⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8383564 | 0.87 | — | — | |
| SCHEMBL6857386 | 0.81 | — | — | |
| SCHEMBL8380356 | 0.78 | — | — | |
| SCHEMBL797694 | 0.74 | — | — | |
| Hydrochloric Acid SCHEMBL28559817 | 0.74 | — | — | |
| SCHEMBL1135114 | 0.71 | — | — | |
| SCHEMBL6850794 | 0.71 | — | — | |
| SCHEMBL27469577 | 0.71 | TSHR (0.31) | — | |
| SCHEMBL6857174 | 0.70 | — | — | |
| SCHEMBL16667047 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3893054-B1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12393116-B2 | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2025-08-19 | — | — | US | disclosed |
| EP-3893053-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM CORP (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-12078929-B2 | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2024-09-03 | — | — | US | disclosed |
| CN-113168093-B | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-113383273-B | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | 富士胶片株式会社 | 2023-11-14 | — | — | CN | disclosed |
| CN-114402256-A | Organic film, method for producing same, composition, laminate, and semiconductor device | 富士胶片株式会社 | 2022-04-26 | — | — | CN | disclosed |
| EP-3893053-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| EP-3893054-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| EP-3492982-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2020-11-11 | — | — | EP | disclosed |
| EP-3492982-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2019-06-05 | — | — | EP | disclosed |
| CN-105324388-A | Bimetallic complex comprising cyclopentadienyl and amidine ligands | LANXESS ELASTOMERS BV | 2016-02-10 | — | — | CN | disclosed |
| US-6787617-B1 | FORMING NARROW MOLECULAR WEIGHT HOMOPOLYMERS AS INTERMEDIATES TO BLOCK OR TERMINAL FUNCTIONALIZED POLYMERS; HAFNIUM OR ZIRCONIUM CYCLOPENTADIENYL FUNCTIONALIZED CATALYSTS WITH TRIPHENYLBORON AND TRIALKYLALUMINUM COMPOUNDS | JAPAN AS REPRESENTED BY DIRECTOR GENERAL OF THE AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2004-09-07 | — | — | US | disclosed |
| EP-1209171-A1 | PROCESS FOR PRODUCING OLEFIN LIVING POLYMER | JAPAN as Represented by DIRECTOR GENERAL OF AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2002-05-29 | — | — | EP | disclosed |
| US-5916982-A | Process for the production of polyolefins | NIPPON OIL CO., LTD. (JP) | 1999-06-29 | — | — | US | disclosed |
| EP-0768319-A1 | Process for the production of polyolefins | NIPPON OIL CO. LTD. (JP) | 1997-04-16 | — | — | EP | disclosed |
| US-5556821-A | Catalyst component for the polymerization of olefins | NIPPON OIL COMPANY, LIMITED (JP) | 1996-09-17 | — | — | US | disclosed |
| CN-1028369-C | Polymerization process using cationic polymerization catalyst | DOW CHEMICAL CO (US) | 1995-05-10 | — | — | CN | disclosed |
| CN-1050194-A | The preparation technology of metal complex compounds and using method | DOW CHEMICAL CO (US) | 1991-03-27 | — | — | CN | disclosed |