PATTERNING PROCESS USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| WO-2010096565-A1 | INTERFACIAL POLYMERIZATION METHODS FOR MAKING FLUOROALCOHOL-CONTAINING POLYAMIDES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-08-26 | — | — | WO | disclosed |
| WO-2010096563-A1 | POLYAMIDE MEMBRANES WITH FLUOROALCOHOL FUNCTIONALITY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-08-26 | — | — | WO | disclosed |
| US-6780561-B2 | FOR FORMING PROTECTIVE FILM OR AN INSULATING FILM FOR A SEMICONDUCTOR ELEMENT OR A CIRCUIT BOARD SUCH AS A PRINTED BOARD | KANSAI PAINT CO., LTD. (JP) | 2004-08-24 | — | — | US | disclosed |
| US-20030143480-A1 | For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board | KANSAI PAINT CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |