⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL39837 | 0.96 | — | — | |
| Hydrogen Sulfide SCHEMBL27509488 | 0.93 | — | — | |
| SCHEMBL8415570 | 0.93 | — | — | |
| Phosphine SCHEMBL27930495 | 0.93 | — | — | |
| Water SCHEMBL27488584 | 0.93 | — | — | |
| Ammonia Solution, Strong SCHEMBL6653979 | 0.93 | — | — | |
| SCHEMBL31382807 | 0.93 | — | — | |
| Ammonia Solution, Strong SCHEMBL27771318 | 0.93 | — | — | |
| Ammonia Solution, Strong SCHEMBL6653517 | 0.90 | — | — | |
| Ammonia Solution, Strong SCHEMBL6652532 | 0.90 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-220439613-U | Semiconductor device with a semiconductor device having a plurality of semiconductor chips | 台湾积体电路制造股份有限公司 | 2024-02-02 | — | — | CN | disclosed |
| CN-115041628-A | Method for preparing regenerated precoated sand by using waste precoated sand | 柳州柳晶环保科技有限公司 | 2022-09-13 | — | — | CN | disclosed |
| CN-107919319-B | Method for manufacturing interconnect structure | 台湾积体电路制造股份有限公司 | 2022-01-11 | — | — | CN | disclosed |
| CN-107919319-A | Method for manufacturing interconnect structure | 台湾积体电路制造股份有限公司 | 2018-04-17 | — | — | CN | disclosed |
| CN-107532061-A | Pressure-sensitive adhesive | 思美定株式会社 | 2018-01-02 | — | — | CN | disclosed |
| CN-103946279-A | Silicone resins and their use in polymers | DOW CORNING | 2014-07-23 | — | — | CN | disclosed |
| US-20040247897-A1 | Sol solution for producing glass coatings for electrically conductive materials that can be used in anodic bonding | FRAUNHOFER-GESELLSDCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNGM E.V. (DE) | 2004-12-09 | — | — | US | disclosed |
| EP-0009947-B1 | THERMOPLASTIC RESIN COMPOSITIONS AND METHOD OF BONDING RESINS TO SUBSTRATES | UNION CARBIDE CORPORATION (US) | 1984-06-27 | — | — | EP | disclosed |