Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23274 | 1.00 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL1415626 | 1.00 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL891682 | 1.00 | TSHR (0.35) | TSHRTDP1 | |
| Cyclohexane SCHEMBL9280284 | 1.00 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL11667188 | 1.00 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL28142940 | 0.97 | TSHR (0.40) | TSHRTDP1 | |
| Methylamine SCHEMBL27398791 | 0.95 | TSHR (0.32) | TSHRTDP1 | |
| Benzene SCHEMBL25269567 | 0.93 | TSHR (0.30) | TSHRTDP1 | |
| Propane SCHEMBL7172421 | 0.93 | TSHR (0.30) | TSHRTDP1 | |
| SCHEMBL28087561 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1627 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210403701-A1 | CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 2021-12-30 | — | — | US | claimed |
| US-20170102347-A1 | BIOCHEMICAL TEST CHIP | APEX BIOTECHNOLOGY CORP. (TW) | 2017-04-13 | — | — | US | claimed |
| EP-3153857-A1 | BIOCHEMICAL TEST CHIP | Apex Biotechnology Corporation (TW) | 2017-04-12 | — | — | EP | claimed |
| US-8916042-B2 | Upgrading heavy oil and bitumen with an initiator | BAKER HUGHES INCORPORATED (US) | 2014-12-23 | — | — | US | claimed |
| US-20130334100-A1 | UPGRADING HEAVY OIL AND BITUMEN WITH AN INITIATOR | BAKER HUGHES INCORPORATED (US) | 2013-12-19 | — | — | US | claimed |
| US-8211254-B2 | Can cap sealing composition and use thereof | W. R. GRACE & CO.-CONN. (US) | 2012-07-03 | — | — | US | claimed |
| US-20100163156-A1 | Can Cap Sealing Composition And Use Thereof | W.R. GRACE & CO.-CONN. | 2010-07-01 | — | — | US | claimed |
| EP-2171010-A1 | CAN CAP SEALING COMPOSITION AND USE THEREOF | W. R. Grace & Co.-Conn (US) | 2010-04-07 | — | — | EP | claimed |
| WO-2008157217-A1 | CAN CAP SEALING COMPOSITION AND USE THEREOF | W.R. GRACE & CO.-CONN. (US) | 2008-12-24 | — | — | WO | claimed |
| US-20050277061-A1 | Polymeric material for laser processing and a laminated body for laser processing thereof, flexographic printing plate and the method of producing the same, and a seal material | JSR CORPORATION (JP) | 2005-12-15 | — | — | US | claimed |
| US-5569716-A | COMPRISING A HYDROCARBON RUBBER, A VULCANIZING OR CROSSLINKING AGENT AND A HYDROGENATED PETROLEUM RESIN | IDEMITSU PETROCHEMICAL CO., LTD. (JP) | 1996-10-29 | — | — | US | claimed |
| EP-0453204-B1 | Composition for cross-linking of ethylene-polymer, method for cross-linking ethylene-polymer, and cross-linkable composition | NIPPON OILS & FATS CO LTD (JP) | 1996-07-24 | — | — | EP | claimed |
| US-5298564-A | Crosslinker is 2,4-diphenyl-4-methyl-1-pentene | NIPPON OIL & FATS CO., LTD. (JP) | 1994-03-29 | — | — | US | claimed |
| EP-0310304-B1 | Visible light-curing polyester resin composition | NIPPON OILS & FATS CO LTD (JP) | 1993-11-18 | — | — | EP | claimed |
| US-5214103-A | ETHYLENE-PROPYLENE TYPE RUBBER COMPOSITION | TOYODA GOSEI CO., LTD. (JP) | 1993-05-25 | — | — | US | claimed |
| EP-0453204-A1 | Composition for cross-linking of ethylene-polymer, method for cross-linking ethylene-polymer, and cross-linkable composition | NIPPON OIL AND FATS COMPANY, LIMITED (JP) | 1991-10-23 | — | — | EP | claimed |
| US-5017626-A | Photocuring agent, unsaturated polyester | NIPPON OIL & FATS CO., LTD. (JP) | 1991-05-21 | — | — | US | claimed |
| EP-0310304-A2 | Visible light-curing polyester resin composition | NIPPON OIL AND FATS COMPANY, LIMITED (JP) | 1989-04-05 | — | — | EP | claimed |
| US-4093786-A | CYCLODODECANONE AND TERT-BUTYLHYDROPEROXIDE, USED AS CROSSLINKING AGENT | NIHON YUSHI CO., LTD. (JA) | 1978-06-06 | — | — | US | claimed |
| US-12631982-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2026-05-19 | — | — | US | disclosed |
| CN-122070344-A | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and joined body | 日东电工株式会社 | 2026-05-19 | — | — | CN | disclosed |
| WO-2026100231-A1 | CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12624140-B2 | Composition containing compound having polyoxyalkylene chain | RESONAC CORPORATION (JP) | 2026-05-12 | — | — | US | disclosed |
| US-12624141-B2 | Composition set containing compound having polyoxyalkylene chain | RESONAC CORPORATION (JP) | 2026-05-12 | — | — | US | disclosed |
| US-12617940-B2 | Curable composition and cured material | COSMO OIL LUBRICANTS CO., LTD. (JP) | 2026-05-05 | — | — | US | disclosed |
| US-20260118791-A1 | TONER | CANON KK (JP) | 2026-04-30 | — | — | US | disclosed |
| US-20260109860-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-23 | — | — | US | disclosed |
| EP-4729563-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD., (JP) | 2026-04-22 | — | — | EP | disclosed |
| US-12606723-B2 | Thermosetting resin composition, semiconductor device and electrical/electronic component | KYOCERA CORPORATION (JP) | 2026-04-21 | — | — | US | disclosed |
| EP-4169994-B1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND SURFACE PROTECTION SHEETS COMPRISING THE SAME | NITTO BELGIUM NV (BE) | 2026-04-15 | — | — | EP | disclosed |
| US-12596315-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2026-04-07 | — | — | US | disclosed |
| US-12596325-B2 | Process cartridge | CANON KABUSHIKI KAISHA (JP) | 2026-04-07 | — | — | US | disclosed |
| EP-4258342-B1 | TWO-COMPONENT CURABLE COMPOSITION AND CURED PRODUCT THEREOF | COSMO OIL LUBRICANTS CO LTD (JP) | 2026-04-01 | — | — | EP | disclosed |
| US-12590653-B2 | Fuel hose | SUMITOMO RIKO COMPANY LIMITED (JP) | 2026-03-31 | — | — | US | disclosed |
| US-12584047-B2 | Electrically peelable adhesive composition, electrically peelable adhesive product, and utilization thereof | VIGTEQNOS CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-12585209-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2026-03-24 | — | — | US | disclosed |
| US-20260079418-A1 | BLACK TONER | CANON KK (JP) | 2026-03-19 | — | — | US | disclosed |
| US-12577432-B2 | Organosilicon compound, production method therefor, and curable composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-17 | — | — | US | disclosed |
| US-20260064023-A1 | DEVELOPING APPARATUS, PROCESS CARTRIDGE, AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS | CANON KK (JP) | 2026-03-05 | — | — | US | disclosed |
| US-12565608-B2 | Thermally conductive resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-03 | — | — | US | disclosed |
| US-12566404-B2 | Process cartridge | CANON KABUSHIKI KAISHA (JP) | 2026-03-03 | — | — | US | disclosed |
| EP-4282653-B1 | ORGANOSILICON COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE COMPOSITION | SHINETSU CHEMICAL CO (JP) | 2026-02-25 | — | — | EP | disclosed |
| EP-4692130-A1 | CURABLE COMPOSITION AND CURED PRODUCT | Cosmo Oil Lubricants Co., Ltd. (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-12545815-B2 | Protective sheet | NITTO DENKO CORPORATION (JP) | 2026-02-10 | — | — | US | disclosed |
| US-12541172-B2 | Process cartridge | CANON KABUSHIKI KAISHA (JP) | 2026-02-03 | — | — | US | disclosed |
| EP-3904088-B1 | PROTECTIVE SHEET | NITTO DENKO CORP (JP) | 2026-01-28 | — | — | EP | disclosed |
| EP-4685163-A1 | TWO-COMPONENT CURABLE COMPOSITION AND CURED PRODUCT | Cosmo Oil Lubricants Co., Ltd. (JP) | 2026-01-28 | — | — | EP | disclosed |
| US-12535751-B2 | Toner particle having hydrotalcite particle containing fluorine | CANON KABUSHIKI KAISHA (JP) | 2026-01-27 | — | — | US | disclosed |
| EP-3715429-B1 | ADHESIVE LAYER | SUMITOMO METAL MINING CO (JP) | 2026-01-21 | — | — | EP | disclosed |
| US-12529971-B2 | Process cartridge | CANON KABUSHIKI KAISHA (JP) | 2026-01-20 | — | — | US | disclosed |
| EP-4310132-B1 | STRETCHED POLYETHYLENE FILM FOR LAMINATION | TOSOH CORP (JP) | 2026-01-14 | — | — | EP | disclosed |
| US-12521919-B2 | Anisotropic film and method for manufacturing anisotropic film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-13 | — | — | US | disclosed |
| US-12522684-B2 | Active-energy-ray-curable resin composition and cured product thereof | NIPPON SHOKUBAI CO., LTD. (JP) | 2026-01-13 | — | — | US | disclosed |
| US-12516226-B2 | Pressure-sensitive adhesive composition and surface protection sheets including the same | NITTO BELGIUM NV (BE) | 2026-01-06 | — | — | US | disclosed |
| US-20260002054-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | RESONAC CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20250388767-A1 | METHOD FOR PRODUCING VARNISH-LIKE CYCLIC OLEFIN COPOLYMER COMPOSITION, CYCLIC OLEFIN COPOLYMER COMPOSITION, CROSSLINKED PRODUCT, FILM, OR SHEET, LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND PREPREG | MITSUI CHEMICALS, INC. (JP) | 2025-12-25 | — | — | US | disclosed |
| US-20250383612-A1 | Toner | CANON KK (JP) | 2025-12-18 | — | — | US | disclosed |
| EP-4159779-B1 | ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON CATALYTIC CHEM IND (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4656700-A1 | VIBRATION-DAMPING PROPERTY-IMPARTING MATERIAL, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE | Techno-UMG Co., Ltd. (JP) | 2025-12-03 | — | — | EP | disclosed |
| US-12486371-B2 | Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2025-12-02 | — | — | US | disclosed |
| US-20250361426-A1 | METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2025-11-27 | — | — | US | disclosed |
| US-12472820-B2 | Display devices | MITSUI CHEMICALS, INC. (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12474649-B2 | Toner and method for producing toner | CANON KABUSHIKI KAISHA (JP) | 2025-11-18 | — | — | US | disclosed |
| US-20250346788-A1 | POLYMALEIMIDE RESIN, RESIN COMPOSITION, CURED OBJECT, SHEET, LAMINATE, AND PRINTED WIRING BOARD | RESONAC CORP (JP) | 2025-11-13 | — | — | US | disclosed |
| US-20250346702-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | RESONAC CORP (JP) | 2025-11-13 | — | — | US | disclosed |
| US-20250341777-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | RESONAC CORP (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12460102-B2 | Paint-protective coating material and acrylic coating composition | NITTO DENKO CORPORATION (JP) | 2025-11-04 | — | — | US | disclosed |
| US-20250326950-A1 | SILSESQUIOXANE DERIVATIVE AND METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL | TOAGOSEI CO LTD (JP) | 2025-10-23 | — | — | US | disclosed |
| EP-4632000-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE COMPRISING SAME | Mitsui Chemicals, Inc. (JP) | 2025-10-15 | — | — | EP | disclosed |
| US-20250314982-A1 | TONER, CARTRIDGE, AND IMAGE FORMING APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2025-10-09 | — | — | US | disclosed |
| EP-4628545-A1 | RATTLE NOISE REDUCTION MATERIAL AND THERMOPLASTIC RESIN COMPOSITION | Techno-UMG Co., Ltd. (JP) | 2025-10-08 | — | — | EP | disclosed |
| EP-4628770-A1 | FLUID HOSE | Sumitomo Riko Company Limited (JP) | 2025-10-08 | — | — | EP | disclosed |
| US-12434463-B2 | Stretched polyethylene film for lamination | TOSOH CORPORATION (JP) | 2025-10-07 | — | — | US | disclosed |
| US-20250297092-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ESTER-BASED THIXOTROPY-IMPARTING AGENT | RESONAC CORPORATION (JP) | 2025-09-25 | — | — | US | disclosed |
| US-20250277087-A1 | MALEIMIDE RESIN, RESIN COMPOSITION, CURED PRODUCT, SHEET, LAMINATE, AND PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| US-20250276509-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO LTD (KR) | 2025-09-04 | — | — | US | disclosed |
| US-20250277077-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND CURED PRODUCT OF RESIN COMPOSITION | RESONAC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| US-12404428-B2 | Radiation-curable adhesive sheet | NITTO DENKO CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| US-12405545-B2 | Toner and method for producing toner | CANON KABUSHIKI KAISHA (JP) | 2025-09-02 | — | — | US | disclosed |
| US-20250271757-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | RESONAC CORPORATION (JP) | 2025-08-28 | — | — | US | disclosed |
| US-12398296-B2 | Method for producing pressure-sensitive adhesive sheet, and pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2025-08-26 | — | — | US | disclosed |
| US-20250264168-A1 | FLUID HOSE | SUMITOMO RIKO COMPANY LIMITED (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4603533-A2 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2025-08-20 | — | — | EP | disclosed |
| US-12393131-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2025-08-19 | — | — | US | disclosed |
| US-12384933-B2 | Paint-protective coating material and coating composition | NITTO DENKO CORPORATION (JP) | 2025-08-12 | — | — | US | disclosed |
| US-12378377-B2 | Cyclic olefin-based copolymer composition, varnish, and cross-linked product | MITSUI CHEMICALS, INC. (JP) | 2025-08-05 | — | — | US | disclosed |
| US-12371591-B2 | Electrically peelable adhesive composition, electrically peelable adhesive product, and method for peeling product | VIGTEQNOS CO., LTD. (JP) | 2025-07-29 | — | — | US | disclosed |
| US-12358263-B2 | Method for protecting low-E glass plate, method for producing glass unit, laminate and protective sheet for low-E glass plate | NITTO DENKO CORPORATION (JP) | 2025-07-15 | — | — | US | disclosed |
| US-12359045-B2 | Oxazoline-modified polypropylene | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2025-07-15 | — | — | US | disclosed |
| EP-4578884-A2 | RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED PLASTIC | Mitsubishi Chemical Corporation (JP) | 2025-07-02 | — | — | EP | disclosed |
| US-20250208529-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2025-06-26 | — | — | US | disclosed |
| US-20250210403-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2025-06-26 | — | — | US | disclosed |
| US-20250208528-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2025-06-26 | — | — | US | disclosed |
| EP-3434746-B1 | PRIMER FOR SOLAR CELL MODULE AND SOLAR CELL MODULE | TOYOTA JIDOSHOKKI KK (JP) | 2025-06-25 | — | — | EP | disclosed |
| WO-2025121040-A1 | COMPOSITION FOR HARDCOATS, PRODUCTION METHOD THEREFOR, HARDCOAT, AND SUBSTRATE | 東亞合成株式会社 | 2025-06-12 | — | — | WO | disclosed |
| US-20250188264-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND METHOD FOR PRODUCING THERMOPLASTIC ELASTOMER COMPOSITION | MITSUI CHEMICALS, INC. (JP) | 2025-06-12 | — | — | US | disclosed |
| US-12319854-B2 | Protective sheet | NITTO DENKO CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| WO-2025109808-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2025-05-30 | — | — | WO | disclosed |
| CN-115335486-B | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and joined body | 日东电工株式会社 | 2025-05-23 | — | — | CN | disclosed |
| WO-2025104829-A1 | THERMOSETTING ACRYLIC RESIN COMPOSITION AND ADHESIVE SHEET OR ADHESIVE TAPE | 株式会社寺岡製作所 | 2025-05-22 | — | — | WO | disclosed |
| WO-2025100369-A1 | MALEIMIDE RESIN, RESIN COMPOSITION, CURED PRODUCT, SHEET, LAMINATE, AND PRINTED WIRING BOARD | 株式会社レゾナック | 2025-05-15 | — | — | WO | disclosed |
| US-20250145870-A1 | ELECTRICALLY DEBONDABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND ADHERED BODY | NITTO DENKO CORPORATION (JP) | 2025-05-08 | — | — | US | disclosed |
| US-12291660-B2 | Method for preparing pressure-sensitive adhesive composition, method for producing protective sheet and method for producing glass unit | NITTO DENKO CORPORATION (JP) | 2025-05-06 | — | — | US | disclosed |
| WO-2025089365-A1 | THERMOPLASTIC ELASTOMER COMPOSITION, MOLDED BODY, AND AUTOMOTIVE COMPONENT | 三井化学株式会社 | 2025-05-01 | — | — | WO | disclosed |
| US-20250136738-A1 | CURABLE COMPOSITION, CURED PRODUCT, MOLDED BODY, AND OPTICAL MATERIAL | MITSUI CHEMICALS, INC. (JP) | 2025-05-01 | — | — | US | disclosed |
| EP-4545576-A1 | METHOD FOR PRODUCING CYCLIC OLEFIN COPOLYMER, CYCLIC OLEFIN COPOLYMER, CROSSLINKED PRODUCT, FILM, OR SHEET, LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND PREPREG | Mitsui Chemicals, Inc. (JP) | 2025-04-30 | — | — | EP | disclosed |
| EP-4545577-A1 | METHOD FOR PRODUCING VARNISH-LIKE CYCLIC OLEFIN COPOLYMER COMPOSITION, CYCLIC OLEFIN COPOLYMER COMPOSITION, CROSSLINKED PRODUCT, FILM, OR SHEET, LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND PREPREG | Mitsui Chemicals, Inc. (JP) | 2025-04-30 | — | — | EP | disclosed |
| CN-119907844-A | Adhesive composition and adhesive sheet | 株式会社力森诺科 | 2025-04-29 | — | — | CN | disclosed |
| WO-2025084280-A1 | SURFACE PROTECTION SHEET | 日東電工株式会社 | 2025-04-24 | — | — | WO | disclosed |
| US-20250129193-A1 | CYCLIC OLEFIN-BASED COPOLYMER, CYCLIC OLEFIN-BASED COPOLYMER COMPOSITION, VARNISH, CROSSLINKED BODY, FILM OR SHEET, LAYERED PRODUCT, CIRCUIT BOARD, ELECTRONIC DEVICE, AND PREPREG | MITSUI CHEMICALS, INC. (JP) | 2025-04-24 | — | — | US | disclosed |
| WO-2025079585-A1 | CURABLE COMPOSITION, CURED PRODUCT, HARD COAT AGENT, HARD COAT, ARTICLE, AND LAMINATE | 東亞合成株式会社 | 2025-04-17 | — | — | WO | disclosed |
| US-20250115689-A1 | POLYFUNCTIONAL (METH)ACRYLATE THIOESTER COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT, MOLDED BODY, OPTICAL MATERIAL, AND METHOD FOR PRODUCING POLYFUNCTIONAL (METH)ACRYLATE THIOESTER COMPOSITION | MITSUI CHEMICALS, INC. (JP) | 2025-04-10 | — | — | US | disclosed |
| EP-3363875-B1 | ELECTRICALLY PEELABLE ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORP (JP) | 2025-04-09 | — | — | EP | disclosed |
| US-20250109252-A1 | SILSESQUIOXANE DERIVATIVE, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL | TOAGOSEI CO., LTD. (JP) | 2025-04-03 | — | — | US | disclosed |
| US-20250109250-A1 | RESIN COMPOSITION, CURED OBJECT, SHEET, LAYERED PRODUCT, AND PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2025-04-03 | — | — | US | disclosed |
| US-20250101181-A1 | RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR, AND CURED PRODUCT OF RESIN COMPOSITION | RESONAC CORPORATION (JP) | 2025-03-27 | — | — | US | disclosed |
| US-20250085661-A1 | PROCESS CARTRIDGE | CANON KABUSHIKI KAISHA (JP) | 2025-03-13 | — | — | US | disclosed |
| US-20250085660-A1 | PROCESS CARTRIDGE | CANON KABUSHIKI KAISHA (JP) | 2025-03-13 | — | — | US | disclosed |
| US-20250085659-A1 | PROCESS CARTRIDGE | CANON KABUSHIKI KAISHA (JP) | 2025-03-13 | — | — | US | disclosed |
| US-20250084205-A1 | RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-03-13 | — | — | US | disclosed |
| US-12247148-B2 | Method for protecting low-E glass plate, method for producing glass unit and protective sheet for low-E glass plate | NITTO DENKO CORPORATION (JP) | 2025-03-11 | — | — | US | disclosed |
| WO-2025047974-A1 | BATTERY PACK AND USE OF ADHESIVE SHEET | 三菱ケミカル株式会社 | 2025-03-06 | — | — | WO | disclosed |
