⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28582442 | 0.82 | — | — | |
| SCHEMBL17184575 | 0.82 | — | — | |
| Hydrogen Sulfide SCHEMBL2814767 | 0.82 | — | — | |
| SCHEMBL8931440 | 0.82 | — | — | |
| SCHEMBL20568018 | 0.82 | — | — | |
| SCHEMBL1616074 | 0.82 | — | — | |
| SCHEMBL2635704 | 0.82 | — | — | |
| SCHEMBL8931443 | 0.82 | — | — | |
| SCHEMBL20531427 | 0.82 | — | — | |
| SCHEMBL12003505 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 795 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025244626-A1 | COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING | DIAMOND FOUNDRY INCORPORATED (US) | 2025-11-27 | — | — | WO | claimed |
| US-20250357263-A1 | COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING | DIAMOND FOUNDRY INC (US) | 2025-11-20 | — | — | US | claimed |
| US-20250266314-A1 | MANUFACTURING METHOD OF ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. (TW) | 2025-08-21 | — | — | US | claimed |
| US-12350662-B2 | Attachment method for microfluidic device | 1248 CAPITAL MANAGEMENT, LLC (KN) | 2025-07-08 | — | — | US | claimed |
| US-20250201692-A1 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-06-19 | — | — | US | claimed |
| CN-119542923-B | Semiconductor laser bar stacked array and packaging method thereof | 苏州长光华芯光电技术股份有限公司 | 2025-04-18 | — | — | CN | claimed |
| CN-119811779-A | Second-generation high-temperature superconducting tape composite structure and preparation method thereof | 上海交通大学 | 2025-04-11 | — | — | CN | claimed |
| CN-119725246-A | Packaging structure | 星科金朋半导体（江阴）有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-119553084-A | Method for recycling silver and indium in heterojunction photovoltaic module | 四川长虹格润环保科技股份有限公司 | 2025-03-04 | — | — | CN | claimed |
| CN-119542923-A | Semiconductor laser bar stacked array and packaging method thereof | 苏州长光华芯光电技术股份有限公司 | 2025-02-28 | — | — | CN | claimed |
| CN-1523242-A | Bearing bush with a high-performance antifriction layer | 刘会学 | 2004-08-25 | — | — | CN | claimed |
| CN-1477913-A | Double-panel organic electroluminescent display device and its mfg. method | LG.������LCD��ʽ���� | 2004-02-25 | — | — | CN | claimed |
| US-20040014251-A1 | Dual panel-type organic electroluminescent display device and method of fabricating the same | LG.PHILIPS LCD CO., LTD. | 2004-01-22 | — | — | US | claimed |
| US-20030157790-A1 | Method of forming bump | ADVANCED SEMICONDUCTOR ENGINEERING, INC. (TW) | 2003-08-21 | — | — | US | claimed |
| US-6567604-B1 | Indium plated package for an optical component and process therefore | OMM, INC. | 2003-05-20 | — | — | US | claimed |
| EP-1109763-B1 | AUTOTHERMAL PROCESS FOR THE PRODUCTION OF OLEFINS | DOW GLOBAL TECHNOLOGIES INC (US) | 2003-04-16 | — | — | EP | claimed |
| CN-1378293-A | High efficiency photovoltaic element and method of forming the same | GUANGLEI SCIENCE AND TECHNOLOG (CN) | 2002-11-06 | — | — | CN | claimed |
| US-6018389-A | Cone penetrometer fiber optic raman spectroscopy probe assembly | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) | 2000-01-25 | — | — | US | claimed |
| US-5520560-A | INTERMETALLIC MERCURY DISPENSER INCLUDING MERCURY AND TITANIUM AND/OR ZIRCONIUM, PROMOTER ALLOY INCLUDING COPPER AND TIN, INDIUM AND/OR SILVER | SAES GETTERS S.P.A. (IT) | 1996-05-28 | — | — | US | claimed |
| US-4797780-A | IMPREGNATION WITH METAL OR ALLOY; FORMING CONTACTS ENRICHED WITH INDIUM, GALLIUM AND THALLIUM | SIEMENS AKTIENGESELLSCHAFT (DE) | 1989-01-10 | — | — | US | claimed |