Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22462276 | 0.71 | TSHR (0.33) | TSHRTDP1 | |
| SCHEMBL891682 | 0.69 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL11667188 | 0.69 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL94870 | 0.69 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL23274 | 0.69 | TSHR (0.35) | TSHRTDP1 | |
| Cyclohexane SCHEMBL9280284 | 0.69 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL1415626 | 0.69 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL208989 | 0.67 | TSHR (0.39) | TSHRTDP1 | |
| SCHEMBL28045865 | 0.67 | — | — | |
| SCHEMBL11116838 | 0.67 | TSHR (0.33) | TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112480624-B | Alkyd resin composition and preparation method and application thereof | 广东广山新材料股份有限公司（CN） | 2023-01-13 | — | — | CN | claimed |
| CN-115124919-A | High-performance environment-friendly three-proofing paint and preparation method thereof | 上海回天新材料有限公司 | 2022-09-30 | — | — | CN | claimed |
| CN-112480624-A | Alkyd resin composition and preparation method and application thereof | 广东广山新材料股份有限公司 | 2021-03-12 | — | — | CN | claimed |
| WO-2023085512-A1 | ANTIBACTERIAL ANTI-STATIC COMPOSITION, AND RUST-PROOF FILM COMPRISING SAME | 대진첨단소재 주식회사 | 2023-05-19 | — | — | WO | disclosed |
| CN-113454153-B | In-line ultrasonic inspection for detecting partial vulcanization of rubber mixtures in-situ silylation of light-colored fillers | 朗盛德国有限责任公司 | 2023-04-28 | — | — | CN | disclosed |
| CN-112480624-B | Alkyd resin composition and preparation method and application thereof | 广东广山新材料股份有限公司（CN） | 2023-01-13 | — | — | CN | disclosed |
| CN-115124919-A | High-performance environment-friendly three-proofing paint and preparation method thereof | 上海回天新材料有限公司 | 2022-09-30 | — | — | CN | disclosed |
| EP-3408329-B1 | METHOD FOR TESTING THE IN SITU SILANIZATION OF LIGHT FILLERS | LANXESS DEUTSCHLAND GMBH (DE) | 2022-09-21 | — | — | EP | disclosed |
| CN-110582538-B | Rubber composition for torsional vibration damper and torsional vibration damper | NOK株式会社 | 2022-05-06 | — | — | CN | disclosed |
| CN-108603000-B | Method for testing in situ silanization of bright fillers | 朗盛德国有限责任公司 | 2021-10-01 | — | — | CN | disclosed |
| CN-113454153-A | On-line ultrasonic inspection for detecting partial vulcanization of rubber mixtures in-situ silanization of light-colored fillers | 朗盛德国有限责任公司 | 2021-09-28 | — | — | CN | disclosed |
| CN-107466307-B | Polymer blend for tires | 盛禧奥欧洲有限责任公司 | 2020-07-14 | — | — | CN | disclosed |
| CN-107454907-B | Functionalized polymer blends for tires | 盛禧奥欧洲有限责任公司 | 2020-07-07 | — | — | CN | disclosed |
| CN-110582538-A | Rubber composition for torsional vibration damper and torsional vibration damper | NOK株式会社 | 2019-12-17 | — | — | CN | disclosed |
| CN-108603000-A | METHOD FOR TESTING IN SITU SILANIZATION OF BRIGHT FILLERS | 朗盛德国有限责任公司 | 2018-09-28 | — | — | CN | disclosed |
| CN-104203986-B | Modified polymer composition | 盛禧奥欧洲有限责任公司 | 2016-08-24 | — | — | CN | disclosed |
| EP-1783159-B1 | RESIN FILM | BRIDGESTONE CORP (JP) | 2012-02-29 | — | — | EP | disclosed |
| US-20070259998-A1 | Resin Film | BRIDGESTONE CORPORATION (JP) | 2007-11-08 | — | — | US | disclosed |
| EP-1783159-A1 | RESIN FILM | BRIDGESTONE CORPORATION (JP) | 2007-05-09 | — | — | EP | disclosed |
| US-6332998-B1 | MOLDINGS AND COVERING WITH HEAT CURING COMPOSITION FOR ELECTRONICS | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2001-12-25 | — | — | US | disclosed |