| WO-2025047052-A1 | ADHESIVE AGENT COMPOSITION AND ADHESIVE SHEET | 株式会社レゾナック | 2025-03-06 | — | — | WO | disclosed |
| WO-2025047977-A1 | BATTERY PACK, USE OF ADHESIVE SHEET, AND RECYCLING METHOD | 三菱ケミカル株式会社 | 2025-03-06 | — | — | WO | disclosed |
| CN-115397936-B | Method for producing adhesive sheet, and adhesive sheet | 日东电工株式会社 | 2025-03-04 | — | — | CN | disclosed |
| EP-4512837-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | Resonac Corporation (JP) | 2025-02-26 | — | — | EP | disclosed |
| US-20250059406-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND BONDED BODY | NITTO DENKO CORPORATION (JP) | 2025-02-20 | — | — | US | disclosed |
| WO-2025032827-A1 | COMPOSITE, AND METHOD FOR SEPARATING CONDUCTOR FROM ELECTRICALLY PEELABLE ADHESIVE LAYER | ビッグテクノス株式会社 | 2025-02-13 | — | — | WO | disclosed |
| WO-2025033289-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BONDED BODY | 日東電工株式会社 | 2025-02-13 | — | — | WO | disclosed |
| US-20250051616-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND BONDED BODY | NITTO DENKO CORPORATION (JP) | 2025-02-13 | — | — | US | disclosed |
| WO-2025027951-A1 | PREPREG AND FIBER-REINFORCED PLASTIC | 三菱ケミカル株式会社 | 2025-02-06 | — | — | WO | disclosed |
| EP-4501978-A1 | POLYFUNCTIONAL (METH)ACRYLATE THIOESTER COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT, MOLDED BODY, OPTICAL MATERIAL, AND METHOD FOR PRODUCING POLYFUNCTIONAL (METH)ACRYLATE THIOESTER COMPOSITION | Mitsui Chemicals, Inc. (JP) | 2025-02-05 | — | — | EP | disclosed |
| EP-4501992-A1 | CURABLE COMPOSITION, CURED PRODUCT, MOLDED BODY, AND OPTICAL MATERIAL | Mitsui Chemicals, Inc. (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-12215218-B2 | Hitting sound reducing material and thermoplastic resin composition | TECHNO-UMG CO., LTD. (JP) | 2025-02-04 | — | — | US | disclosed |
| US-20250034433-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE AND USE THEREOF | NITTO DENKO CORPORATION (JP) | 2025-01-30 | — | — | US | disclosed |
| EP-4495183-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND METHOD FOR PRODUCING THERMOPLASTIC ELASTOMER COMPOSITION | Mitsui Chemicals, Inc. (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-12195350-B2 | Adhesive layer, near-infrared shielding film, laminated structure, stacked body and adhesive agent composition | SUMITOMO METAL MINING CO., LTD. (JP) | 2025-01-14 | — | — | US | disclosed |
| US-20250002632-A1 | RESIN, METHOD FOR PRODUCING RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-01-02 | — | — | US | disclosed |
| US-20240425690-A1 | HITTING SOUND REDUCING MATERIAL AND THERMOPLASTIC RESIN COMPOSITION | TECHNO-UMG CO., LTD. (JP) | 2024-12-26 | — | — | US | disclosed |
| WO-2024257836-A1 | PHOTOCURABLE ADHESIVE COMPOSITION FOR POLYMER ELECTROLYTE, AND LAYERED PRODUCT | 東亞合成株式会社 | 2024-12-19 | — | — | WO | disclosed |
| US-20240409787-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND BONDED BODY | NITTO DENKO CORPORATION (JP) | 2024-12-12 | — | — | US | disclosed |
| US-20240400866-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2024-12-05 | — | — | US | disclosed |
| CN-119072659-A | Photosensitive resin composition, cured product, and semiconductor element | 株式会社力森诺科 | 2024-12-03 | — | — | CN | disclosed |
| CN-119072660-A | Photosensitive resin composition, cured product, and semiconductor element | 株式会社力森诺科 | 2024-12-03 | — | — | CN | disclosed |
| US-20240392051-A1 | PAINT-PROTECTIVE COATING MATERIAL AND COATING COMPOSITION | NITTO DENKO CORPORATION (JP) | 2024-11-28 | — | — | US | disclosed |
| CN-119032416-A | Protective sheet for semiconductor processing and method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-11-26 | — | — | CN | disclosed |
| CN-119013314-A | Method for producing (meth) acrylic resin and method for producing adhesive composition | 株式会社力森诺科 | 2024-11-22 | — | — | CN | disclosed |
| US-20240385546-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-11-21 | — | — | US | disclosed |
| US-12146057-B2 | Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-11-19 | — | — | US | disclosed |
| US-20240376350-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE PRODUCT, AND UTILIZATION THEREOF | VIGTEQNOS CO., LTD. (JP) | 2024-11-14 | — | — | US | disclosed |
| CN-118946644-A | Pressure-sensitive adhesive sheet for optical use | 日东电工株式会社 | 2024-11-12 | — | — | CN | disclosed |
| US-20240368319-A1 | Curable Composition, and Cured Product | COSMO OIL LUBRICANTS CO., LTD. (JP) | 2024-11-07 | — | — | US | disclosed |
| US-20240369949-A1 | TONER AND PROCESS CARTRIDGE | CANON KABUSHIKI KAISHA (JP) | 2024-11-07 | — | — | US | disclosed |
| WO-2024228363-A1 | METHOD FOR CLEANING SEMICONDUCTOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2024-11-07 | — | — | WO | disclosed |
| CN-118891339-A | Adhesive composition, adhesive layer, and adhesive sheet | 日东电工株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-118871542-A | Pressure-sensitive adhesive sheet for optical use | 日东电工株式会社 | 2024-10-29 | — | — | CN | disclosed |
| US-20240350970-A1 | SEPARATION FUNCTIONAL LAYER, SEPARATION MEMBRANE, AND METHOD FOR MANUFACTURING SEPARATION FUNCTIONAL LAYER | NITTO DENKO CORPORATION (JP) | 2024-10-24 | — | — | US | disclosed |
| US-20240336816-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE PRODUCT, AND UTILIZATION THEREOF | VIGTEQNOS CO., LTD. (JP) | 2024-10-10 | — | — | US | disclosed |
| WO-2024210133-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | 株式会社レゾナック | 2024-10-10 | — | — | WO | disclosed |
| WO-2024210007-A1 | COATING COMPOSITION AND PAINT FILM PROTECTIVE COATING MATERIAL | 日東電工株式会社 | 2024-10-10 | — | — | WO | disclosed |
| EP-4092086-B1 | PAINT-PROTECTIVE COATING MATERIAL AND ACRYLIC COATING COMPOSITION | NITTO DENKO CORP (JP) | 2024-10-09 | — | — | EP | disclosed |
| WO-2024204367-A1 | ELECTRICALLY REMOVABLE PRESSURE-SENSITIVE ADHESIVE SHEET AND BONDED OBJECT | 日東電工株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024204621-A1 | CURABLE COMPOSITION AND CURED PRODUCT | コスモ石油ルブリカンツ株式会社 | 2024-10-03 | — | — | WO | disclosed |
| US-12104100-B2 | Adhesive composition, adhesive sheet, and adhered body | NITTO DENKO CORPORATION (JP) | 2024-10-01 | — | — | US | disclosed |
| US-20240317966-A1 | RUBBER COMPOSITION, AND RUBBER PRODUCT AND HOSE EACH OBTAINED USING SAID RUBBER COMPOSITION | SUMITOMO RIKO COMPANY LIMITED (JP) | 2024-09-26 | — | — | US | disclosed |
| WO-2024195843-A1 | TWO-COMPONENT CURABLE COMPOSITION AND CURED PRODUCT | コスモ石油ルブリカンツ株式会社 | 2024-09-26 | — | — | WO | disclosed |
| US-20240308195-A1 | STRETCHED POLYETHYLENE FILM FOR LAMINATION | TOSOH CORPORATION (JP) | 2024-09-19 | — | — | US | disclosed |
| WO-2024190477-A1 | METHOD FOR PRODUCING LOW-MOLECULAR-WEIGHT (METH)ACRYLIC POLYMER | 日東電工株式会社 | 2024-09-19 | — | — | WO | disclosed |
| WO-2024189667-A1 | FUEL HOSE | 住友理工株式会社 | 2024-09-19 | — | — | WO | disclosed |
| WO-2024190108-A1 | PROCESSING DEVICE, PROCESSING METHOD, AND METHOD FOR MANUFACTURING POLYMER | 日東電工株式会社 | 2024-09-19 | — | — | WO | disclosed |
| WO-2024189666-A1 | FUEL HOSE | 住友理工株式会社 | 2024-09-19 | — | — | WO | disclosed |
| CN-118647685-A | Adhesive composition, adhesive layer, and adhesive sheet | 日东电工株式会社 | 2024-09-13 | — | — | CN | disclosed |
| US-20240286321-A1 | ANISOTROPIC FILM AND METHOD FOR MANUFACTURING ANISOTROPIC FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-08-29 | — | — | US | disclosed |
| WO-2024176617-A1 | FLUORENE SKELETON-CONTAINING (METH)ACRYLATE COMPOUND, RESIN COMPOSITION, AND CURED PRODUCT | 信越化学工業株式会社 | 2024-08-29 | — | — | WO | disclosed |
| WO-2024177030-A1 | SHEET-SHAPED SKIN MATERIAL AND LAYERED BODY HAVING SAID SKIN MATERIAL | 三井化学株式会社 | 2024-08-29 | — | — | WO | disclosed |
| US-20240278536-A1 | BISMALEIMIDE COMPOSITION, CURED PRODUCT, SHEET, LAMINATED BODY, AND FLEXIBLE PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2024-08-22 | — | — | US | disclosed |
| EP-3656806-B1 | SHEET MOLDING COMPOUND, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL | MITSUBISHI CHEM CORP (JP) | 2024-08-21 | — | — | EP | disclosed |
| CN-113150699-B | Re-releasable adhesive composition and adhesive sheet | 狮王特殊化学株式会社 | 2024-08-16 | — | — | CN | disclosed |
| WO-2024166604-A1 | SEPARATION FUNCTION LAYER AND SEPARATION MEMBRANE | 日東電工株式会社 | 2024-08-15 | — | — | WO | disclosed |
| US-20240263033-A1 | PAINT-PROTECTIVE COATING MATERIAL AND COATING COMPOSITION | NITTO DENKO CORPORATION (JP) | 2024-08-08 | — | — | US | disclosed |
| WO-2024162168-A1 | FLUID HOSE | 住友理工株式会社 | 2024-08-08 | — | — | WO | disclosed |
| US-20240264545-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-08-08 | — | — | US | disclosed |
| WO-2024162063-A1 | AQUEOUS DISPERSION AND RESIN FILM FORMED FROM SAID AQUEOUS DISPERSION | 住友化学株式会社 | 2024-08-08 | — | — | WO | disclosed |
| US-20240264543-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-08-08 | — | — | US | disclosed |
| US-20240264544-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-08-08 | — | — | US | disclosed |
| EP-4410917-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BONDED BODY | NITTO DENKO CORPORATION (JP) | 2024-08-07 | — | — | EP | disclosed |
| EP-4410916-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2024-08-07 | — | — | EP | disclosed |
| EP-4410919-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BONDED BODY | NITTO DENKO CORPORATION (JP) | 2024-08-07 | — | — | EP | disclosed |
| CN-118402041-A | Method for manufacturing semiconductor device and semiconductor device | 株式会社力森诺科 | 2024-07-26 | — | — | CN | disclosed |
| WO-2024154780-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | 株式会社レゾナック | 2024-07-25 | — | — | WO | disclosed |
| US-20240241460-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-07-18 | — | — | US | disclosed |
| EP-4400204-A1 | SEPARATION FUNCTION LAYER, SEPARATION MEMBRANE, AND PRODUCTION METHOD FOR SEPARATION FUNCTION LAYER | NITTO DENKO CORPORATION (JP) | 2024-07-17 | — | — | EP | disclosed |
| US-20240234638-A9 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2024-07-11 | — | — | US | disclosed |
| US-20240231251-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240231250-A1 | TONER FOR USE IN IMAGE-FORMING | CANON KABUSHIKI KAISHA (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240219857-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-07-04 | — | — | US | disclosed |
| US-12027666-B2 | Electrolyte composition, electrolyte film, and method of manufacturing electrolyte film | NIPPON SHOKUBAI CO., LTD. (JP) | 2024-07-02 | — | — | US | disclosed |
| WO-2024135615-A1 | ELECTROLYTE COMPOSITION, ELECTROLYTE CURED ARTICLE OBTAINED BY CURING SAME, ELECTRODE, AND SECONDARY BATTERY | 株式会社日本触媒 | 2024-06-27 | — | — | WO | disclosed |
| WO-2024135527-A1 | SEALING MATERIAL COMPOSITION FOR HIGH PRESSURE HYDROGEN GAS | 株式会社バルカー | 2024-06-27 | — | — | WO | disclosed |
| EP-4389792-A1 | RESIN, METHOD FOR PRODUCING RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-06-26 | — | — | EP | disclosed |
| US-12017950-B2 | Low-E glass plate, protective sheet for low-E glass plate and use thereof | NITTO DENKO CORPORATION (JP) | 2024-06-25 | — | — | US | disclosed |
| CN-118251434-A | Resin, method for producing resin, curable resin composition, and cured product | 三菱瓦斯化学株式会社 | 2024-06-25 | — | — | CN | disclosed |
| WO-2024122417-A1 | METHOD FOR PRODUCING LAMINATE WITH HARD COAT LAYER, AND LAMINATE WITH HARD COAT LAYER | 東亞合成株式会社 | 2024-06-13 | — | — | WO | disclosed |
| WO-2024122170-A1 | ADHESIVE COMPOSITION AND ADHESIVE SHEET | 株式会社レゾナック | 2024-06-13 | — | — | WO | disclosed |
| WO-2024122591-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE COMPRISING SAME | 三井化学株式会社 | 2024-06-13 | — | — | WO | disclosed |
| WO-2024122416-A1 | METHOD FOR PRODUCING LAMINATED BODY WITH HARD COAT LAYER | 東亞合成株式会社 | 2024-06-13 | — | — | WO | disclosed |
| WO-2024122173-A1 | (METH)ACRYLIC RESIN | 株式会社レゾナック | 2024-06-13 | — | — | WO | disclosed |
| EP-4382564-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE COMPRISING SAME | Mitsui Chemicals, Inc. (JP) | 2024-06-12 | — | — | EP | disclosed |
| US-20240184225-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-06-06 | — | — | US | disclosed |
| US-20240182756-A1 | RADIATION-CURABLE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2024-06-06 | — | — | US | disclosed |
| WO-2024116498-A1 | LIQUID SURFACE PROTECTIVE MATERIAL FOR SEMICONDUCTOR WAFER PROCESSING | 日東電工株式会社 | 2024-06-06 | — | — | WO | disclosed |
| WO-2024116569-A1 | RATTLE NOISE REDUCTION MATERIAL AND THERMOPLASTIC RESIN COMPOSITION | テクノＵＭＧ株式会社 | 2024-06-06 | — | — | WO | disclosed |
| US-20240182644-A1 | CURABLE RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2024-06-06 | — | — | US | disclosed |
| US-20240158626-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND APPLICATION THEREOF | MITSUI CHEMICALS, INC. (JP) | 2024-05-16 | — | — | US | disclosed |
| US-20240158904-A1 | UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF | TOAGOSEI CO., LTD. (JP) | 2024-05-16 | — | — | US | disclosed |
| WO-2024100764-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | 株式会社レゾナック | 2024-05-16 | — | — | WO | disclosed |
| WO-2024101358-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | 株式会社レゾナック | 2024-05-16 | — | — | WO | disclosed |
| CN-118043424-A | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and joined body | 日东电工株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-118043426-A | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and joined body | 日东电工株式会社 | 2024-05-14 | — | — | CN | disclosed |
| EP-4365255-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE PRODUCT, AND USE OF SAME | Vigteqnos Co., Ltd. (JP) | 2024-05-08 | — | — | EP | disclosed |
| EP-4365254-A1 | ELECTRICALLY PEELABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE PRESSURE-SENSITIVE ADHESIVE PRODUCT, AND USE OF SAME | Vigteqnos Co., Ltd. (JP) | 2024-05-08 | — | — | EP | disclosed |
| US-11980084-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2024-05-07 | — | — | US | disclosed |
| US-20240132646-A1 | COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVING POLYOXYALKYLENE CHAIN | RESONAC CORPORATION (JP) | 2024-04-25 | — | — | US | disclosed |
| US-20240136474-A1 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2024-04-25 | — | — | US | disclosed |
| US-20240132645-A1 | COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND COMPOUND HAVING POLY(METH)ACRYLATE CHAIN | RESONAC CORPORATION (JP) | 2024-04-25 | — | — | US | disclosed |
| US-11965048-B2 | Acrylic resin, producing method thereof, resin composition set, heat storage material, and article | RESONAC CORPORATION (JP) | 2024-04-23 | — | — | US | disclosed |
| WO-2024079923-A1 | RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ELEMENT, AND DRY FILM RESIST | 日本化薬株式会社 | 2024-04-18 | — | — | WO | disclosed |
| US-11958274-B2 | Curable composition for polymer electrolyte, and layered body | TOAGOSEI CO., LTD. (JP) | 2024-04-16 | — | — | US | disclosed |
| WO-2024075746-A1 | RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR, AND CURED PRODUCT OF RESIN COMPOSITION | 株式会社レゾナック | 2024-04-11 | — | — | WO | disclosed |
| WO-2024075744-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND CURED PRODUCT OF RESIN COMPOSITION | 株式会社レゾナック | 2024-04-11 | — | — | WO | disclosed |
| US-20240110647-A1 | FUEL HOSE | SUMITOMO RIKO COMPANY LIMITED (JP) | 2024-04-04 | — | — | US | disclosed |
| WO-2024069725-A1 | RUBBER COMPOSITION AND RUBBER PRODUCT USING SAME, AND HOSE | 住友理工株式会社 | 2024-04-04 | — | — | WO | disclosed |
| US-20240101723-A1 | METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE POLYMER LATEX | ZEON CORPORATION (JP) | 2024-03-28 | — | — | US | disclosed |
| CN-117651730-A | Resin composition and adhesive | 纳美仕有限公司 | 2024-03-05 | — | — | CN | disclosed |
| WO-2024038732-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2024-02-22 | — | — | WO | disclosed |
| US-20240059929-A1 | ORGANOSILICON COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-02-22 | — | — | US | disclosed |
| WO-2024038490-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 株式会社レゾナック | 2024-02-22 | — | — | WO | disclosed |
| US-20240052077-A1 | Two-Component Curable Composition and Cured Product Thereof | COSMO OIL LUBRICANTS CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| WO-2024029315-A1 | METHOD FOR PRODUCING (METH)ACRYLIC RESIN AND METHOD FOR PRODUCING ADHESIVE COMPOSITION | 株式会社レゾナック | 2024-02-08 | — | — | WO | disclosed |
| US-20240043637-A1 | THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2024-02-08 | — | — | US | disclosed |
| US-20240043597-A1 | COMPOSITION AND SHEET | RESONAC CORPORATION (JP) | 2024-02-08 | — | — | US | disclosed |
| US-20240043648-A1 | COMPOSITION AND SHEET CONTAINING CURED PRODUCT OF SAME | RESONAC CORPORATION (JP) | 2024-02-08 | — | — | US | disclosed |
| EP-4317344-A1 | RADIATION-CURABLE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2024-02-07 | — | — | EP | disclosed |
| EP-4317343-A1 | RADIATION-CURABLE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2024-02-07 | — | — | EP | disclosed |
| EP-4317212-A1 | CURABLE COMPOSITION, AND CURED PRODUCT | Cosmo Oil Lubricants Co., Ltd. (JP) | 2024-02-07 | — | — | EP | disclosed |
| EP-4317281-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND USE THEREOF | Mitsui Chemicals, Inc. (JP) | 2024-02-07 | — | — | EP | disclosed |
| EP-4317345-A1 | RADIATION-CURABLE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2024-02-07 | — | — | EP | disclosed |
| US-11891550-B2 | Curable and optically clear pressure sensitive adhesives and uses thereof | HENKEL AG & CO. KGAA (DE) | 2024-02-06 | — | — | US | disclosed |
| US-20240036489-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2024-02-01 | — | — | US | disclosed |
| WO-2024019088-A1 | MALEIMIDE RESIN, RESIN COMPOSITION, CURED PRODUCT, SHEET, LAMINATE, AND PRINTED WIRING BOARD | 株式会社レゾナック | 2024-01-25 | — | — | WO | disclosed |
| WO-2024019084-A1 | POLYMALEIMIDE RESIN, RESIN COMPOSITION, CURED OBJECT, SHEET, LAMINATE, AND PRINTED WIRING BOARD | 株式会社レゾナック | 2024-01-25 | — | — | WO | disclosed |
| EP-4310132-A1 | STRETCHED POLYETHYLENE FILM FOR LAMINATION | Tosoh Corporation (JP) | 2024-01-24 | — | — | EP | disclosed |
| EP-4310112-A1 | RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED PLASTIC | Mitsubishi Chemical Corporation (JP) | 2024-01-24 | — | — | EP | disclosed |
| WO-2024009895-A1 | COMPOSITION CONTAINING (METH)ACRYLIC POLYMER AND METAL PARTICLES | 株式会社レゾナック | 2024-01-11 | — | — | WO | disclosed |
| CN-117355586-A | Adhesive composition, adhesive layer, and adhesive sheet | 日东电工株式会社 | 2024-01-05 | — | — | CN | disclosed |
| WO-2024004884-A1 | METHOD FOR PRODUCING VARNISH-LIKE CYCLIC OLEFIN COPOLYMER COMPOSITION, CYCLIC OLEFIN COPOLYMER COMPOSITION, CROSSLINKED PRODUCT, FILM, OR SHEET, LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND PREPREG | 三井化学株式会社 | 2024-01-04 | — | — | WO | disclosed |
| WO-2024004882-A1 | METHOD FOR PRODUCING CYCLIC OLEFIN COPOLYMER, CYCLIC OLEFIN COPOLYMER, CROSSLINKED PRODUCT, FILM, OR SHEET, LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND PREPREG | 三井化学株式会社 | 2024-01-04 | — | — | WO | disclosed |
| EP-4299272-A1 | METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE POLYMER LATEX | Zeon Corporation (JP) | 2024-01-03 | — | — | EP | disclosed |
| WO-2023243691-A1 | STRETCHED POLYETHYLENE FILM FOR LAMINATION | 東ソー株式会社 | 2023-12-21 | — | — | WO | disclosed |
| US-20230411335-A1 | THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT | KYOCERA CORPORATION (JP) | 2023-12-21 | — | — | US | disclosed |
| US-20230399479-A1 | LAMINATED FILM AND FLEXIBLE DEVICE | DAICEL CORPORATION (JP) | 2023-12-14 | — | — | US | disclosed |
| WO-2023238925-A1 | RADICAL POLYMERIZABLE COMPOSITION AND POLYMERIZED PRODUCT THEREOF | 株式会社日本触媒 | 2023-12-14 | — | — | WO | disclosed |
| WO-2023238835-A1 | SILSESQUIOXANE DERIVATIVE AND METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL | 東亞合成株式会社 | 2023-12-14 | — | — | WO | disclosed |
| EP-4289618-A1 | UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME | Toagosei Co., Ltd. (JP) | 2023-12-13 | — | — | EP | disclosed |
| CN-117222682-A | Cured resin composition and cured product thereof | 日本化药株式会社 | 2023-12-12 | — | — | CN | disclosed |
| US-20230383077-A1 | RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED PLASTIC | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-11-30 | — | — | US | disclosed |
| EP-4282653-A1 | ORGANOSILICON COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-29 | — | — | EP | disclosed |
| WO-2023223978-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ESTER-BASED THIXOTROPY-IMPARTING AGENT | 株式会社レゾナック | 2023-11-23 | — | — | WO | disclosed |
| WO-2023223979-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | 株式会社レゾナック | 2023-11-23 | — | — | WO | disclosed |
| US-11822286-B2 | Process cartridge and electrophotographic apparatus | CANON KABUSHIKI KAISHA (JP) | 2023-11-21 | — | — | US | disclosed |
| EP-3640737-B1 | TONER | CANON KK (JP) | 2023-11-15 | — | — | EP | disclosed |
| EP-3650499-B1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING SHIELDED PACKAGE USING SAME | TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP) | 2023-11-08 | — | — | EP | disclosed |
| CN-111801384-B | Curable composition for polyelectrolyte and laminate | 东亚合成株式会社 | 2023-10-20 | — | — | CN | disclosed |
| US-11787976-B2 | Method of producing anisotropic conductive film and anisotropic conductive film | DEXERIALS CORPORATION (JP) | 2023-10-17 | — | — | US | disclosed |
| CN-116888189-A | Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | 日本化药株式会社 | 2023-10-13 | — | — | CN | disclosed |
| EP-4258342-A1 | TWO-COMPONENT CURABLE COMPOSITION AND CURED PRODUCT THEREOF | Cosmo Oil Lubricants Co., Ltd. (JP) | 2023-10-11 | — | — | EP | disclosed |
| US-11784154-B2 | Anisotropic conductive film and method of producing the same | DEXERIALS CORPORATION (JP) | 2023-10-10 | — | — | US | disclosed |
| US-11784153-B2 | Thermosetting resin composition, semiconductor device, and electrical/electronic component | KYOCERA CORPORATION (JP) | 2023-10-10 | — | — | US | disclosed |
| US-20230314974-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2023-10-05 | — | — | US | disclosed |
| WO-2023187992-A1 | HOSE FOR FUELS | 住友理工株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023188978-A1 | CURABLE COMPOSITION, CURED PRODUCT, MOLDED BODY, AND OPTICAL MATERIAL | 三井化学株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023189741-A1 | RUBBER COMPOSITION, AND RUBBER PRODUCT AND HOSE EACH OBTAINED USING SAID RUBBER COMPOSITION | 住友理工株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023188968-A1 | POLYFUNCTIONAL (METH)ACRYLATE THIOESTER COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT, MOLDED BODY, OPTICAL MATERIAL, AND METHOD FOR PRODUCING POLYFUNCTIONAL (METH)ACRYLATE THIOESTER COMPOSITION | 三井化学株式会社 | 2023-10-05 | — | — | WO | disclosed |
| US-20230303894-A1 | ELECTRICALLY DEBONDABLE ADHESIVE SHEET AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2023-09-28 | — | — | US | disclosed |
| EP-4249242-A1 | ADHESIVE TAPE AND USE OF SAME | Nitto Denko Corporation (JP) | 2023-09-27 | — | — | EP | disclosed |
| CN-116806246-A | Optical adhesive tape | 日东电工株式会社 | 2023-09-26 | — | — | CN | disclosed |
| CN-116802247-A | Optical adhesive tape | 日东电工株式会社 | 2023-09-22 | — | — | CN | disclosed |
| WO-2023176810-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND METHOD FOR PRODUCING THERMOPLASTIC ELASTOMER COMPOSITION | 三井化学株式会社 | 2023-09-21 | — | — | WO | disclosed |
| EP-2216349-B1 | USE OF A PHENOL TYPE COMPOUND IN A DENTAL CHEMICAL POLYMERIZATION CATALYST WITH IMPROVED POLYMERIZING ACTIVITY | TOKUYAMA DENTAL CORP (JP) | 2023-09-20 | — | — | EP | disclosed |
| US-11760066-B2 | Method for protecting Low-E glass plate, method for producing glass unit, laminate and protective sheet for Low-E glass plate | NITTO DENKO CORPORATION (JP) | 2023-09-19 | — | — | US | disclosed |
| CN-116761863-A | Optical adhesive tape | 日东电工株式会社 | 2023-09-15 | — | — | CN | disclosed |
| CN-116761864-A | Optical adhesive tape | 日东电工株式会社 | 2023-09-15 | — | — | CN | disclosed |
| WO-2023167187-A1 | POLYMERIZABLE COMPOSITION | 株式会社日本触媒 | 2023-09-07 | — | — | WO | disclosed |
| WO-2023167186-A1 | POLYMERIZABLE COMPOSITION | 株式会社日本触媒 | 2023-09-07 | — | — | WO | disclosed |
| WO-2023163160-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION | タツタ電線株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230273538-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2023-08-31 | — | — | US | disclosed |
| US-20230273539-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2023-08-31 | — | — | US | disclosed |
| US-20230273543-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2023-08-31 | — | — | US | disclosed |
| CN-110894339-B | Thermosetting resin composition, thermosetting resin film, and semiconductor device | 信越化学工业株式会社 | 2023-08-29 | — | — | CN | disclosed |
| WO-2023152913-A1 | ELECTRICALLY REMOVABLE PRESSURE-SENSITIVE ADHESIVE SHEET AND PRODUCTION METHOD THEREFOR | ビッグテクノス株式会社 | 2023-08-17 | — | — | WO | disclosed |
| WO-2023152911-A1 | ELECTRICALLY PEELABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE PRESSURE-SENSITIVE ADHESIVE PRODUCT, AND USE OF SAME | ビッグテクノス株式会社 | 2023-08-17 | — | — | WO | disclosed |
| WO-2023152912-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE PRODUCT, AND USE OF SAME | ビッグテクノス株式会社 | 2023-08-17 | — | — | WO | disclosed |
| WO-2023149461-A1 | CYCLIC OLEFIN-BASED COPOLYMER, CYCLIC OLEFIN-BASED COPOLYMER COMPOSITION, VARNISH, CROSSLINKED BODY, FILM OR SHEET, LAYERED PRODUCT, CIRCUIT BOARD, ELECTRONIC DEVICE AND PREPREG | 三井化学株式会社 | 2023-08-10 | — | — | WO | disclosed |
| US-20230250328-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-08-10 | — | — | US | disclosed |
| CN-116569328-A | Two-component curable composition and cured product | 可舒磨润滑油株式会社 | 2023-08-08 | — | — | CN | disclosed |
| CN-116536005-A | Adhesive composition, adhesive sheet, and joined body | 日东电工株式会社 | 2023-08-04 | — | — | CN | disclosed |
| US-20230220142-A1 | ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON SHOKUBAI CO., LTD. (JP) | 2023-07-13 | — | — | US | disclosed |
| CN-112639045-B | Adhesive composition, adhesive sheet, and joined body | 日东电工株式会社 | 2023-07-04 | — | — | CN | disclosed |
| US-20230209980-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-06-29 | — | — | US | disclosed |
| US-20230203347-A1 | METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2023-06-29 | — | — | US | disclosed |
| WO-2023119879-A1 | SEPARATION FUNCTION LAYER, SEPARATION MEMBRANE, AND MEMBRANE SEPARATION METHOD | 日東電工株式会社 | 2023-06-29 | — | — | WO | disclosed |
| EP-4201972-A1 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | Techno-UMG Co., Ltd. (JP) | 2023-06-28 | — | — | EP | disclosed |
| CN-116323845-A | Adhesive composition, adhesive layer, and adhesive sheet | 日东电工株式会社 | 2023-06-23 | — | — | CN | disclosed |
| WO-2023112427-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2023-06-22 | — | — | WO | disclosed |
| EP-4194198-A1 | ELECTRICALLY PEELABLE ADHESIVE SHEET AND BONDED BODY | NITTO DENKO CORPORATION (JP) | 2023-06-14 | — | — | EP | disclosed |
| WO-2023100991-A1 | SILSESQUIOXANE DERIVATIVE, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL | 東亞合成株式会社 | 2023-06-08 | — | — | WO | disclosed |
| WO-2023100992-A1 | SILSESQUIOXANE DERIVATIVE, CURABLE COMPOSITION, CURED PRODUCT, AND BASE MATERIAL | 東亞合成株式会社 | 2023-06-08 | — | — | WO | disclosed |
| CN-112292735-B | Conductive paste for vacuum printing | 纳美仕有限公司 | 2023-06-06 | — | — | CN | disclosed |
| CN-116234888-A | Millimeter wave antenna | 日东电工株式会社 | 2023-06-06 | — | — | CN | disclosed |
| US-20230167339-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2023-06-01 | — | — | US | disclosed |
| US-20230167335-A1 | METHOD FOR PROTECTING LOW-E GLASS PLATE, METHOD FOR PRODUCING GLASS UNIT, LAMINATE AND PROTECTIVE SHEET FOR LOW-E GLASS PLATE | NITTO DENKO CORPORATION (JP) | 2023-06-01 | — | — | US | disclosed |
| US-20230159799-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2023-05-25 | — | — | US | disclosed |
| WO-2023090363-A1 | RESIN COMPOSITION, CURED OBJECT, SHEET, LAYERED PRODUCT, AND PRINTED WIRING BOARD | 株式会社レゾナック | 2023-05-25 | — | — | WO | disclosed |
| US-20230151228-A1 | CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING SHIELDED PACKAGE USING SAME | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2023-05-18 | — | — | US | disclosed |
| CN-110938395-B | Adhesive sheet for electronic device | 日东电工株式会社 | 2023-05-16 | — | — | CN | disclosed |
| CN-110938396-B | Adhesive sheet for electronic device | 日东电工株式会社 | 2023-05-16 | — | — | CN | disclosed |
| CN-116096568-A | Electric release type adhesive sheet and joined body | 日东电工株式会社 | 2023-05-09 | — | — | CN | disclosed |
| US-20230139814-A1 | SHEET MOLDING COMPOUND, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-05-04 | — | — | US | disclosed |
| US-20230130867-A1 | CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COPPER-CLAD LAMINATE AND PRINTED-WIRING BOARD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| US-20230126433-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND SURFACE PROTECTION SHEETS INCLUDING THE SAME | NITTO BELGIUM NV (BE) | 2023-04-27 | — | — | US | disclosed |
| EP-4169994-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND SURFACE PROTECTION SHEETS COMPRISING THE SAME | Nitto Belgium NV (BE) | 2023-04-26 | — | — | EP | disclosed |
| CN-111662414-B | Rubbery polymer, graft copolymer and thermoplastic resin composition | 大科能宇菱通株式会社 | 2023-04-25 | — | — | CN | disclosed |
| CN-116004005-A | Cyclic imide resin composition, liquid adhesive, film, prepreg, copper-clad laminate, and printed wiring board | 信越化学工业株式会社 | 2023-04-25 | — | — | CN | disclosed |
| CN-111849381-B | Pressure-sensitive adhesive sheet | 日东电工株式会社 | 2023-04-25 | — | — | CN | disclosed |
| US-20230119795-A1 | PROCESS CARTRIDGE | CANON KABUSHIKI KAISHA (JP) | 2023-04-20 | — | — | US | disclosed |
| US-20230114583-A1 | PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2023-04-13 | — | — | US | disclosed |
| WO-2023054478-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | 日東電工株式会社 | 2023-04-06 | — | — | WO | disclosed |
| WO-2023054484-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BONDED BODY | 日東電工株式会社 | 2023-04-06 | — | — | WO | disclosed |
| WO-2023054480-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BONDED BODY | 日東電工株式会社 | 2023-04-06 | — | — | WO | disclosed |
| EP-4159779-A1 | ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | Nippon Shokubai Co., Ltd. (JP) | 2023-04-05 | — | — | EP | disclosed |
| US-11608402-B2 | Graft copolymer, thermoplastic resin composition, and molded article produced by molding the same | TECHNO-UMG CO., LTD. (JP) | 2023-03-21 | — | — | US | disclosed |
| US-11608438-B2 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-03-21 | — | — | US | disclosed |
| US-20230071452-A1 | DOUBLE-SIDED ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2023-03-09 | — | — | US | disclosed |
| WO-2023032744-A1 | SEPARATION FUNCTION LAYER, SEPARATION MEMBRANE, AND PRODUCTION METHOD FOR SEPARATION FUNCTION LAYER | 日東電工株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-11600778-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-03-07 | — | — | US | disclosed |
| US-11597829-B2 | Resin composition for fiber-reinforced composite materials and fiber-reinforced composite material using same | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2023-03-07 | — | — | US | disclosed |
| EP-4140732-A1 | LOW-E GLASS PLATE PROTECTION METHOD, GLASS UNIT PRODUCTION METHOD, LAYERED BODY, AND LOW-E GLASS PLATE PROTECTION SHEET | Nitto Denko Corporation (JP) | 2023-03-01 | — | — | EP | disclosed |
| WO-2023021813-A1 | RESIN, METHOD FOR PRODUCING RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT | 三菱瓦斯化学株式会社 | 2023-02-23 | — | — | WO | disclosed |
| WO-2023017752-A1 | RESIN COMPOSITION AND ADHESIVE | ナミックス株式会社 | 2023-02-16 | — | — | WO | disclosed |
| US-20230047560-A1 | TONER AND METHOD FOR PRODUCING TONER | CANON KABUSHIKI KAISHA (JP) | 2023-02-16 | — | — | US | disclosed |
| US-20230047510-A1 | TONER AND METHOD FOR PRODUCING TONER | CANON KABUSHIKI KAISHA (JP) | 2023-02-16 | — | — | US | disclosed |
| WO-2023013772-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE COMPRISING SAME | 三井化学株式会社 | 2023-02-09 | — | — | WO | disclosed |
| WO-2023013687-A1 | ANTIBACTERIAL/ANTIVIRAL AGENT COMPOSITION, ANTIBACTERIAL/ANTIVIRAL STRUCTURE, AND ANTIBACTERIAL/ANTIVIRAL STRUCTURE PRODUCTION METHOD | 日華化学株式会社 | 2023-02-09 | — | — | WO | disclosed |
| US-20230042289-A1 | TONER AND METHOD FOR PRODUCING THE TONER | CANON KABUSHIKI KAISHA (JP) | 2023-02-09 | — | — | US | disclosed |
| EP-4130182-A1 | METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2023-02-08 | — | — | EP | disclosed |
| CN-115685704-A | Toner and method for producing toner | 佳能株式会社 | 2023-02-03 | — | — | CN | disclosed |
| CN-115667395-A | Thermoplastic resin composition and molded article thereof | 大科能宇菱通株式会社 | 2023-01-31 | — | — | CN | disclosed |
| US-20230016868-A1 | CURABLE COMPOSITION SET AND ARTICLE | RESONAC CORPORATION (JP) | 2023-01-19 | — | — | US | disclosed |
| CN-111094361-B | Method for producing structure containing ionic liquid, and structure containing ionic liquid | 日东电工株式会社 | 2023-01-10 | — | — | CN | disclosed |
| US-20230002661-A1 | CURABLE COMPOSITION AND ARTICLE | RESONAC CORPORATION (JP) | 2023-01-05 | — | — | US | disclosed |
| CN-113166612-B | Adhesive composition and adhesive sheet | 昭和电工株式会社 | 2022-12-30 | — | — | CN | disclosed |
| EP-4108453-A1 | ELECTRICALLY PEELABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE PRESSURE-SENSITIVE ADHESIVE PRODUCT, AND METHOD FOR PEELING SAME | Vigteqnos Co., Ltd. (JP) | 2022-12-28 | — | — | EP | disclosed |
| WO-2022264292-A1 | BISMALEIMIDE COMPOSITION, CURED PRODUCT, SHEET, LAMINATED BODY, AND FLEXIBLE PRINTED WIRING BOARD | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-12-22 | — | — | WO | disclosed |
| US-20220403082-A1 | COMPOSITION SET CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN | RESONAC CORPORATION (JP) | 2022-12-22 | — | — | US | disclosed |
| US-20220403081-A1 | COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN | RESONAC CORPORATION (JP) | 2022-12-22 | — | — | US | disclosed |
| US-20220389284-A1 | DOUBLE-SIDED ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2022-12-08 | — | — | US | disclosed |
| US-20220389283-A1 | DOUBLE-SIDED ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2022-12-08 | — | — | US | disclosed |
| CN-115397915-A | Conductive composition and method for manufacturing shield package using the same | 拓自达电线株式会社 | 2022-11-25 | — | — | CN | disclosed |
| CN-115397936-A | Method for producing adhesive sheet and adhesive sheet | 日东电工株式会社 | 2022-11-25 | — | — | CN | disclosed |
| WO-2022244695-A1 | COATING FILM-PROTECTING COAT, AND COATING COMPOSITION | 日東電工株式会社 | 2022-11-24 | — | — | WO | disclosed |
| WO-2022244694-A1 | COATING FILM PROTECTIVE COATING MATERIAL AND COATING COMPOSITION | 日東電工株式会社 | 2022-11-24 | — | — | WO | disclosed |
| US-20220371304-A1 | METHOD FOR PROTECTING LOW-E GLASS PLATE, METHOD FOR PRODUCING GLASS UNIT, LAMINATE AND PROTECTIVE SHEET FOR LOW-E GLASS PLATE | NITTO DENKO CORPORATION (JP) | 2022-11-24 | — | — | US | disclosed |
| EP-4092086-A1 | PAINT-PROTECTIVE COATING MATERIAL AND ACRYLIC COATING COMPOSITION | Nitto Denko Corporation (JP) | 2022-11-23 | — | — | EP | disclosed |
| US-11505693-B1 | Thermoplastic resin composition and molded article produced by molding the same | TECHNO-UMG CO., LTD. (JP) | 2022-11-22 | — | — | US | disclosed |
| US-20220363940-A1 | PAINT-PROTECTIVE COATING MATERIAL AND ACRYLIC COATING COMPOSITION | NITTO DENKO CORPORATION (JP) | 2022-11-17 | — | — | US | disclosed |
| US-20220363035-A1 | METHOD FOR PROTECTING LOW-E GLASS PLATE, METHOD FOR PRODUCING GLASS UNIT, LAMINATE AND PROTECTIVE SHEET FOR LOW-E GLASS PLATE | NITTO DENKO CORPORATION (JP) | 2022-11-17 | — | — | US | disclosed |
| US-20220348758-A1 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED BY MOLDING THE SAME | TECHNO-UMG CO., LTD. (JP) | 2022-11-03 | — | — | US | disclosed |
| WO-2022225041-A1 | CURABLE COMPOSITION, ACTIVE-ENERGY-RAY-CURABLE COMPOSITION, AND ACTIVE-ENERGY-RAY-CURABLE COATING COMPOSITION | 東亞合成株式会社 | 2022-10-27 | — | — | WO | disclosed |
| US-20220332927-A1 | DISPLAY DEVICES | MITSUI CHEMICALS, INC. (JP) | 2022-10-20 | — | — | US | disclosed |
| CN-115210334-A | Adhesive composition, adhesive sheet, and bonded body | 日东电工株式会社 | 2022-10-18 | — | — | CN | disclosed |
| WO-2022210053-A1 | MODIFIED POLYOLEFIN RESIN | 住友化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210277-A1 | RADIATION-CURABLE ADHESIVE SHEET | 日東電工株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210054-A1 | AQUEOUS DISPERSION | 住友化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210055-A1 | ADHESIVE SHEET, BONDED BODY, AND METHOD FOR SEPARATING BONDED BODY | 日東電工株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210276-A1 | RADIATION-CURABLE ADHESIVE SHEET | 日東電工株式会社 | 2022-10-06 | — | — | WO | disclosed |
| US-20220315484-A1 | LOW-E GLASS PLATE, PROTECTIVE SHEET FOR LOW-E GLASS PLATE AND USE THEREOF | NITTO DENKO CORPORATION (JP) | 2022-10-06 | — | — | US | disclosed |
| WO-2022209230-A1 | CURABLE COMPOSITION, AND CURED PRODUCT | コスモ石油ルブリカンツ株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210275-A1 | RADIATION-CURABLE ADHESIVE SHEET | 日東電工株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022201619-A1 | THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE | 日本化薬株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022196239-A1 | STRETCHED POLYETHYLENE FILM FOR LAMINATION | 東ソー株式会社 | 2022-09-22 | — | — | WO | disclosed |
| WO-2022196624-A1 | RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED PLASTIC | 三菱ケミカル株式会社 | 2022-09-22 | — | — | WO | disclosed |
| US-11447663-B2 | Adhesive layer, near-infrared absorbing film, laminated structure, lamination body, adhesive composition and method for producing the same | SUMITOMO METAL MINING CO., LTD. (JP) | 2022-09-20 | — | — | US | disclosed |
| US-20220293858-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2022-09-15 | — | — | US | disclosed |
| EP-4056610-A1 | CURABLE COMPOSITION AND ARTICLE | Showa Denko Materials Co., Ltd. (JP) | 2022-09-14 | — | — | EP | disclosed |
| EP-4056609-A1 | COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN | Showa Denko Materials Co., Ltd. (JP) | 2022-09-14 | — | — | EP | disclosed |
| EP-4056608-A1 | COMPOSITION SET CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN | Showa Denko Materials Co., Ltd. (JP) | 2022-09-14 | — | — | EP | disclosed |
| EP-4056611-A1 | CURABLE COMPOSITION SET AND ARTICLE | Showa Denko Materials Co., Ltd. (JP) | 2022-09-14 | — | — | EP | disclosed |
| CN-115044321-A | Optical adhesive sheet | 日东电工株式会社 | 2022-09-13 | — | — | CN | disclosed |
| WO-2022185891-A1 | SEPARATION MEMBRANE | 日東電工株式会社 | 2022-09-09 | — | — | WO | disclosed |
| WO-2022181454-A1 | COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND COMPOUND HAVING POLY(METH)ACRYLATE CHAIN | 昭和電工マテリアルズ株式会社 | 2022-09-01 | — | — | WO | disclosed |
| WO-2022181389-A1 | METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE POLYMER LATEX | 日本ゼオン株式会社 | 2022-09-01 | — | — | WO | disclosed |
| WO-2022181446-A1 | COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVING POLYOXYALKYLENE CHAIN | 昭和電工マテリアルズ株式会社 | 2022-09-01 | — | — | WO | disclosed |
| US-20220275135-A1 | CYCLIC OLEFIN-BASED COPOLYMER COMPOSITION, VARNISH, AND CROSS-LINKED PRODUCT | MITSUI CHEMICALS, INC. (JP) | 2022-09-01 | — | — | US | disclosed |
| CN-114981376-A | Double-sided adhesive tape | 日东电工株式会社 | 2022-08-30 | — | — | CN | disclosed |
| US-20220267526-A1 | MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-08-25 | — | — | US | disclosed |
| EP-3647371-B1 | RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND MOLDED ARTICLE | ASAHI CHEMICAL IND (JP) | 2022-08-24 | — | — | EP | disclosed |
| US-20220262760-A1 | ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME | DEXERIALS CORPORATION (JP) | 2022-08-18 | — | — | US | disclosed |
| EP-3817119-B1 | ELECTROLYTE COMPOSITION, ELECTROLYTE FILM, AND METHOD OF MANUFACTURING ELECTROLYTE FILM | NIPPON CATALYTIC CHEM IND (JP) | 2022-08-17 | — | — | EP | disclosed |
| WO-2022168804-A1 | UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME | 東亞合成株式会社 | 2022-08-11 | — | — | WO | disclosed |
| WO-2022163593-A1 | ADHESIVE COMPOSITION FOR ELECTICAL PEELING, ADHESIVE SHEET AND BONDED BODY | 日東電工株式会社 | 2022-08-04 | — | — | WO | disclosed |
| US-11401351-B2 | Method of producing a rubbery polymer | TECHNO-UMG CO., LTD. (JP) | 2022-08-02 | — | — | US | disclosed |
| US-11404391-B2 | Anisotropic conductive film and method of producing the same | DEXERIALS CORPORATION (JP) | 2022-08-02 | — | — | US | disclosed |
| CN-114829522-A | Double-sided adhesive tape | 日东电工株式会社 | 2022-07-29 | — | — | CN | disclosed |
| WO-2022158176-A1 | ORGANOSILICON COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE COMPOSITION | 信越化学工業株式会社 | 2022-07-28 | — | — | WO | disclosed |
| EP-4032735-A1 | DISPLAY DEVICE | Mitsui Chemicals, Inc. (JP) | 2022-07-27 | — | — | EP | disclosed |
| US-11384231-B2 | Propylene polymer composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2022-07-12 | — | — | US | disclosed |
| CN-114729237-A | Double-sided adhesive tape | 日东电工株式会社 | 2022-07-08 | — | — | CN | disclosed |
| US-20220214629-A1 | TONER | CANON KK (JP) | 2022-07-07 | — | — | US | disclosed |
| WO-2022138562-A1 | COMPOSITION AND SHEET CONTAINING CURED PRODUCT OF SAME | 昭和電工マテリアルズ株式会社 | 2022-06-30 | — | — | WO | disclosed |
| WO-2022138590-A1 | COMPOSITION AND SHEET | 昭和電工マテリアルズ株式会社 | 2022-06-30 | — | — | WO | disclosed |
| US-20220204737-A1 | OXAZOLINE-MODIFIED POLYPROPYLENE | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2022-06-30 | — | — | US | disclosed |
| EP-4019556-A1 | OXAZOLINE-MODIFIED POLYPROPYLENE | Sumitomo Chemical Company, Limited (JP) | 2022-06-29 | — | — | EP | disclosed |
| US-20220195259-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE PRODUCT, AND METHOD FOR PEELING PRODUCT | VIGTEQNOS CO., LTD. (JP) | 2022-06-23 | — | — | US | disclosed |
| US-20220195189-A1 | CYCLIC IMIDE RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE AND PRINTED-WIRING BOARD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-06-23 | — | — | US | disclosed |
| WO-2022118631-A1 | TWO-COMPONENT CURABLE COMPOSITION AND CURED PRODUCT THEREOF | コスモ石油ルブリカンツ株式会社 | 2022-06-09 | — | — | WO | disclosed |
| US-20220177734-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2022-06-09 | — | — | US | disclosed |
| US-11352496-B2 | Resin composition, method of producing resin composition, and molded article | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2022-06-07 | — | — | US | disclosed |
| US-11352449-B2 | Graft copolymer, and thermoplastic resin composition using same | TECHNO-UMG CO., LTD. (JP) | 2022-06-07 | — | — | US | disclosed |
| US-20220169895-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2022-06-02 | — | — | US | disclosed |
| EP-3674801-B1 | TONER | CANON KK (JP) | 2022-06-01 | — | — | EP | disclosed |
| US-11349077-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2022-05-31 | — | — | US | disclosed |
| US-11348891-B2 | — | — | 2022-05-31 | — | — | US | disclosed |
| WO-2022102736-A1 | LAMINATED FILM AND FLEXIBLE DEVICE | 株式会社ダイセル | 2022-05-19 | — | — | WO | disclosed |
| EP-3992163-A1 | METHOD FOR PROTECTING LOW-E GLASS PLATE, METHOD FOR PRODUCING GLASS UNIT, LAMINATE, AND PROTECTION SHEET FOR LOW-E GLASS PLATE | Nitto Denko Corporation (JP) | 2022-05-04 | — | — | EP | disclosed |
| EP-3992164-A1 | LOW-E GLASS PLATE, PROTECTIVE SHEET FOR LOW-E GLASS PLATE, AND USES FOR SAME | Nitto Denko Corporation (JP) | 2022-05-04 | — | — | EP | disclosed |
| EP-3992165-A1 | LOW-E GLASS PLATE PROTECTION METHOD, GLASS UNIT PRODUCTION METHOD, LAYERED BODY, AND LOW-E GLASS PLATE PROTECTION SHEET | Nitto Denko Corporation (JP) | 2022-05-04 | — | — | EP | disclosed |
| US-11319395-B2 | Rubbery polymer, graft copolymer, and thermoplastic resin composition | TECHNO-UMG CO., LTD. (JP) | 2022-05-03 | — | — | US | disclosed |
| CN-114410254-A | Adhesive composition, adhesive layer, adhesive sheet, optical member, and touch panel | 日东电工株式会社 | 2022-04-29 | — | — | CN | disclosed |
| US-11312850-B2 | Gasket material | NOK CORPORATION (JP) | 2022-04-26 | — | — | US | disclosed |
| US-11314178-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2022-04-26 | — | — | US | disclosed |
| US-20220112410-A1 | SEPARATION AND BONDING METHOD FOR ADHEREND | NITTO DENKO CORPORATION (JP) | 2022-04-14 | — | — | US | disclosed |
| CN-114292595-A | Adhesive composition, adhesive layer, adhesive sheet, optical member, and touch panel | 日东电工株式会社 | 2022-04-08 | — | — | CN | disclosed |
| WO-2022070900-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE SHEET | 日東電工株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022070901-A1 | MILLIMETER WAVE ANTENNA | 日東電工株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022070899-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET | 日東電工株式会社 | 2022-04-07 | — | — | WO | disclosed |
| CN-110382650-B | Adhesive composition for electric peeling, adhesive sheet and joined body | 日东电工株式会社 | 2022-04-05 | — | — | CN | disclosed |
| US-20220089855-A1 | Curable Composition and Cured Material | COSMO OIL LUBRICANTS CO., LTD. (JP) | 2022-03-24 | — | — | US | disclosed |
| US-11279855-B2 | Electrically peelable adhesive composition, adhesive sheet, and joined body | NITTO DENKO CORPORATION (JP) | 2022-03-22 | — | — | US | disclosed |
| US-20220064495-A1 | PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2022-03-03 | — | — | US | disclosed |
| WO-2022045130-A1 | PHOTOCURABLE ADHESIVE SHEET | 日東電工株式会社 | 2022-03-03 | — | — | WO | disclosed |
| US-20220063180-A1 | PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2022-03-03 | — | — | US | disclosed |
| US-20220064494-A1 | METHOD FOR PREPARING PRESSURE-SENSITIVE ADHESIVE COMPOSITION, METHOD FOR PRODUCING PROTECTIVE SHEET AND METHOD FOR PRODUCING GLASS UNIT | NITTO DENKO CORPORATION (JP) | 2022-03-03 | — | — | US | disclosed |
| CN-112534015-B | Adhesive composition and adhesive sheet | 昭和电工株式会社 | 2022-02-25 | — | — | CN | disclosed |
| WO-2022038988-A1 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | テクノＵＭＧ株式会社 | 2022-02-24 | — | — | WO | disclosed |
| WO-2022038987-A1 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | テクノＵＭＧ株式会社 | 2022-02-24 | — | — | WO | disclosed |
| US-11254774-B2 | Styrene resin and method for producing styrene resin | JSP CORPORATION (JP) | 2022-02-22 | — | — | US | disclosed |
| WO-2022030565-A1 | ELECTRICALLY PEELABLE ADHESIVE SHEET AND BONDED BODY | 日東電工株式会社 | 2022-02-10 | — | — | WO | disclosed |
| WO-2022025123-A1 | RESIN COMPOSITION, CURED MATERIAL, SHEET, LAMINATE, AND FLEXIBLE PRINTED CIRCUIT BOARD | 昭和電工マテリアルズ株式会社 | 2022-02-03 | — | — | WO | disclosed |
| US-20220032600-A1 | SEPARATION METHOD AND BONDING METHOD FOR ADHEREND | NITTO DENKO CORPORATION (JP) | 2022-02-03 | — | — | US | disclosed |
| EP-3943567-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2022-01-26 | — | — | EP | disclosed |
| US-20220010072-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-01-13 | — | — | US | disclosed |
| US-11214644-B2 | Rubbery polymer, graft copolymer, and thermoplastic resin composition | TECHNO-UMG CO., LTD. (JP) | 2022-01-04 | — | — | US | disclosed |
| US-20210403701-A1 | CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 2021-12-30 | — | — | US | disclosed |
| US-20210371706-A1 | METHOD OF PRODUCING ANISOTROPIC CONDUCTIVE FILM AND ANISOTROPIC CONDUCTIVE FILM | DEXERIALS CORPORATION (JP) | 2021-12-02 | — | — | US | disclosed |
| EP-3527605-B1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS AND FIBER-REINFORCED COMPOSITE MATERIAL USING SAME | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2021-12-01 | — | — | EP | disclosed |
| US-11191198-B2 | Shield package | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2021-11-30 | — | — | US | disclosed |
| EP-3913664-A1 | CURABLE COMPOSITION AND CURED MATERIAL | Cosmo Oil Lubricants Co., Ltd. (JP) | 2021-11-24 | — | — | EP | disclosed |
| US-20210340298-A1 | GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE PRODUCED BY MOLDING THE SAME | TECHNO-UMG CO., LTD. (JP) | 2021-11-04 | — | — | US | disclosed |
| EP-3904084-A1 | PROTECTIVE SHEET | Nitto Denko Corporation (JP) | 2021-11-03 | — | — | EP | disclosed |
| EP-3904087-A1 | ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2021-11-03 | — | — | EP | disclosed |
| EP-3904088-A1 | PROTECTIVE SHEET | Nitto Denko Corporation (JP) | 2021-11-03 | — | — | EP | disclosed |
| US-11161975-B2 | Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using said curable resin composition | MITSUBISHI CHEMICAL CORPORATION (JP) | 2021-11-02 | — | — | US | disclosed |
| EP-3898794-A1 | ARTICLE COMPRISING A WATER-BASED TOP-COAT | Honeywell International Inc. (US) | 2021-10-27 | — | — | EP | disclosed |
| US-11149162-B2 | Aqueous dispersion, coating film, and laminate | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2021-10-19 | — | — | US | disclosed |
| US-11142610-B2 | Curable epoxy resin composition, fiber-reinforced composite material and molded body using same | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2021-10-12 | — | — | US | disclosed |
| US-11136476-B2 | Method of producing anisotropic conductive film and anisotropic conductive film | DEXERIALS CORPORATION (JP) | 2021-10-05 | — | — | US | disclosed |
| US-20210301059-A1 | ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEAT STORAGE MATERIAL, AND ARTICLE | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-09-30 | — | — | US | disclosed |
| US-20210296700-A1 | ELECTROLYTE COMPOSITION, ELECTROLYTE FILM, AND METHOD OF MANUFACTURING ELECTROLYTE FILM | NIPPON SHOKUBAI CO., LTD. (JP) | 2021-09-23 | — | — | US | disclosed |
| EP-3878879-A1 | GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF | Techno-UMG Co., Ltd. (JP) | 2021-09-15 | — | — | EP | disclosed |
| US-20210277286-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND ADHERED BODY | NITTO DENKO CORPORATION (JP) | 2021-09-09 | — | — | US | disclosed |
| US-20210280548-A1 | ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF | DEXERIALS CORPORATION (JP) | 2021-09-09 | — | — | US | disclosed |
| EP-3131859-B1 | HIGH PERFORMANCE WATER-BASED ADHESION COMPOSITIONS AND APPLICATIONS | HONEYWELL INT INC (US) | 2021-08-11 | — | — | EP | disclosed |
| US-11086242-B2 | Toner and method for producing toner | CANON KABUSHIKI KAISHA (JP) | 2021-08-10 | — | — | US | disclosed |
| WO-2021152890-A1 | DOUBLE-SIDED ADHESIVE TAPE | 日東電工株式会社 | 2021-08-05 | — | — | WO | disclosed |
| EP-3858932-A1 | ADHEREND SEPARATION METHOD AND JOINING METHOD | NITTO DENKO CORPORATION (JP) | 2021-08-04 | — | — | EP | disclosed |
| EP-3858929-A1 | JOINING AND SEPARATION METHOD FOR ADHERENDS | NITTO DENKO CORPORATION (JP) | 2021-08-04 | — | — | EP | disclosed |
| US-11072710-B2 | Surface-treated silica filler, and resin composition containing surface-treated silica filler | NAMICS CORPORATION (JP) | 2021-07-27 | — | — | US | disclosed |
| US-20210214585-A1 | CURABLE AND OPTICALLY CLEAR PRESSURE SENSITIVE ADHESIVES AND USES THEREOF | Henkel IP & Holding GmbH (DE) | 2021-07-15 | — | — | US | disclosed |
| EP-3848434-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET AND BONDED BODY | NITTO DENKO CORPORATION (JP) | 2021-07-14 | — | — | EP | disclosed |
| EP-3845605-A1 | METHOD FOR PRODUCING IONIC LIQUID-CONTAINING STRUCTURE AND IONIC LIQUID-CONTAINING STRUCTURE | NITTO DENKO CORPORATION (JP) | 2021-07-07 | — | — | EP | disclosed |
| US-11034863-B2 | — | — | 2021-06-15 | — | — | US | disclosed |
| US-11013668-B2 | Two-package dental adhesive composition | TOKUYAMA DENTAL CORPORATION | 2021-05-25 | — | — | US | disclosed |
| EP-3819338-A1 | PROPYLENE POLYMER COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2021-05-12 | — | — | EP | disclosed |
| EP-3817119-A1 | ELECTROLYTE COMPOSITION, ELECTROLYTE FILM, AND METHOD OF MANUFACTURING ELECTROLYTE FILM | Nippon Shokubai Co., Ltd. (JP) | 2021-05-05 | — | — | EP | disclosed |
| US-10988642-B2 | Curable and optically clear pressure sensitive adhesive and uses thereof | Henkel IP & Holding GmbH (DE) | 2021-04-27 | — | — | US | disclosed |
| US-20210115234-A1 | PROPYLENE POLYMER COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2021-04-22 | — | — | US | disclosed |
| EP-3064562-B1 | SURFACE PROTECTION SHEET AND WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR SURFACE PROTECTION SHEET | NITTO DENKO CORP (JP) | 2021-04-21 | — | — | EP | disclosed |
| US-10976679-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2021-04-13 | — | — | US | disclosed |
| EP-3425001-B1 | CYCLIC OLEFIN COPOLYMER COMPOSITION AND CROSSLINKED PRODUCT THEREOF | MITSUI CHEMICALS INC (JP) | 2021-03-24 | — | — | EP | disclosed |
| US-20210079219-A1 | MALEIMIDE RESIN COMPOSITION AND MALEIMIDE RESIN FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-03-18 | — | — | US | disclosed |
| EP-3124535-B1 | USE OF A COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE | ZEON CORP (JP) | 2021-03-17 | — | — | EP | disclosed |
| EP-3501482-B1 | TWO-PACKAGE DENTAL ADHESIVE COMPOSITION | TOKUYAMA DENTAL CORP (JP) | 2021-03-17 | — | — | EP | disclosed |
| US-10948839-B2 | Toner having a toner particle with a binder resin containing a copolymer of a styrenic polymerizable monomer, and at least one of an acrylic or methacrylic polymerizable monomer | CANON KABUSHIKI KAISHA (JP) | 2021-03-16 | — | — | US | disclosed |
| US-20210070727-A1 | COMPOUND, RESIN, COMPOSITION AND PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-03-11 | — | — | US | disclosed |
| US-20210070685-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-03-11 | — | — | US | disclosed |
| US-20210070683-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-03-11 | — | — | US | disclosed |
| US-20210061955-A1 | MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-03-04 | — | — | US | disclosed |
| US-20210047457-A1 | COMPOUND, RESIN, COMPOSITION AND PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-02-18 | — | — | US | disclosed |
| US-20210026262-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2021-01-28 | — | — | US | disclosed |
| EP-3770684-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2021-01-27 | — | — | EP | disclosed |
| US-20210008859-A1 | CURABLE COMPOSITION FOR POLYMER ELECTROLYTE, AND LAYERED BODY | TOAGOSEI CO., LTD. (JP) | 2021-01-14 | — | — | US | disclosed |
| EP-3763788-A1 | CURABLE COMPOSITION FOR POLYMER ELECTROLYTE, AND LAMINATE | Toagosei Co., Ltd. (JP) | 2021-01-13 | — | — | EP | disclosed |
| US-20210003921-A1 | COMPOUND, RESIN, COMPOSITION, AND FILM FORMING MATERIAL FOR LITHOGRAPHY USING THE SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-01-07 | — | — | US | disclosed |
| EP-3760611-A1 | COMPOUND, RESIN, COMPOSITION AND FILM-FORMING MATERIAL FOR LITHOGRAPHY USING SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-01-06 | — | — | EP | disclosed |
| US-10865304-B2 | Heat-curable resin composition, heat-curable resin film and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-12-15 | — | — | US | disclosed |
| EP-3747857-A1 | COMPOUND, RESIN, COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR FORMING CIRCUIT PATTERN, AND METHOD FOR PURIFYING RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-12-09 | — | — | EP | disclosed |
| EP-3744710-A1 | COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-12-02 | — | — | EP | disclosed |
| US-20200369923-A1 | ADHESIVE LAYER, NEAR-INFRARED ABSORBING FILM, LAMINATED STRUCTURE, LAMINATION BODY, ADHESIVE COMPOSITION AND METHOD FOR PRODUCING THE SAME | SUMITOMO METAL MINING CO., LTD. (JP) | 2020-11-26 | — | — | US | disclosed |
| US-10845721-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2020-11-24 | — | — | US | disclosed |
| US-20200361843-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD, CIRCUIT PATTERN FORMATION METHOD AND METHOD FOR PURIFYING RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-11-19 | — | — | US | disclosed |
| US-20200362140-A1 | METHOD FOR PRODUCING IONIC LIQUID-CONTAINING STRUCTURE, AND IONIC LIQUID-CONTAINING STRUCTURE | NITTO DENKO CORPORATION (JP) | 2020-11-19 | — | — | US | disclosed |
| US-20200362153-A1 | GASKET MATERIAL | NOK CORPORATION (JP) | 2020-11-19 | — | — | US | disclosed |
| EP-3350277-B1 | CURABLE AND OPTICALLY CLEAR PRESSURE SENSITIVE ADHESIVES AND USES THEREOF | Henkel IP & Holding GmbH (DE) | 2020-11-18 | — | — | EP | disclosed |
| US-20200354501-A1 | COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, FILM FOR LITHOGRAPHY, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CIRCUIT PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-11-12 | — | — | US | disclosed |
| EP-3345964-B1 | TIRE | BRIDGESTONE CORP (JP) | 2020-11-11 | — | — | EP | disclosed |
| EP-3121219-B1 | PREPREG ROLL | MITSUBISHI CHEM CORP (JP) | 2020-11-04 | — | — | EP | disclosed |
| US-10821692-B2 | Tire | BRIDGESTONE CORPORATION (JP) | 2020-11-03 | — | — | US | disclosed |
| US-20200339842-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2020-10-29 | — | — | US | disclosed |
| US-20200325334-A1 | LOW-DIELECTRIC HEAT DISSIPATION FILM COMPOSITION AND LOW-DIELECTRIC HEAT DISSIPATION FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-10-15 | — | — | US | disclosed |
| US-10800209-B2 | Tire | BRIDGESTONE CORPORATION (JP) | 2020-10-13 | — | — | US | disclosed |
| US-20200317920-A1 | METHOD OF PRODUCING A RUBBERY POLYMER | TECHNO UMG CO LTD (JP) | 2020-10-08 | — | — | US | disclosed |
| EP-3715949-A1 | COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, AND CIRCUIT PATTERN FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2020-09-30 | — | — | EP | disclosed |
| EP-3715429-A1 | ADHESIVE LAYER, NEAR-INFRARED ABSORPTION FILM, LAMINATED STRUCTURE, LAYERED PRODUCT, ADHESIVE COMPOSITION, AND PRODUCTION METHOD THEREFOR | Sumitomo Metal Mining Co., Ltd. (JP) | 2020-09-30 | — | — | EP | disclosed |
| EP-3715680-A1 | GASKET MATERIAL | Nok Corporation (JP) | 2020-09-30 | — | — | EP | disclosed |
| EP-3715380-A1 | METHOD FOR PRODUCING IONIC LIQUID-CONTAINING STRUCTURE, AND IONIC LIQUID-CONTAINING STRUCTURE | Nitto Denko Corporation (JP) | 2020-09-30 | — | — | EP | disclosed |
| US-20200288608-A1 | SHIELD PACKAGE | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2020-09-10 | — | — | US | disclosed |
| US-20200263065-A1 | ADHESIVE ARTICLE | NITTO DENKO CORPORATION (JP) | 2020-08-20 | — | — | US | disclosed |
| US-20200254736-A1 | ADHESIVE ARTICLE | NITTO DENKO CORPORATION (JP) | 2020-08-13 | — | — | US | disclosed |
| US-20200247739-A1 | COMPOUND, RESIN, COMPOSITION, PATTERN FORMATION METHOD, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-08-06 | — | — | US | disclosed |
| EP-3689937-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL AND FIBER-REINFORCED COMPOSITE MATERIAL OBTAINED USING SAME | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2020-08-05 | — | — | EP | disclosed |
| EP-3689991-A1 | ADHESIVE ARTICLE | Nitto Denko Corporation (JP) | 2020-08-05 | — | — | EP | disclosed |
| EP-3689990-A1 | ADHESIVE ARTICLE | Nitto Denko Corporation (JP) | 2020-08-05 | — | — | EP | disclosed |
| US-20200239625-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL AND FIBER-REINFORCED COMPOSITE MATERIAL OBTAINED USING SAME | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2020-07-30 | — | — | US | disclosed |
| WO-2020149193-A1 | CURABLE COMPOSITION AND CURED MATERIAL | コスモ石油ルブリカンツ株式会社 | 2020-07-23 | — | — | WO | disclosed |
| US-20200216595-A1 | POLYMER, GRAFT POLYMER, AND THERMOPLASTIC RESIN COMPOSITION | TECHNO-UMG CO., LTD. (JP) | 2020-07-09 | — | — | US | disclosed |
| WO-2020137953-A1 | METHOD FOR PREPARING ADHESIVE AGENT COMPOSITION, METHOD FOR MANUFACTURING PROTECTIVE SHEET, AND METHOD FOR MANUFACTURING GLASS UNIT | 日東電工株式会社 | 2020-07-02 | — | — | WO | disclosed |
| WO-2020137954-A1 | PROTECTIVE SHEET | 日東電工株式会社 | 2020-07-02 | — | — | WO | disclosed |
| WO-2020137956-A1 | PROTECTIVE SHEET | 日東電工株式会社 | 2020-07-02 | — | — | WO | disclosed |
| WO-2020137955-A1 | ADHESIVE SHEET | 日東電工株式会社 | 2020-07-02 | — | — | WO | disclosed |
| US-20200209775-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2020-07-02 | — | — | US | disclosed |
| US-20200207897-A1 | STYRENE RESIN AND METHOD FOR PRODUCING STYRENE RESIN | JSP CORPORATION (JP) | 2020-07-02 | — | — | US | disclosed |
| EP-3674801-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2020-07-01 | — | — | EP | disclosed |
| WO-2020132519-A1 | ARTICLE COMPRISING A WATER-BASED TOP-COAT | HONEYWELL INTERNATIONAL INC. (US) | 2020-06-25 | — | — | WO | disclosed |
| EP-3666846-A1 | ADHESIVE LAYER, NEAR-INFRARED ABSORPTION FILM, LAMINATED STRUCTURE, LAMINATE, ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING SAME | Sumitomo Metal Mining Co., Ltd. (JP) | 2020-06-17 | — | — | EP | disclosed |
| WO-2020116101-A1 | ADHESIVE COMPOSITION AND ADHESIVE SHEET | 昭和電工株式会社 | 2020-06-11 | — | — | WO | disclosed |
| US-20200181307-A1 | RUBBERY POLYMER, GRAFT COPOLYMER, AND THERMOPLASTIC RESIN COMPOSITION | TECHNO-UMG CO., LTD. (JP) | 2020-06-11 | — | — | US | disclosed |
| EP-3660062-A1 | RUBBER-LIKE POLYMER, GRAFT COPOLYMER, AND THERMOPLASTIC RESIN COMPOSITION | Techno-UMG Co., Ltd. (JP) | 2020-06-03 | — | — | EP | disclosed |
| US-20200165370-A1 | RUBBERY POLYMER, GRAFT COPOLYMER, AND THERMOPLASTIC RESIN COMPOSITION | TECHNO-UMG CO., LTD. (JP) | 2020-05-28 | — | — | US | disclosed |
| US-20200166844-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-05-28 | — | — | US | disclosed |
| EP-3656806-A1 | SHEET MOLDING COMPOUND, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL | Mitsubishi Chemical Corporation (JP) | 2020-05-27 | — | — | EP | disclosed |
| US-10662321-B2 | Cyclic olefin copolymer composition and cross-linked product thereof | MITSUI CHEMICALS, INC. (JP) | 2020-05-26 | — | — | US | disclosed |
| US-20200156291-A1 | ANISOTROPIC FILM AND METHOD FOR MANUFACTURING ANISOTROPIC FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-21 | — | — | US | disclosed |
| EP-2841255-B1 | RESIN PRODUCTION METHOD AND RESIN PRODUCTION APPARATUS | CANON KK (JP) | 2020-05-13 | — | — | EP | disclosed |
| EP-3650477-A1 | POLYMER, GRAFT POLYMER, AND THERMOPLASTIC RESIN COMPOSITION | Techno-UMG Co., Ltd. (JP) | 2020-05-13 | — | — | EP | disclosed |
| EP-3650499-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING SHIELDED PACKAGE USING SAME | Tatsuta Electric Wire & Cable Co., Ltd. (JP) | 2020-05-13 | — | — | EP | disclosed |
| US-10647828-B2 | Prepreg and method for producing same | MITSUBISHI CHEMICAL CORPORATION (JP) | 2020-05-12 | — | — | US | disclosed |
| US-10647826-B2 | Curable epoxy resin composition, and fiber-reinforced composite material obtained using same | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2020-05-12 | — | — | US | disclosed |
| US-20200131297-A1 | SHEET MOLDING COMPOUND, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL | MITSUBISHI CHEMICAL CORPORATION (JP) | 2020-04-30 | — | — | US | disclosed |
| US-20200133151-A1 | TONER AND METHOD FOR PRODUCING TONER | CANON KABUSHIKI KAISHA (JP) | 2020-04-30 | — | — | US | disclosed |
| US-20200133152-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2020-04-30 | — | — | US | disclosed |
| US-10636971-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2020-04-28 | — | — | US | disclosed |
| US-20200124999-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2020-04-23 | — | — | US | disclosed |
| EP-3640737-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2020-04-22 | — | — | EP | disclosed |
| EP-3357952-B1 | CURABLE EPOXY RESIN COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL OBTAINED USING SAME | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2020-04-15 | — | — | EP | disclosed |
| US-10619058-B2 | Curable composition | TOAGOSEI CO., LTD. (JP) | 2020-04-14 | — | — | US | disclosed |
| US-20200109233-A1 | CURABLE EPOXY RESIN COMPOSITION, FIBER-REINFORCED COMPOSITE MATERIAL AND MOLDED BODY USING SAME | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2020-04-09 | — | — | US | disclosed |
| WO-2020070806-A1 | RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR COMPONENT | 日立化成株式会社 | 2020-04-09 | — | — | WO | disclosed |
| EP-3048151-B1 | WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORP (JP) | 2020-04-08 | — | — | EP | disclosed |
| US-10611856-B2 | Curable composition | TOAGOSEI CO., LTD. (JP) | 2020-04-07 | — | — | US | disclosed |
| US-20200095474-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR ELECTRONIC DEVICES | NITTO DENKO CORPORATION (JP) | 2020-03-26 | — | — | US | disclosed |
| US-20200095473-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR ELECTRONIC DEVICES | NITTO DENKO CORPORATION (JP) | 2020-03-26 | — | — | US | disclosed |
| EP-3627224-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2020-03-25 | — | — | EP | disclosed |
| US-20200091105-A1 | ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME | DEXERIALS CORPORATION (JP) | 2020-03-19 | — | — | US | disclosed |
| US-20200079954-A1 | HEAT-CURABLE RESIN COMPOSITION, HEAT-CURABLE RESIN FILM AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-03-12 | — | — | US | disclosed |
| US-20200058876-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2020-02-20 | — | — | US | disclosed |
| EP-3239182-B1 | MODIFIED LIQUID DIENE RUBBER, AND RESIN COMPOSITION CONTAINING SAID MODIFIED LIQUID DIENE RUBBER | KURARAY CO (JP) | 2020-02-12 | — | — | EP | disclosed |
| US-20190338138-A1 | SURFACE-TREATED SILICA FILLER, AND RESIN COMPOSITION CONTAINING SURFACE-TREATED SILICA FILLER | NAMICS CORPORATION (JP) | 2019-11-07 | — | — | US | disclosed |
| EP-3564323-A1 | SURFACE-TREATED SILICA FILLER AND RESIN COMPOSITION CONTAINING SURFACE-TREATED SILICA FILLER | Namics Corporation (JP) | 2019-11-06 | — | — | EP | disclosed |
| US-20190330464-A1 | CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 2019-10-31 | — | — | US | disclosed |
| EP-2894190-B1 | PREPREG AND METHOD FOR PRODUCING SAME | MITSUBISHI CHEM CORP (JP) | 2019-10-30 | — | — | EP | disclosed |
| US-10461255-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2019-10-29 | — | — | US | disclosed |
| US-10442922-B2 | Tire | BRIDGESTONE CORPORATION (JP) | 2019-10-15 | — | — | US | disclosed |
| CN-110325501-A | Compound, resin, composition, pattern forming method and purification process | 三菱瓦斯化学株式会社 | 2019-10-11 | — | — | CN | disclosed |
| US-10414834-B2 | Modified liquid diene rubber and resin composition containing modified liquid diene rubber | KURARAY CO., LTD. (JP) | 2019-09-17 | — | — | US | disclosed |
| US-10414908-B2 | Composition for dip molding and dip-molded article | ZEON CORPORATION (JP) | 2019-09-17 | — | — | US | disclosed |
| US-20190278180-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-09-12 | — | — | US | disclosed |
| EP-3527605-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS AND FIBER-REINFORCED COMPOSITE MATERIAL USING SAME | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2019-08-21 | — | — | EP | disclosed |
| CN-110121529-A | Curable epoxy resin composition, fiber-reinforced composite material using same, and molded article | 日铁化学材料株式会社 | 2019-08-13 | — | — | CN | disclosed |
| US-20190240117-A1 | TWO-PACKAGE DENTAL ADHESIVE COMPOSITION | TOKUYAMA DENTAL CORPORATION (JP) | 2019-08-08 | — | — | US | disclosed |
| US-20190233633-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS AND FIBER-REINFORCED COMPOSITE MATERIAL USING SAME | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2019-08-01 | — | — | US | disclosed |
| EP-3517522-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMING METHOD AND CIRCUIT PATTERN FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2019-07-31 | — | — | EP | disclosed |
| US-20190224889-A1 | METHOD OF PRODUCING ANISOTROPIC CONDUCTIVE FILM AND ANISOTROPIC CONDUCTIVE FILM | DEXERIALS CORPORATION (JP) | 2019-07-25 | — | — | US | disclosed |
| EP-3360695-B1 | TIRE | BRIDGESTONE CORP (JP) | 2019-06-26 | — | — | EP | disclosed |
| EP-3501482-A1 | TWO-PACKAGE DENTAL ADHESIVE COMPOSITION | Tokuyama Dental Corporation (JP) | 2019-06-26 | — | — | EP | disclosed |
| US-10329457-B2 | Conductive pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2019-06-25 | — | — | US | disclosed |
| EP-2812406-B1 | HIGH PERFORMANCE WATER-BASED TACKIFIED ACRYLIC PRESSURE SENSITIVE ADHESIVES | HONEYWELL INT INC (US) | 2019-06-19 | — | — | EP | disclosed |
| EP-2957580-B1 | GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOULDED ARTICLE OF SAID RESIN COMPOSITION | UMG ABS LTD (JP) | 2019-06-19 | — | — | EP | disclosed |
| US-20190177568-A1 | AQUEOUS DISPERSION, COATING FILM, AND LAMINATE | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2019-06-13 | — | — | US | disclosed |
| EP-3128540-B1 | THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT | KYOCERA CORP (JP) | 2019-06-12 | — | — | EP | disclosed |
| EP-3020778-B1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION | NITTO DENKO CORP (JP) | 2019-05-29 | — | — | EP | disclosed |
| CN-109803950-A | Compound, resin and composition and corrosion-resisting pattern forming method and circuit pattern forming method | 三菱瓦斯化学株式会社 | 2019-05-24 | — | — | CN | disclosed |
| CN-109790175-A | Compound, resin, composition and corrosion-resisting pattern forming method and pattern forming method | 三菱瓦斯化学株式会社 | 2019-05-21 | — | — | CN | disclosed |
| EP-2626374-B1 | DIENE-BASED CARBOXYLATE ANION AND SALT THEREOF, AND POLYMERIZABLE OR CURABLE COMPOSITION THEREOF | NIPPON CATALYTIC CHEM IND (JP) | 2019-05-15 | — | — | EP | disclosed |
| CN-109715591-A | Compound, resin, composition and corrosion-resisting pattern forming method and circuit pattern forming method | 三菱瓦斯化学株式会社 | 2019-05-03 | — | — | CN | disclosed |
| US-20190127594-A1 | ARTICLE COMPRISING A WATER-BASED TOP-COAT | HONEYWELL INTERNATIONAL INC. (US) | 2019-05-02 | — | — | US | disclosed |
| US-10272598-B2 | Method of producing anisotropic conductive film and anisotropic conductive film | DEXERIALS CORPORATION (JP) | 2019-04-30 | — | — | US | disclosed |
| US-10266733-B2 | Optically clear hot melt adhesives and uses thereof | Henkel IP & Holding GmbH (DE) | 2019-04-23 | — | — | US | disclosed |
| EP-2213275-B1 | CURABLE COMPOSITION FOR DENTAL APPLICATIONS | TOKUYAMA DENTAL CORP (JP) | 2019-04-10 | — | — | EP | disclosed |
| EP-3255097-B1 | TIRE | BRIDGESTONE CORP (JP) | 2019-04-03 | — | — | EP | disclosed |
| US-20190096844-A1 | ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF | DEXERIALS CORPORATION (JP) | 2019-03-28 | — | — | US | disclosed |
| EP-3456780-A1 | AQUEOUS DISPERSION, COATING FILM, AND LAMINATE | Sumitomo Chemical Company Limited (JP) | 2019-03-20 | — | — | EP | disclosed |
| EP-3456792-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2019-03-20 | — | — | EP | disclosed |
| CN-109475470-A | Dual liquid type gear division adhesive composition | 德山齿科株式会社 | 2019-03-15 | — | — | CN | disclosed |
| CN-107001490-B | Modified liquid diene series rubber and resin combination comprising the modified liquid diene series rubber | 株式会社可乐丽 | 2019-03-12 | — | — | CN | disclosed |
| US-20190074444-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2019-03-07 | — | — | US | disclosed |
| US-20190055369-A1 | CURABLE EPOXY RESIN COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL OBTAINED USING SAME | NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) | 2019-02-21 | — | — | US | disclosed |
| EP-2698247-B1 | RUBBER/METAL LAMINATE | UNIMATEC CO LTD (JP) | 2019-02-13 | — | — | EP | disclosed |
| US-20190031929-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2019-01-31 | — | — | US | disclosed |
| EP-3434746-A1 | PRIMER FOR SOLAR CELL MODULE AND SOLAR CELL MODULE | Kabushiki Kaisha Toyota Jidoshokki (JP) | 2019-01-30 | — | — | EP | disclosed |
| US-20190025699-A1 | FILM-FORMING MATERIAL FOR RESIST PROCESS AND PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2019-01-24 | — | — | US | disclosed |
| US-20190016932-A1 | LAMINATE | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2019-01-17 | — | — | US | disclosed |
| EP-3425001-A1 | CYCLIC OLEFIN COPOLYMER COMPOSITION AND CROSSLINKED PRODUCT THEREOF | Mitsui Chemicals, Inc. (JP) | 2019-01-09 | — | — | EP | disclosed |
| US-10167416-B2 | High performance water-based adhesion compositions and applications | HONEYWELL INTERNATIONAL INC. (US) | 2019-01-01 | — | — | US | disclosed |
| US-10160891-B2 | High performance water-based tackified acrylic pressure sensitive adhesives | HONEYWELL INTERNATIONAL INC. (US) | 2018-12-25 | — | — | US | disclosed |
| CN-109071913-A | AQUEOUS DISPERSION, COATING FILM, AND LAMINATE | 住友化学株式会社 | 2018-12-21 | — | — | CN | disclosed |
| EP-3406641-A1 | RUBBERY POLYMERS, GRAFT COPOLYMERS, AND THERMOPLASTIC RESIN COMPOSITIONS | UMG ABS, Ltd. (JP) | 2018-11-28 | — | — | EP | disclosed |
| US-10141532-B2 | Curable encapsulants and use thereof | Henkel IP & Holding GmbH (DE) | 2018-11-27 | — | — | US | disclosed |
| US-10128462-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2018-11-13 | — | — | US | disclosed |
| US-20180312693-A1 | GRAFT COPOLYMER, CROSSLINKED PARTICLES, GRAFT CROSSLINKED PARTICLES, RUBBERY POLYMER, AND THERMOPLASTIC RESIN COMPOSITION USING SAME | TECHNO-UMG CO., LTD. (JP) | 2018-11-01 | — | — | US | disclosed |
| CN-105683325-B | Surface protective plate and the water-dispersible type adhesive composition of surface protective plate | 日东电工株式会社 | 2018-10-26 | — | — | CN | disclosed |
| US-20180305593-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2018-10-25 | — | — | US | disclosed |
| CN-108699343-A | Curable composition for producing resin sheet providing tough cured product | 东亚合成株式会社 | 2018-10-23 | — | — | CN | disclosed |
| US-20180281329-A1 | TIRE | BRIDGESTONE CORPORATION (JP) | 2018-10-04 | — | — | US | disclosed |
| US-20180250983-A1 | TIRE | BRIDGESTONE CORPORATION (JP) | 2018-09-06 | — | — | US | disclosed |
| EP-3369735-A1 | GLYCOLURILS HAVING FUNCTIONAL GROUP AND USE THEREOF | Shikoku Chemicals Corporation (JP) | 2018-09-05 | — | — | EP | disclosed |
| EP-3369755-A1 | GRAFT COPOLYMER, CROSSLINKED PARTICLES, GRAFT CROSSLINKED PARTICLES, RUBBERY POLYMER AND THERMOPLASTIC RESIN COMPOSITION USING SAME | UMG ABS, Ltd. (JP) | 2018-09-05 | — | — | EP | disclosed |
| US-10059083-B2 | Method of manufacturing resin impregnated material, composite material and copper-clad laminate | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2018-08-28 | — | — | US | disclosed |
| US-20180237629-A1 | CURABLE COMPOSITION | TOAGOSEI CO., LTD. (JP) | 2018-08-23 | — | — | US | disclosed |
| EP-3363875-A1 | ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND JOINED BODY | Nitto Denko Corporation (JP) | 2018-08-22 | — | — | EP | disclosed |
| US-10054866-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2018-08-21 | — | — | US | disclosed |
| EP-3357952-A1 | CURABLE EPOXY RESIN COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL OBTAINED USING SAME | Nippon Steel & Sumikin Chemical Co., Ltd. (JP) | 2018-08-08 | — | — | EP | disclosed |
| US-20180208803-A1 | ADHESIVE LAYER, NEAR-INFRARED SHIELDING FILM, LAMINATED STRUCTURE, STACKED BODY AND ADHESIVE AGENT COMPOSITION | SUMITOMO METAL MINING CO., LTD. (JP) | 2018-07-26 | — | — | US | disclosed |
| US-20180208799-A1 | CURABLE AND OPTICALLY CLEAR PRESSURE SENSITIVE ADHESIVE AND USES THEREOF | HENKEL AG & CO. KGAA (DE) | 2018-07-26 | — | — | US | disclosed |
| EP-3345964-A1 | TIRE | Bridgestone Corporation (JP) | 2018-07-11 | — | — | EP | disclosed |
| US-20180187026-A1 | CURABLE COMPOSITION | TOAGOSEI CO., LTD. (JP) | 2018-07-05 | — | — | US | disclosed |
| US-20180171038-A1 | CURABLE COMPOSITION | TOAGOSEI CO., LTD. (JP) | 2018-06-21 | — | — | US | disclosed |
| US-10000622-B2 | Glycolurils having functional groups and use thereof | SHIKOKU CHEMICALS CORPORATION (JP) | 2018-06-19 | — | — | US | disclosed |
| US-9993997-B2 | Laminate and process for producing same | MITSUBISHI CABLE INDUSTRIES, LTD. (JP) | 2018-06-12 | — | — | US | disclosed |
| CN-104877589-B | Electroconductive pressure-sensitive adhesive tape and the display device with electroconductive pressure-sensitive adhesive tape | 日东电工株式会社 | 2018-06-12 | — | — | CN | disclosed |
| EP-2450415-B1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORP (JP) | 2018-06-06 | — | — | EP | disclosed |
| CN-105378015-B | Bonding sheet and its application | 日东电工株式会社 | 2018-05-15 | — | — | CN | disclosed |
| CN-108026429-A | Curable and optically transparent contact adhesive and application thereof | 汉高知识产权控股有限责任公司 | 2018-05-11 | — | — | CN | disclosed |
| US-9958801-B2 | Toner and production method thereof | CANON KABUSHIKI KAISHA (JP) | 2018-05-01 | — | — | US | disclosed |
| US-20180086025-A1 | METHOD OF MANUFACTURING RESIN IMPREGNATED MATERIAL, COMPOSITE MATERIAL AND COPPER-CLAD LAMINATE | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| US-20180086946-A1 | CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2018-03-29 | — | — | US | disclosed |
| US-20180066163-A1 | MAGNETIC DISC DRIVE, HELIUM GAS FILLED CONTAINER, AND APPARATUS | NITTO DENKO CORPORATION (JP) | 2018-03-08 | — | — | US | disclosed |
| US-9896606-B2 | Pressure-sensitive adhesive sheet and use thereof | NITTO DENKO CORPORATION (JP) | 2018-02-20 | — | — | US | disclosed |
| EP-3275922-A1 | METHOD OF MANUFACTURING RESIN IMPREGNATED MATERIAL, COMPOSITE MATERIAL AND COPPER-CLAD LAMINATE | Tatsuta Electric Wire & Cable Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| US-20180026191-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2018-01-25 | — | — | US | disclosed |
| US-20180022835-A1 | MODIFIED LIQUID DIENE RUBBER AND RESIN COMPOSITION CONTAINING MODIFIED LIQUID DIENE RUBBER | KURARAY CO., LTD. (JP) | 2018-01-25 | — | — | US | disclosed |
| CN-105378018-B | Adhesive composition | 日东电工株式会社 | 2018-01-23 | — | — | CN | disclosed |
| US-20180016427-A1 | TIRE | BRIDGESTONE CORPORATION (JP) | 2018-01-18 | — | — | US | disclosed |
| US-9851650-B2 | Toner and method for producing toner | CANON KABUSHIKI KAISHA (JP) | 2017-12-26 | — | — | US | disclosed |
| US-9837572-B2 | Solar cell module and method of manufacturing thereof | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-12-05 | — | — | US | disclosed |
| US-9835964-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2017-12-05 | — | — | US | disclosed |
| US-20170342243-A1 | DIP-FORMED ARTICLE | ZEON CORPORATION (JP) | 2017-11-30 | — | — | US | disclosed |
| US-9828677-B2 | Article and process for selective etching | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE (US) | 2017-11-28 | — | — | US | disclosed |
| US-9829816-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2017-11-28 | — | — | US | disclosed |
| US-9809882-B2 | Article and process for selective deposition | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE (US) | 2017-11-07 | — | — | US | disclosed |
| EP-3239217-A1 | DIP-MOLDED PRODUCT | Zeon Corporation (JP) | 2017-11-01 | — | — | EP | disclosed |
| EP-3026065-B1 | MODIFIED LIQUID DIENE-BASED RUBBER AND PRODUCTION PROCESS FOR THE SAME | KURARAY CO (JP) | 2017-11-01 | — | — | EP | disclosed |
| EP-3239182-A1 | MODIFIED LIQUID DIENE RUBBER, AND RESIN COMPOSITION CONTAINING SAID MODIFIED LIQUID DIENE RUBBER | Kuraray Co., Ltd. (JP) | 2017-11-01 | — | — | EP | disclosed |
| US-9806261-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-10-31 | — | — | US | disclosed |
| CN-107275511-A | Curable encapsulant and application thereof | 汉高知识产权控股有限责任公司 | 2017-10-20 | — | — | CN | disclosed |
| US-20170299972-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2017-10-19 | — | — | US | disclosed |
| CN-107207643-A | Resin sheet manufacture curing composition | 东亚合成株式会社 | 2017-09-26 | — | — | CN | disclosed |
| US-9766566-B2 | Toner and method for producing the same | CANON KABUSHIKI KAISHA (JP) | 2017-09-19 | — | — | US | disclosed |
| US-9755207-B2 | Pressure-sensitive adhesive tape for battery and battery using the pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2017-09-05 | — | — | US | disclosed |
| US-9745406-B2 | Curable composition | CEMEDINE CO., LTD. (JP) | 2017-08-29 | — | — | US | disclosed |
| US-20170244058-A1 | CURABLE ENCAPSULANTS AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2017-08-24 | — | — | US | disclosed |
| CN-107001490-A | Modified liquid diene series rubber and the resin combination for including the modified liquid diene series rubber | 株式会社可乐丽 | 2017-08-01 | — | — | CN | disclosed |
| EP-2906972-B1 | OPTICAL MEMBER COMPRISING A LAMINATED BODY WITH POLYMER LAYER CONTAINING A MALEIMIDE COPOLYMER AND METHOD FOR MANUFACTURING THE SAME | CANON KK (JP) | 2017-07-05 | — | — | EP | disclosed |
| CN-106916542-A | Sheet adhesive and sheet adhesive applying method | 日东电工株式会社 | 2017-07-04 | — | — | CN | disclosed |
| CN-106905867-A | Sheet adhesive and sheet adhesive applying method | 日东电工株式会社 | 2017-06-30 | — | — | CN | disclosed |
| CN-106905868-A | Sheet adhesive | 日东电工株式会社 | 2017-06-30 | — | — | CN | disclosed |
| US-20170176644-A1 | OPTICAL MEMBER AND METHOD FOR MANUFACTURING THE SAME | CANON KABUSHIKI KAISHA (JP) | 2017-06-22 | — | — | US | disclosed |
| CN-103045114-B | Double-faced adhesive tape | 日东电工株式会社 | 2017-06-20 | — | — | CN | disclosed |
| CN-104584257-B | Curable encapsulants and uses thereof | 汉高知识产权控股有限责任公司 | 2017-06-20 | — | — | CN | disclosed |
| US-9676928-B2 | Curable encapsulants and use thereof | Henkel IP & Holding GmbH (DE) | 2017-06-13 | — | — | US | disclosed |
| US-9673345-B2 | Composition for solar cell sealing film, method for producing same and solar cell sealing film | BRIDGESTONE CORPORATION (JP) | 2017-06-06 | — | — | US | disclosed |
| EP-2962843-B1 | LAMINATE AND PROCESS FOR PRODUCING SAME | MITSUBISHI CABLE IND LTD (JP) | 2017-05-31 | — | — | EP | disclosed |
| US-20170145267-A1 | OPTICALLY CLEAR HOT MELT ADHESIVES AND USES THEREOF | HENKEL AG & CO. KGAA (DE) | 2017-05-25 | — | — | US | disclosed |
| US-9657169-B2 | Graft copolymer, thermoplastic resin composition, and molded article of said resin composition | UMG ABS, LTD. (JP) | 2017-05-23 | — | — | US | disclosed |
| US-9658549-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2017-05-23 | — | — | US | disclosed |
| US-20170130035-A1 | WAVELENGTH CONVERSION MATERIAL AND SOLAR CELL SEALING FILM CONTAINING THE SAME | BRIDGESTONE CORPORATION (JP) | 2017-05-11 | — | — | US | disclosed |
| US-9647270-B2 | Binder for lithium ion secondary battery electrode, production method for lithium ion secondary battery electrode, lithium ion secondary battery electrode, and lithium ion secondary battery | THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD. (JP) | 2017-05-09 | — | — | US | disclosed |
| US-20170121597-A1 | WAVELENGTH CONVERSION MATERIAL AND SOLAR CELL SEALING FILM CONTAINING THE SAME | BRIDGESTONE CORPORATION (JP) | 2017-05-04 | — | — | US | disclosed |
| US-20170102347-A1 | BIOCHEMICAL TEST CHIP | APEX BIOTECHNOLOGY CORP. (TW) | 2017-04-13 | — | — | US | disclosed |
| EP-3153857-A1 | BIOCHEMICAL TEST CHIP | Apex Biotechnology Corporation (TW) | 2017-04-12 | — | — | EP | disclosed |
| US-20170098548-A9 | ARTICLE AND PROCESS FOR SELECTIVE ETCHING | GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE, THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | 2017-04-06 | — | — | US | disclosed |
| US-20170088700-A1 | COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE | ZEON CORPORATION (JP) | 2017-03-30 | — | — | US | disclosed |
| US-9605189-B2 | Pressure-sensitive adhesive composition | NITTO DENKO CORPORATION (JP) | 2017-03-28 | — | — | US | disclosed |
| US-20170084868-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-03-23 | — | — | US | disclosed |
| US-20170080697-A1 | ADHESIVE SHEET AND ADHESIVE-SHEET APPLICATION METHOD | NITTO DENKO CORPORATION (JP) | 2017-03-23 | — | — | US | disclosed |
| US-20170080698-A1 | ADHESIVE SHEET AND ADHESIVE-SHEET APPLICATION METHOD | NITTO DENKO CORPORATION (JP) | 2017-03-23 | — | — | US | disclosed |
| US-20170080677-A1 | ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2017-03-23 | — | — | US | disclosed |
| US-9599919-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2017-03-21 | — | — | US | disclosed |
| US-9598507-B2 | Modified liquid diene-based rubber and production process for the same | KURARAY CO., LTD. (JP) | 2017-03-21 | — | — | US | disclosed |
| US-9580809-B2 | Article with gradient property and processes for selective etching | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE (US) | 2017-02-28 | — | — | US | disclosed |
| US-9585247-B2 | Anisotropic conductive film and method of producing the same | DEXERIALS CORPORATION (JP) | 2017-02-28 | — | — | US | disclosed |
| EP-3131859-A1 | HIGH PERFORMANCE WATER-BASED ADHESION COMPOSITIONS AND APPLICATIONS | Honeywell International Inc. (US) | 2017-02-22 | — | — | EP | disclosed |
| CN-106459329-A | Curable composition | 东亚合成株式会社 | 2017-02-22 | — | — | CN | disclosed |
| US-9570707-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-02-14 | — | — | US | disclosed |
| EP-2365031-B1 | THERMOPLASTIC ELASTOMER COMPOSITION | ASAHI CHEMICAL IND (JP) | 2017-02-08 | — | — | EP | disclosed |
| EP-3128540-A1 | THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT | KYOCERA Corporation (JP) | 2017-02-08 | — | — | EP | disclosed |
| EP-3124535-A1 | COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE | Zeon Corporation (JP) | 2017-02-01 | — | — | EP | disclosed |
| US-20170025374-A1 | THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND ELECTRICAL/ELECTRONIC COMPONENT | KYOCERA CORPORATION (JP) | 2017-01-26 | — | — | US | disclosed |
| EP-3121219-A1 | PREPREG ROLL | Mitsubishi Rayon Co. Ltd. (JP) | 2017-01-25 | — | — | EP | disclosed |
| US-9549879-B2 | Powder-liquid dental curable material kit | TOKUYAMA DENTAL CORPORATION (JP) | 2017-01-24 | — | — | US | disclosed |
| EP-2808906-B1 | SEALING FILM FOR SOLAR CELLS, AND SOLAR CELL USING SAME | BRIDGESTONE CORP (JP) | 2017-01-11 | — | — | EP | disclosed |
| US-20170005214-A1 | SOLAR CELL SEALING FILM, AND SOLAR CELL MODULE USING THE SAME | BRIDGESTONE CORPORATION (JP) | 2017-01-05 | — | — | US | disclosed |
| CN-103992526-B | Padded coaming bridging property rubber composition and use its padded coaming | 日本华尔卡工业株式会社 | 2017-01-04 | — | — | CN | disclosed |
| US-20160376470-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET AND USE THEREOF | NITTO DENKO CORPORATION (JP) | 2016-12-29 | — | — | US | disclosed |
| EP-2003701-B1 | SEALING FILM FOR SOLAR CELL AND SOLAR CELL USING SUCH SEALING FILM | BRIDGESTONE CORP (JP) | 2016-12-21 | — | — | EP | disclosed |
| EP-2412756-B1 | CURABLE COMPOSITION | CEMEDINE CO LTD (JP) | 2016-12-21 | — | — | EP | disclosed |
| WO-2016200335-A1 | MOULDED ARTICLE FROM POLYPROPYLENE COMPOSITION | THE POLYOLEFIN COMPANY (SINGAPORE) PTE LTD (SG) | 2016-12-15 | — | — | WO | disclosed |
| US-20160362563-A1 | FIRE AND SMOLDERING RESISTANT ARTICLE | GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE, THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | 2016-12-15 | — | — | US | disclosed |
| US-20160349640-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2016-12-01 | — | — | US | disclosed |
| US-20160349649-A1 | TONER AND METHOD FOR PRODUCING THE SAME | CANON KABUSHIKI KAISHA (JP) | 2016-12-01 | — | — | US | disclosed |
| US-9506149-B2 | Liquid deposition composition and process for forming metal therefrom | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE (US) | 2016-11-29 | — | — | US | disclosed |
| EP-2108685-B1 | Pressure-sensitive adhesive sheet and production method thereof | NITTO DENKO CORP (JP) | 2016-11-23 | — | — | EP | disclosed |
| CN-106154779-A | Toner and production method thereof | 佳能株式会社 | 2016-11-23 | — | — | CN | disclosed |
| CN-104081540-B | Sealing films for solar cell and the solaode using it | 株式会社普利司通 | 2016-11-23 | — | — | CN | disclosed |
| US-9499466-B2 | Diene-based carboxylate anion and salt thereof, and polymerizable or curable composition thereof | NIPPON SHOKUBAI CO., LTD. (JP) | 2016-11-22 | — | — | US | disclosed |
| US-9500972-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2016-11-22 | — | — | US | disclosed |
| US-20160334727-A1 | TONER AND PRODUCTION METHOD THEREOF | CANON KABUSHIKI KAISHA (JP) | 2016-11-17 | — | — | US | disclosed |
| US-20160327882-A1 | TONER AND METHOD FOR PRODUCING TONER | CANON KABUSHIKI KAISHA (JP) | 2016-11-10 | — | — | US | disclosed |
| CN-104592913-B | The preparation method of acrylic adhesives, binding agent and application thereof | 日东电工（上海松江）有限公司 | 2016-11-02 | — | — | CN | disclosed |
| CN-106062131-A | Sealing film for solar cell, and solar cell using same | 日立化成株式会社 | 2016-10-26 | — | — | CN | disclosed |
| US-9475229-B2 | Resin production method and resin production apparatus | CANON KABUSHIKI KAISHA (JP) | 2016-10-25 | — | — | US | disclosed |
| US-20160297951-A1 | GLYCOLURILS HAVING FUNCTIONAL GROUPS AND USE THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2016-10-13 | — | — | US | disclosed |
| US-20160300971-A1 | FLUORESCENT MATERIAL FOR CONVERTING WAVELENGTHS, RESIN COMPOSITION FOR CONVERTING WAVELENGTHS CONTAINING THE FLUORESCENT MATERIAL, SOLAR CELL MODULE PRODUCED USING THE FLUORESCENT MATERIAL OR THE RESIN COMPOSITION, PROCESS FOR PRODUCING RESIN COMPOSITION FOR CONVERTING WAVELENGTHS, AND PROCESS FOR PRODUCING SOLAR CELL MODULE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-10-13 | — | — | US | disclosed |
| EP-2033942-B1 | COMPOSITION FOR FORMING INTERLAYER FOR LAMINATED GLASS, INTERLAYER FOR LAMINATED GLASS, AND LAMINATED GLASS | BRIDGESTONE CORP (JP) | 2016-10-12 | — | — | EP | disclosed |
| EP-3075735-A1 | GLYCOLURILS HAVING FUNCTIONAL GROUP AND USE THEREOF | Shikoku Chemicals Corporation (JP) | 2016-10-05 | — | — | EP | disclosed |
| US-20160280967-A1 | SURFACE PROTECTION SHEET | NITTO DENKO CORPORATION (JP) | 2016-09-29 | — | — | US | disclosed |
| US-20160264825-A1 | SURFACE PROTECTION SHEET AND WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR SURFACE PROTECTION SHEET | NITTO DENKO CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| EP-2492320-B1 | CURABLE COATING AGENT COMPOSITION | TOYOTA JIDOSHOKKI KK (JP) | 2016-09-14 | — | — | EP | disclosed |
| US-20160257863-A1 | BONDED MEMBER AND METHOD FOR PRODUCING THE SAME | ALPS ELECTRIC CO., LTD. | 2016-09-08 | — | — | US | disclosed |
| EP-3064559-A1 | SURFACE-PROTECTING SHEET | Nitto Denko Corporation (JP) | 2016-09-07 | — | — | EP | disclosed |
| EP-2770541-B1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING SAME | BRIDGESTONE CORP (JP) | 2016-09-07 | — | — | EP | disclosed |
| EP-3064562-A1 | SURFACE-PROTECTING SHEET, AND WATER-DISPERSED ADHESIVE AGENT COMPOSITION FOR SURFACE-PROTECTING SHEET | Nitto Denko Corporation (JP) | 2016-09-07 | — | — | EP | disclosed |
| US-9428667-B2 | Member for vehicle and manufacturing process for the same | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2016-08-30 | — | — | US | disclosed |
| EP-2439783-B1 | SEALING FILM FOR SOLAR CELL, AND SOLAR CELL UTILIZING SAME | BRIDGESTONE CORP (JP) | 2016-08-24 | — | — | EP | disclosed |
| CN-103237865-B | Spherical phosphor, sealing material for wavelength conversion type solar cell, solar cell module, and methods for producing same | 日立化成株式会社 | 2016-08-24 | — | — | CN | disclosed |
| US-20160238164-A1 | ACRYLIC RUBBER COMPOSITION FOR HEAT-RESISTANT HOSE AND HEAT-RESISTANT HOSE USING THE SAME | SUMITOMO RIKO COMPANY LIMITED (JP) | 2016-08-18 | — | — | US | disclosed |
| US-20160229927-A1 | MODIFIED LIQUID DIENE-BASED RUBBER AND PRODUCTION PROCESS FOR THE SAME | KURARAY CO., LTD. (JP) | 2016-08-11 | — | — | US | disclosed |
| EP-2725627-B1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM | BRIDGESTONE CORP (JP) | 2016-08-10 | — | — | EP | disclosed |
| US-20160222255-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR MOBILE ELECTRONIC DEVICES | NITTO DENKO CORPORATION (JP) | 2016-08-04 | — | — | US | disclosed |
| CN-103102820-B | Pressure-sensitive adhesive sheet | 日东电工株式会社 | 2016-08-03 | — | — | CN | disclosed |
| US-9403990-B2 | Curing-type coating-agent composition | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2016-08-02 | — | — | US | disclosed |
| US-20160215180-A1 | WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2016-07-28 | — | — | US | disclosed |
| EP-3048151-A1 | WATER-DISPERSIBLE ADHESIVE COMPOSITION AND ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2016-07-27 | — | — | EP | disclosed |
| EP-2537893-B1 | SEALING FILM FOR PHOTOVOLTAIC MODULES AND PHOTOVOLTAIC MODULES USING SAME | BRIDGESTONE CORP (JP) | 2016-07-13 | — | — | EP | disclosed |
| EP-2153699-B1 | ORGANIC ELECTRONIC DEVICES PROTECTED BY ELASTOMERIC LAMINATING ADHESIVE | HENKEL AG & CO KGAA (DE) | 2016-07-13 | — | — | EP | disclosed |
| US-9383668-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2016-07-05 | — | — | US | disclosed |
| US-20160181617-A1 | BINDER FOR LITHIUM ION SECONDARY BATTERY ELECTRODE, PRODUCTION METHOD FOR LITHIUM ION SECONDARY BATTERY ELECTRODE, LITHIUM ION SECONDARY BATTERY ELECTRODE, AND LITHIUM ION SECONDARY BATTERY | THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD. (JP) | 2016-06-23 | — | — | US | disclosed |
| EP-2685508-B1 | SEALING FILM FOR SOLAR CELLS AND SOLAR CELL USING SAME | BRIDGESTONE CORP (JP) | 2016-06-22 | — | — | EP | disclosed |
| CN-105705603-A | Surface-protecting sheet | 日东电工株式会社 | 2016-06-22 | — | — | CN | disclosed |
| CN-105683325-A | Surface-protecting sheet, and water-dispersed adhesive agent composition for surface-protecting sheet | 日东电工株式会社 | 2016-06-15 | — | — | CN | disclosed |
| US-20160160096-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION | NITTO DENKO CORPORATION (JP) | 2016-06-09 | — | — | US | disclosed |
| CN-105647410-A | Surface protective film, method for manufacturing surface protective film and optical member | 日东电工株式会社 | 2016-06-08 | — | — | CN | disclosed |
| CN-103119701-B | Liquid resin composition and semiconductor device | 住友电木株式会社 | 2016-06-08 | — | — | CN | disclosed |
| US-9359521-B2 | Member for vehicle and manufacturing process for the same | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2016-06-07 | — | — | US | disclosed |
| US-20160152873-A1 | SHEET FOR FORMING LAMINATE, AND METHOD FOR PRODUCING LAMINATE | BRIDGESTONE CORPORATION (JP) | 2016-06-02 | — | — | US | disclosed |
| US-20160155717-A1 | ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR | DEXERIALS CORPORATION (JP) | 2016-06-02 | — | — | US | disclosed |
| EP-3026065-A1 | MODIFIED LIQUID DIENE RUBBER AND PRODUCTION METHOD FOR SAME | Kuraray Co., Ltd. (JP) | 2016-06-01 | — | — | EP | disclosed |
| EP-3023469-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2016-05-25 | — | — | EP | disclosed |
| US-20160137884-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2016-05-19 | — | — | US | disclosed |
| EP-3020778-A1 | ADHESIVE-AGENT COMPOSITION | Nitto Denko Corporation (JP) | 2016-05-18 | — | — | EP | disclosed |
| EP-3020776-A1 | ADHESIVE SHEET AND USE THEREOF | Nitto Denko Corporation (JP) | 2016-05-18 | — | — | EP | disclosed |
| EP-2656831-B1 | CURABLE DENTAL COMPOSITION | KURARAY NORITAKE DENTAL INC (JP) | 2016-05-11 | — | — | EP | disclosed |
| US-20160121576-A1 | ELECTROCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE CUSHIONING | NITTO DENKO CORPORATION (JP) | 2016-05-05 | — | — | US | disclosed |
| EP-3015522-A1 | SHEET FOR FORMING LAMINATE, AND METHOD FOR PRODUCING LAMINATE | Bridgestone Corporation (JP) | 2016-05-04 | — | — | EP | disclosed |
| CN-105555898-A | Water-dispersible adhesive composition and adhesive sheet | NITTO DENKO CORP | 2016-05-04 | — | — | CN | disclosed |
| CN-105555891-A | Adhesive sheet for portable electronic devices | NITTO DENKO CORP | 2016-05-04 | — | — | CN | disclosed |
| EP-3007235-A1 | COMPOSITION FOR SEALING FILMS FOR SOLAR CELLS, METHOD FOR PRODUCING SAME, AND SEALING FILM FOR SOLAR CELLS | Bridgestone Corporation (JP) | 2016-04-13 | — | — | EP | disclosed |
| US-20160087130-A1 | COMPOSITION FOR SOLAR CELL SEALING FILM, METHOD FOR PRODUCING SAME AND SOLAR CELL SEALING FILM | BRIDGESTONE CORPORATION (JP) | 2016-03-24 | — | — | US | disclosed |
| CN-105431291-A | Laminate and process for producing same | MITSUBIHI CABLE IND LTD | 2016-03-23 | — | — | CN | disclosed |
| US-9293616-B2 | Solar cell sealing film and solar cell using the same | BRIDGESTONE CORPORATION (JP) | 2016-03-22 | — | — | US | disclosed |
| US-9287429-B2 | Solar cell sealing film and solar cell using the same | BRIDGESTONE CORPORATION (JP) | 2016-03-15 | — | — | US | disclosed |
| CN-105378015-A | Adhesive sheet and use thereof | NITTO DENKO CORP | 2016-03-02 | — | — | CN | disclosed |
| CN-105378018-A | Adhesive composition | NITTO DENKO CORP | 2016-03-02 | — | — | CN | disclosed |
| US-20160052238-A1 | BONDED MEMBER AND METHOD FOR PRODUCING THE SAME | ALPS ELECTRIC CO., LTD. (JP) | 2016-02-25 | — | — | US | disclosed |
| CN-103154052-B | Diene carboxylate anion, salt thereof, and polymerization or curing composition thereof | NIPPON SHOKUBAI CO.,LTD. (JP) | 2016-02-24 | — | — | CN | disclosed |
| US-9257673-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2016-02-09 | — | — | US | disclosed |
| US-20160001523-A1 | LAMINATE AND PROCESS FOR PRODUCING SAME | MITSUBISHI CABLE INDUSTRIES, LTD. (JP) | 2016-01-07 | — | — | US | disclosed |
| US-20160005901-A1 | METHOD FOR MANUFACTURING SOLAR CELL MODULE AND SOLAR CELL MODULE | BRIDGESTONE CORPORATION (JP) | 2016-01-07 | — | — | US | disclosed |
| EP-2962843-A1 | LAMINATE AND PROCESS FOR PRODUCING SAME | Mitsubishi Cable Industries, Ltd. (JP) | 2016-01-06 | — | — | EP | disclosed |
| EP-2963690-A1 | SOLAR CELL MODULE MANUFACTURING METHOD AND SOLAR CELL MODULE | Bridgestone Corporation (JP) | 2016-01-06 | — | — | EP | disclosed |
| US-20150376395-A1 | GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE OF SAID RESIN COMPOSITION | UMG ABS, LTD. (JP) | 2015-12-31 | — | — | US | disclosed |
| US-20150376477-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL COMPONENT, AND TOUCH PANEL | NITTO DENKO CORPORATION (JP) | 2015-12-31 | — | — | US | disclosed |
| CN-105199616-A | Heat-curable adhesive sheet and flexible printed circuit substrate | NITTO DENKO CORP | 2015-12-30 | — | — | CN | disclosed |
| US-20150370189-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2015-12-24 | — | — | US | disclosed |
| US-20150368435-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SAME, AND HIGHLY THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE | TOKUYAMA CORPORATION (JP) | 2015-12-24 | — | — | US | disclosed |
| EP-2957601-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SAME, AND HIGHLY THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE | Tokuyama Corporation (JP) | 2015-12-23 | — | — | EP | disclosed |
| EP-2957580-A1 | GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOULDED ARTICLE OF SAID RESIN COMPOSITION | UMG ABS, Ltd. (JP) | 2015-12-23 | — | — | EP | disclosed |
| US-20150357601-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | YOULCHON CHEMICAL CO., LTD. (KR) | 2015-12-10 | — | — | US | disclosed |
| US-9206278-B2 | Cyclic olefin copolymer and crosslinked polymer thereof | MITSUI CHEMICALS, INC. (JP) | 2015-12-08 | — | — | US | disclosed |
| US-20150316691-A1 | OPTICAL MEMBER AND METHOD FOR MANUFACTURING THE SAME | CANON KABUSHIKI KAISHA (JP) | 2015-11-05 | — | — | US | disclosed |
| EP-2390273-B1 | DUAL-CURE CURABLE MATERIAL KIT | TOKUYAMA DENTAL CORP (JP) | 2015-11-04 | — | — | EP | disclosed |
| US-9175194-B2 | Acrylic pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2015-11-03 | — | — | US | disclosed |
| US-20150303339-A1 | PAIR OF SEALING FILMS FOR SOLAR CELL AND METHOD FOR PRODUCING SOLAR CELL MODULE USING SAME | BRIDGESTONE CORPORATION (JP) | 2015-10-22 | — | — | US | disclosed |
| WO-2015160939-A1 | HIGH PERFORMANCE WATER-BASED ADHESION COMPOSITIONS AND APPLICATIONS | HONEYWELL INTERNATIONAL INC. (US) | 2015-10-22 | — | — | WO | disclosed |
| US-20150291859-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTROCHEMICAL DEVICE | NITTO DENKO CORPORATION (JP) | 2015-10-15 | — | — | US | disclosed |
| US-20150280037-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL MODULE USING THE SAME | BRIDGESTONE CORPORATION (JP) | 2015-10-01 | — | — | US | disclosed |
| US-20150271918-A1 | ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME | DEXERIALS CORPORATION (JP) | 2015-09-24 | — | — | US | disclosed |
| US-20150267012-A1 | CURED SHEET, LAMINATE HAVING THE SAME AND PROCESS FOR MANUFACTURING THE LAMINATE | BRIDGESTONE CORPORATION (JP) | 2015-09-24 | — | — | US | disclosed |
| US-20150252160-A1 | PREPREG AND METHOD FOR PRODUCING SAME | MITSUBISHI RAYON CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |
| US-9125802-B2 | Dental curable composition | KURARAY NORITAKE DENTAL INC. (JP) | 2015-09-08 | — | — | US | disclosed |
| US-9123836-B2 | Solar cell sealing film and solar cell using the same | BRIDGESTONE CORPORATION (JP) | 2015-09-01 | — | — | US | disclosed |
| EP-2910615-A1 | CURED SHEET, LAMINATE BODY USING SAME, AND METHOD FOR PRODUCING SAID LAMINATE BODY | Bridgestone Corporation (JP) | 2015-08-26 | — | — | EP | disclosed |
| US-20150231803-A1 | METHOD OF PRODUCING ANISOTROPIC CONDUCTIVE FILM AND ANISOTROPIC CONDUCTIVE FILM | DEXERIALS CORPORATION (JP) | 2015-08-20 | — | — | US | disclosed |
| EP-2056356-B1 | COMPOSITION FOR SOLAR CELL SEALING FILM, SOLAR CELL SEALING FILM, AND SOLAR CELL USING THE SEALING FILM | BRIDGESTONE CORP (JP) | 2015-08-19 | — | — | EP | disclosed |
| US-9112180-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2015-08-18 | — | — | US | disclosed |
| EP-2905815-A1 | SEALING FILM FOR SOLAR CELLS AND SOLAR CELL USING SAME | Bridgestone Corporation (JP) | 2015-08-12 | — | — | EP | disclosed |
| US-20150218426-A1 | HIGH PERFORMANCE WATER-BASED ADHESION COMPOSITIONS AND APPLICATIONS | SOLSTICE ADVANCED MATERIALS US, INC. | 2015-08-06 | — | — | US | disclosed |
| US-9096748-B2 | Thermoplastic elastomer composition and molded products using the same | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2015-08-04 | — | — | US | disclosed |
| US-20150214176-A1 | ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME | DEXERIALS CORPORATION (JP) | 2015-07-30 | — | — | US | disclosed |
| US-9090812-B2 | Self-inhibited swell packer compound | BAKER HUGHES INCORPORATED (US) | 2015-07-28 | — | — | US | disclosed |
| EP-2894190-A1 | PREPREG AND METHOD FOR PRODUCING SAME | Mitsubishi Rayon Co., Ltd. (JP) | 2015-07-15 | — | — | EP | disclosed |
| CN-104774570-A | Double-faced bonding piece | NITTO DENKO CORP | 2015-07-15 | — | — | CN | disclosed |
| US-20150191825-A1 | LIQUID DEPOSITION COMPOSITION AND PROCESS FOR FORMING METAL THEREFROM | GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE, THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | 2015-07-09 | — | — | US | disclosed |
| EP-2892080-A1 | PAIR OF SEALING FILMS FOR SOLAR CELL AND METHOD FOR MANUFACTURING SOLAR CELL MODULE USING SAME | Bridgestone Corporation (JP) | 2015-07-08 | — | — | EP | disclosed |
| CN-103154047-B | Cyclic olefin copolymer and crosslinked product thereof | MITSUI CHEMICALS INC | 2015-07-08 | — | — | CN | disclosed |
| US-20150179852-A1 | SEALING FILM FOR SOLAR CELLS, SOLAR CELL MODULE, AND METHOD FOR SELECTING SEALING FILM FOR SOLAR CELLS | BRIDGESTONE CORPORATION (JP) | 2015-06-25 | — | — | US | disclosed |
| US-9065150-B2 | Electrolyte material, and battery material and secondary battery using said electrolyte material | NIPPON SHOKUBAI CO., LTD. (JP) | 2015-06-23 | — | — | US | disclosed |
| US-20150153666-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2015-06-04 | — | — | US | disclosed |
| US-20150153667-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2015-06-04 | — | — | US | disclosed |
| US-20150153669-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2015-06-04 | — | — | US | disclosed |
| US-20150153668-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2015-06-04 | — | — | US | disclosed |
| EP-2879192-A1 | SEALING FILM FOR SOLAR CELLS, SOLAR CELL MODULE, AND METHOD FOR SELECTING SEALING FILM FOR SOLAR CELLS | Bridgestone Corporation (JP) | 2015-06-03 | — | — | EP | disclosed |
| US-20150147885-A1 | ARTICLE AND PROCESS FOR SELECTIVE ETCHING | NAT INST OF STANDARDS & TECH (US) | 2015-05-28 | — | — | US | disclosed |
| CN-104650758-A | Double-sided adhesive sheet | NITTO DENKO CORP | 2015-05-27 | — | — | CN | disclosed |
| CN-104650757-A | Double-sided adhesive sheet | NITTO DENKO CORP | 2015-05-27 | — | — | CN | disclosed |
| US-20150140227-A1 | RESIN PRODUCTION METHOD AND RESIN PRODUCTION APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2015-05-21 | — | — | US | disclosed |
| US-9034973-B2 | Composition for forming intermediate film for laminated glass, intermediate film for laminated glass and laminated glass | BRIDGESTONE CORPORATION (JP) | 2015-05-19 | — | — | US | disclosed |
| US-20150123249-A1 | ARTICLE WITH GRADIENT PROPERTY AND PROCESSES FOR SELECTIVE ETCHING | GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE, THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | 2015-05-07 | — | — | US | disclosed |
| US-20150126031-A1 | ARTICLE AND PROCESS FOR SELECTIVE DEPOSITION | GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE, THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | 2015-05-07 | — | — | US | disclosed |
| CN-104584257-A | Curable encapsulants and uses thereof | Henkel US IP LLC | 2015-04-29 | — | — | CN | disclosed |
| US-8993652-B2 | Dual-cure curable material kit | TOKUYAMA DENTAL CORPORATION (JP) | 2015-03-31 | — | — | US | disclosed |
| EP-2093268-B1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORP (JP) | 2015-03-25 | — | — | EP | disclosed |
| US-20150069376-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO LTD (KR) | 2015-03-12 | — | — | US | disclosed |
| US-20150060889-A1 | SEMICONDUCTOR DEVICE, DIE ATTACH MATERIAL, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE SINGAPORE PTE. LTD. (SG) | 2015-03-05 | — | — | US | disclosed |
| US-20150056757-A1 | CURABLE ENCAPSULANTS AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2015-02-26 | — | — | US | disclosed |
| EP-2468793-B1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIALS, MOLDINGS OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF | DAINIPPON INK & CHEMICALS (JP) | 2015-02-25 | — | — | EP | disclosed |
| US-8962986-B2 | Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-02-24 | — | — | US | disclosed |
| US-20150047703-A1 | INORGANIC PHOSPHOR-CONTAINING POLYMER PARTICLES, METHOD FOR PRODUCING INORGANIC PHOSPHOR-CONTAINING POLYMER PARTICLES, AND PHOTOVOLTAIC CELL MODULE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-02-19 | — | — | US | disclosed |
| EP-2838126-A1 | SEMICONDUCTOR DEVICE, DIE ATTACH MATERIAL, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company Limited (JP) | 2015-02-18 | — | — | EP | disclosed |
| US-20150044477-A1 | MEMBER FOR VEHICLE AND MANUFACTURING PROCESS FOR THE SAME | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2015-02-12 | — | — | US | disclosed |
| US-20150038646-A1 | COMPOSITION FOR PRODUCING SHEET FOR FORMING LAMINATE, PROCESS FOR PRODUCING THE SAME, AND SHEET FOR FORMING LAMINATE | BRIDGESTONE CORPORATION (JP) | 2015-02-05 | — | — | US | disclosed |
| US-20150038614-A1 | POWDER-LIQUID DENTAL CURABLE MATERIAL KIT | TOKUYAMA DENTAL CORPORATION (JP) | 2015-02-05 | — | — | US | disclosed |
| US-8940808-B2 | Curable coating agent composition | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2015-01-27 | — | — | US | disclosed |
| EP-2826794-A1 | INORGANIC PHOSPHOR-CONTAINING POLYMER PARTICLES, METHOD FOR PRODUCING INORGANIC PHOSPHOR-CONTAINING POLYMER PARTICLES, AND SOLAR CELL MODULE | Hitachi Chemical Company, Ltd. (JP) | 2015-01-21 | — | — | EP | disclosed |
| EP-2823802-A1 | POWDER-LIQUID DENTAL CURABLE MATERIAL KIT | Tokuyama Dental Corporation (JP) | 2015-01-14 | — | — | EP | disclosed |
| US-20150007888-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SAME | BRIDGESTONE CORPORATION (JP) | 2015-01-08 | — | — | US | disclosed |
| EP-2218724-B1 | EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIAL, AND FINE PATTERN FORMING METHOD USING THE COMPOSITION | SHOWA DENKO KK (JP) | 2015-01-07 | — | — | EP | disclosed |
| CN-104271696-A | High performance water-based tackified acrylic pressure sensitive adhesives | HONEYWELL INT INC | 2015-01-07 | — | — | CN | disclosed |
| EP-2818486-A1 | Water-Dispersed Pressure-Sensitive Adhesive Composition and Method for Producing Same | NITTO DENKO CORPORATION (JP) | 2014-12-31 | — | — | EP | disclosed |
| CN-104231966-A | Manufacturing method for double-surface bonding sheet | NITTO DENKO CORP | 2014-12-24 | — | — | CN | disclosed |
| US-8916042-B2 | Upgrading heavy oil and bitumen with an initiator | BAKER HUGHES INCORPORATED (US) | 2014-12-23 | — | — | US | disclosed |
| US-20140366945-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SAME | BRIDGESTONE CORPORATION (JP) | 2014-12-18 | — | — | US | disclosed |
| EP-2812406-A1 | HIGH PERFORMANCE WATER-BASED TACKIFIED ACRYLIC PRESSURE SENSITIVE ADHESIVES | Honeywell International Inc. (US) | 2014-12-17 | — | — | EP | disclosed |
| CN-102924326-B | Liquid crystalline compound, liquid crystalline composition, optical film, and optical laminate | ZEON CORP | 2014-12-17 | — | — | CN | disclosed |
| US-8906989-B2 | Pressure-sensitive adhesive layer and pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2014-12-09 | — | — | US | disclosed |
| EP-2808360-A1 | COMPOSITION FOR PRODUCING SHEET FOR FORMING LAMINATE, PROCESS FOR PRODUCING SAME, AND SHEET FOR FORMING LAMINATE | Bridgestone Corporation (JP) | 2014-12-03 | — | — | EP | disclosed |
| EP-2808907-A1 | SEALING FILM FOR SOLAR CELLS, AND SOLAR CELL USING SAME | Bridgestone Corporation (JP) | 2014-12-03 | — | — | EP | disclosed |
| EP-2808906-A1 | SEALING FILM FOR SOLAR CELLS, AND SOLAR CELL USING SAME | Bridgestone Corporation (JP) | 2014-12-03 | — | — | EP | disclosed |
| US-8900712-B2 | Member for vehicle and manufacturing process for the same | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2014-12-02 | — | — | US | disclosed |
| CN-104159987-A | Adhesive tape | NITTO DENKO CORP | 2014-11-19 | — | — | CN | disclosed |
| US-8883938-B2 | Resin composition for fiber-reinforced composite material, cured product thereof, fiber-reinforced composite material, molding of fiber-reinforced resin, and process for production thereof | DIC CORPORATION (JP) | 2014-11-11 | — | — | US | disclosed |
| EP-2433916-B1 | ETHYLENE-UNSATURATED ESTER COPOLYMER FILM FOR FORMING LAMINATE | BRIDGESTONE CORP (JP) | 2014-11-05 | — | — | EP | disclosed |
| US-8871825-B2 | Polypropylene resin composition, method for producing the same, and foam molded article | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2014-10-28 | — | — | US | disclosed |
| US-20140311571-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SAME | BRIDGESTONE CORPORATION (JP) | 2014-10-23 | — | — | US | disclosed |
| US-8860165-B2 | Wavelength conversion-type photovoltaic cell sealing material and photovoltaic cell module using the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-10-14 | — | — | US | disclosed |
| US-8853312-B2 | Resin composition and semiconductor device produced by using the same | SUMITOMO BAKELITE CO., LTD (JP) | 2014-10-07 | — | — | US | disclosed |
| US-20140295182-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTROCHEMICAL DEVICE | NITTO DENKO CORPORATION (JP) | 2014-10-02 | — | — | US | disclosed |
| US-20140296401-A1 | PRESSURE-SENSITIVE ADHESIVE LAYER AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2014-10-02 | — | — | US | disclosed |
| EP-2784140-A1 | Pressure-sensitive adhesive tape for electrochemical device | NITTO DENKO CORPORATION (JP) | 2014-10-01 | — | — | EP | disclosed |
| CN-104073195-A | Pressure-sensitive adhesive layer and pressure-sensitive adhesive sheet | NITTO DENKO CORP | 2014-10-01 | — | — | CN | disclosed |
| US-8846813-B2 | Optical pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2014-09-30 | — | — | US | disclosed |
| US-20140287543-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-09-25 | — | — | US | disclosed |
| US-20140284306-A1 | METHOD FOR MANUFACTURING POROUS STRUCTURE AND METHOD FOR FORMING PATTERN | KABUSHIKI KAISHA TOSHIBA (JP) | 2014-09-25 | — | — | US | disclosed |
| EP-2398066-B1 | ENCAPSULATION FILM FOR SOLAR CELL MODULE AND SOLAR CELL MODULE USING ENCAPSULATION FILM | BRIDGESTONE CORP (JP) | 2014-09-24 | — | — | EP | disclosed |
| US-20140256877-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2014-09-11 | — | — | US | disclosed |
| US-8829772-B2 | Organic light emitting diode display with heat dissipating adhesive | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-09-09 | — | — | US | disclosed |
| US-20140242395-A1 | MEMBER FOR VEHICLE AND MANUFACTURING PROCESS FOR THE SAME | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2014-08-28 | — | — | US | disclosed |
| EP-2770541-A1 | SEALING FILM FOR SOLAR CELLS, AND SOLAR CELL USING SAME | Bridgestone Corporation (JP) | 2014-08-27 | — | — | EP | disclosed |
| CN-103992526-A | Buffer material cross-linked rubber composition and buffer material using same | NIHON VALQUA KOGYO KK | 2014-08-20 | — | — | CN | disclosed |
| US-20140227502-A1 | PRESSURE-SENSITIVE ADHESIVE LAYER FOR OPTICAL USE, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL COMPONENT AND TOUCH PANEL | NITTO DENKO CORPORATION (JP) | 2014-08-14 | — | — | US | disclosed |
| US-20140226085-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL COMPONENT AND TOUCH PANEL | NITTO DENKO CORPORATION (JP) | 2014-08-14 | — | — | US | disclosed |
| US-20140228468-A1 | CURING-TYPE COATING-AGENT COMPOSITION | TOAGOSEI CO., LTD. (JP) | 2014-08-14 | — | — | US | disclosed |
| US-8786186-B2 | Organic light emitting diode display with adhesive layer | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-07-22 | — | — | US | disclosed |
| US-8778201-B2 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2014-07-15 | — | — | US | disclosed |
| US-8765837-B2 | Dental curable composition | TOKUYAMA DENTAL CORPORATION (JP) | 2014-07-01 | — | — | US | disclosed |
| CN-103890967-A | Sealing film for solar cell and solar cell using same | BRIDGESTONE CORP | 2014-06-25 | — | — | CN | disclosed |
| US-8754178-B2 | Resin composition and semiconductor device produced using resin composition | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-06-17 | — | — | US | disclosed |
| US-8749076-B2 | Resin paste composition | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-06-10 | — | — | US | disclosed |
| EP-2426152-B1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN PARTICLES AND METHOD FOR PRODUCING SAME | DAI ICHI KOGYO SEIYAKU CO LTD (JP) | 2014-06-04 | — | — | EP | disclosed |
| US-20140144481-A1 | SOLAR CELL MODULE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-05-29 | — | — | US | disclosed |
| US-8722768-B2 | Liquid resin composition and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-05-13 | — | — | US | disclosed |
| US-8722799-B2 | Thermoplastic elastomer composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2014-05-13 | — | — | US | disclosed |
| US-8716360-B2 | Curing-type coating-agent composition | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20140116499-A1 | PROCESS FOR MANUFACTURING SOLAR CELL MODULES | BRIDGESTONE CORPORATION (JP) | 2014-05-01 | — | — | US | disclosed |
| EP-2725627-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM | Bridgestone Corporation (JP) | 2014-04-30 | — | — | EP | disclosed |
| EP-1736520-B1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME | SUMITOMO BAKELITE CO (JP) | 2014-04-30 | — | — | EP | disclosed |
| EP-2720278-A1 | SOLAR CELL MODULE MANUFACTURING METHOD | Bridgestone Corporation (JP) | 2014-04-16 | — | — | EP | disclosed |
| EP-2711402-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSTIVE ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2014-03-26 | — | — | EP | disclosed |
| US-8679625-B2 | Solar cell sealing film and solar cell using the sealing film | BRIDGESTONE CORPORATION (JP) | 2014-03-25 | — | — | US | disclosed |
| CN-103649259-A | Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet | NITTO DENKO CORP | 2014-03-19 | — | — | CN | disclosed |
| US-20140066557-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2014-03-06 | — | — | US | disclosed |
| EP-2492023-B1 | VEHICLE MEMBER AND PROCESS FOR PRODUCING THE SAME | TOYOTA JIDOSHOKKI KK (JP) | 2014-03-05 | — | — | EP | disclosed |
| EP-2698247-A1 | RUBBER/METAL LAMINATE | Unimatec Co., Ltd. (JP) | 2014-02-19 | — | — | EP | disclosed |
| US-20140044975-A1 | RUBBER METAL LAMINATE | UNIMATEC CO., LTD (JP) | 2014-02-13 | — | — | US | disclosed |
| US-8647800-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2014-02-11 | — | — | US | disclosed |
| US-8642178-B2 | Vehicle member and process for producing the same | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2014-02-04 | — | — | US | disclosed |
| US-8637225-B2 | Magnetic recording medium and magnetic recording/reproducing apparatus | SHOWA DENKO K.K. (JP) | 2014-01-28 | — | — | US | disclosed |
| EP-2684930-A1 | WATER-DISPERSIBLE ADHESIVE COMPOSITION AND ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2014-01-15 | — | — | EP | disclosed |
| EP-2685508-A1 | SEALING FILM FOR SOLAR CELLS AND SOLAR CELL USING SAME | Bridgestone Corporation (JP) | 2014-01-15 | — | — | EP | disclosed |
| EP-2684929-A1 | AQUEOUS DISPERSION ADHESIVE COMPOSITION AND ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2014-01-15 | — | — | EP | disclosed |
| US-20140004343-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2014-01-02 | — | — | US | disclosed |
| US-20130344328-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-12-26 | — | — | US | disclosed |
| US-20130340828-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SAME | BRIDGESTONE CORPORATION (JP) | 2013-12-26 | — | — | US | disclosed |
| US-20130340813-A1 | SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-12-26 | — | — | US | disclosed |
| US-20130344327-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-12-26 | — | — | US | disclosed |
| US-20130344288-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-12-26 | — | — | US | disclosed |
| US-8614270-B2 | Resin composition and semiconductor device produced by using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2013-12-24 | — | — | US | disclosed |
| US-20130334100-A1 | UPGRADING HEAVY OIL AND BITUMEN WITH AN INITIATOR | BAKER HUGHES INCORPORATED (US) | 2013-12-19 | — | — | US | disclosed |
| US-20130333744-A1 | CONDUCTIVE BINDER COMPOSITION, METAL WIRE WITH CONDUCTIVE BINDER, BONDED UNIT, AND SOLAR CELL MODULE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-12-19 | — | — | US | disclosed |
| US-8609225-B2 | Ethylene-unsaturated ester copolymer film for forming laminate | BRIDGESTONE CORPORATION (JP) | 2013-12-17 | — | — | US | disclosed |
| US-20130328149-A1 | WAVELENGTH CONVERSION-TYPE PHOTOVOLTAIC CELL SEALING MATERIAL AND PHOTOVOLTAIC CELL MODULE USING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-12-12 | — | — | US | disclosed |
| EP-2671925-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Co., Ltd. (JP) | 2013-12-11 | — | — | EP | disclosed |
| EP-2546053-B1 | Double-sided pressure-sensitive adhesive sheet | NITTO DENKO CORP (JP) | 2013-12-11 | — | — | EP | disclosed |
| US-8604150-B2 | Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition | SHOWA DENKO K.K. (JP) | 2013-12-10 | — | — | US | disclosed |
| US-20130323498-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-12-05 | — | — | US | disclosed |
| US-20130319499-A1 | CONDUCTIVE BINDER COMPOSITION AND METHOD FOR PRODUCING THE SAME, BONDED UNIT, AND SOLAR CELL MODULE AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-12-05 | — | — | US | disclosed |
| EP-2669345-A1 | Pressure-Sensitive Adhesive Composition and Pressure-Sensitive Adhesive Sheet | NITTO DENKO CORPORATION (JP) | 2013-12-04 | — | — | EP | disclosed |
| EP-2669348-A1 | CONDUCTIVE BINDER COMPOSITION, METAL WIRE WITH CONDUCTIVE BINDER, BONDED UNIT, AND SOLAR CELL MODULE | Hitachi Chemical Company, Ltd. (JP) | 2013-12-04 | — | — | EP | disclosed |
| EP-2669346-A1 | CONDUCTIVE BINDER COMPOSITION AND METHOD FOR PRODUCING THE SAME, BONDED UNIT, AND SOLAR CELL MODULE AND METHOD FOR PRODUCING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2013-12-04 | — | — | EP | disclosed |
| EP-2669955-A1 | SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF | Hitachi Chemical Company, Ltd. (JP) | 2013-12-04 | — | — | EP | disclosed |
| US-20130307195-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION | SHOWA DENKO K.K. (JP) | 2013-11-21 | — | — | US | disclosed |
| US-8586186-B2 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2013-11-19 | — | — | US | disclosed |
| US-20130292652-A1 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG DISPLAY CO., LTD. (KR) | 2013-11-07 | — | — | US | disclosed |
| US-20130289210-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-10-31 | — | — | US | disclosed |
| US-20130289166-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-10-31 | — | — | US | disclosed |
| EP-2656831-A1 | CURABLE DENTAL COMPOSITION | Kuraray Noritake Dental Inc. (JP) | 2013-10-30 | — | — | EP | disclosed |
| EP-2657287-A1 | COMPOSITION | Sumitomo Chemical Company, Limited (JP) | 2013-10-30 | — | — | EP | disclosed |
| US-20130281576-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF | DAINIPPON INK & CHEMICALS (JP) | 2013-10-24 | — | — | US | disclosed |
| US-20130280527-A1 | SURFACE PROTECTION FILM | NITTO DENKO CORPORATION (JP) | 2013-10-24 | — | — | US | disclosed |
| US-20130274426-A1 | DENTAL CURABLE COMPOSITION | KURARAY NORITAKE DENTAL INC. (JP) | 2013-10-17 | — | — | US | disclosed |
| EP-2650342-A1 | SPHERICAL PHOSPHOR, SEALING MATERIAL FOR WAVELENGTH-CONVERSION-TYPE SOLAR BATTERIES, SOLAR BATTERY MODULE, AND PROCESS FOR MANUFACTURE OF THOSE | Hitachi Chemical Company, Ltd. (JP) | 2013-10-16 | — | — | EP | disclosed |
| US-20130266806-A1 | COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2013-10-10 | — | — | US | disclosed |
| EP-2647686-A2 | Resin Composition And Semiconductor Device Produced By Using The Same | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-10-09 | — | — | EP | disclosed |
| US-8551615-B2 | Pressure sensitive adhesive composition, product using the same, and display using the product | NITTO DENKO CORPORATION (JP) | 2013-10-08 | — | — | US | disclosed |
| US-20130255778-A1 | SPHERICAL PHOSPHOR, WAVELENGTH CONVERSION-TYPE PHOTOVOLTAIC CELL SEALING MATERIAL, PHOTOVOLTAIC CELL MODULE, AND PRODUCTION METHODS THEREOF | HITACHI CHEMICAL COMPANY, LTD. | 2013-10-03 | — | — | US | disclosed |
| CN-103339206-A | Resin composition and semiconductor device | SUMITOMO BAKELITE CO | 2013-10-02 | — | — | CN | disclosed |
| US-20130252163-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2013-09-26 | — | — | US | disclosed |
| EP-1542273-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2013-09-25 | — | — | EP | disclosed |
| US-8535789-B2 | Bonded member and process for producing the same | ALPS ELECTRIC CO., LTD. (JP) | 2013-09-17 | — | — | US | disclosed |
| EP-2169024-B1 | Pressure-sensitive adhesive sheet for optical member adhesion | NITTO DENKO CORP (JP) | 2013-08-28 | — | — | EP | disclosed |
| EP-2629336-A1 | SOLAR CELL MODULE | Hitachi Chemical Company, Ltd. (JP) | 2013-08-21 | — | — | EP | disclosed |
| WO-2013119404-A1 | HIGH PERFORMANCE WATER-BASED TACKIFIED ACRYLIC PRESSURE SENSITIVE ADHESIVES | HONEYWELL INTERNATIONAL INC. (US) | 2013-08-15 | — | — | WO | disclosed |
| EP-2626374-A1 | DIENE-BASED CARBOXYLATE ANION AND SALT THEREOF, AND POLYMERIZABLE OR CURABLE COMPOSITION THEREOF | Nippon Shokubai Co., Ltd. (JP) | 2013-08-14 | — | — | EP | disclosed |
| US-20130203941-A1 | ACRYLIC PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2013-08-08 | — | — | US | disclosed |
| US-20130202885-A1 | HIGH PERFORMANCE WATER-BASED TACKIFIED ACRYLIC PRESSURE SENSITIVE ADHESIVES | HONEYWELL INTERNATIONAL INC. (US) | 2013-08-08 | — | — | US | disclosed |
| EP-2624287-A1 | LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Co., Ltd. (JP) | 2013-08-07 | — | — | EP | disclosed |
| CN-103237865-A | Spherical phosphor, sealing material for wavelength conversion type solar cell, solar cell module, and methods for producing same | HITACHI CHEMICAL CO LTD | 2013-08-07 | — | — | CN | disclosed |
| US-20130196142-A1 | DOUBLE-FACED PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-08-01 | — | — | US | disclosed |
| US-20130197123-A1 | DIENE-BASED CARBOXYLATE ANION AND SALT THEREOF, AND POLYMERIZABLE OR CURABLE COMPOSITION THEREOF | NIPPON SHOKUBAI CO., LTD. (JP) | 2013-08-01 | — | — | US | disclosed |
| US-20130189507-A1 | DOUBLE-FACED PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-07-25 | — | — | US | disclosed |
| US-8487531-B2 | Encapsulation sheet, flat panel display device using the same, and method of manufacturing the flat panel display device | SAMSUNG DISPLAY CO., LTD. (KR) | 2013-07-16 | — | — | US | disclosed |
| US-8487052-B2 | Resin composition for fiber-reinforced composite material, cured product thereof, fiber-reinforced composite material, molding of fiber-reinforced resin, and process for production thereof | DIC CORPORATION (JP) | 2013-07-16 | — | — | US | disclosed |
| US-8486524-B2 | Double-sided pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2013-07-16 | — | — | US | disclosed |
| US-20130178575-A1 | CYCLIC OLEFIN COPOLYMER AND CROSSLINKED POLYMER THEREOF | MITSUI CHEMICALS, INC. (JP) | 2013-07-11 | — | — | US | disclosed |
| CN-103180965-A | Solar cell module | HITACHI CHEMICAL CO LTD | 2013-06-26 | — | — | CN | disclosed |
| US-20130156946-A1 | PRESSURE-SENSITIVE ADHESIVE PRODUCT | NITTO DENKO CORPORATION (JP) | 2013-06-20 | — | — | US | disclosed |
| US-20130157051-A1 | COMPOSITION, LAMINATED STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2013-06-20 | — | — | US | disclosed |
| US-20130158188-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED USING RESIN COMPOSITION | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-06-20 | — | — | US | disclosed |
| EP-2314650-B1 | Electroconductive pressure-sensitive adhesive tape with separator | NITTO DENKO CORP (JP) | 2013-06-19 | — | — | EP | disclosed |
| WO-2013085648-A1 | SELF-INHIBITED SWELL PACKER COMPOUND | BAKER HUGHES INCORPORATED (US) | 2013-06-13 | — | — | WO | disclosed |
| US-20130146312-A1 | SELF-INHIBITED SWELL PACKER COMPOUND | BAKER HUGHES INCORPORATED (US) | 2013-06-13 | — | — | US | disclosed |
| CN-103154052-A | Diene carboxylate anion, salt thereof, and polymerization or curing composition thereof | NIPPON CATALYTIC CHEM IND | 2013-06-12 | — | — | CN | disclosed |
| CN-103154047-A | Cyclic olefin copolymer and crosslinked product thereof | MITSUI CHEMICALS INC | 2013-06-12 | — | — | CN | disclosed |
| US-8460787-B2 | Sealing film for solar cell | BRIDGESTONE CORPORATION (JP) | 2013-06-11 | — | — | US | disclosed |
| US-20130143983-A1 | LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-06-06 | — | — | US | disclosed |
| US-20130142982-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-06-06 | — | — | US | disclosed |
| CN-103131343-A | Adhesive tape, carrier tape connecting thin film, carrier tape connecting method and connected carrier tape | NITTO DENKO CORP | 2013-06-05 | — | — | CN | disclosed |
| US-8449075-B2 | Ink jet recording head | CANON KABUSHIKI KAISHA (JP) | 2013-05-28 | — | — | US | disclosed |
| US-20130125985-A1 | WAVELENGTH CONVERSION TYPE PHOTOVOLTAIC CELL SEALING MATERIAL AND PHOTOVOLTAIC CELL MODULE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-05-23 | — | — | US | disclosed |
| US-20130123451-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-05-16 | — | — | US | disclosed |
| EP-2592113-A1 | COMPOSITION, LAMINATED STRUCTURE, AND LAMINATED STRUCTURE PRODUCTION METHOD | Sumitomo Chemical Company, Limited (JP) | 2013-05-15 | — | — | EP | disclosed |
| CN-103102820-A | Pressure-sensitive adhesive sheet | NITTO DENKO CORP | 2013-05-15 | — | — | CN | disclosed |
| US-8440382-B2 | Method of producing toner | CANON KABUSHIKI KAISHA (JP) | 2013-05-14 | — | — | US | disclosed |
| US-20130113121-A1 | RESIN PASTE COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-05-09 | — | — | US | disclosed |
| US-20130115450-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR OPTICAL MEMBER ADHESION | NITTO DENKO CORPORATION (JP) | 2013-05-09 | — | — | US | disclosed |
| EP-2105483-B1 | Light-shielding pressure-sensitive adhesive sheet | NITTO DENKO CORP (JP) | 2013-05-08 | — | — | EP | disclosed |
| US-8435416-B2 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2013-05-07 | — | — | US | disclosed |
| US-20130109798-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-05-02 | — | — | US | disclosed |
| CN-103080160-A | Resin composition, and semiconductor device produced using resin composition | SUMITOMO BAKELITE CO | 2013-05-01 | — | — | CN | disclosed |
| US-20130098494-A1 | RUBBER COMPOSITION FOR WATER HOSE, AND WATER HOSE OBTAINED USING SAME | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2013-04-25 | — | — | US | disclosed |
| US-8425990-B2 | Liquid crystalline compound, liquid crystalline composition, optical film, and optical laminate | ZEON CORPORATION (JP) | 2013-04-23 | — | — | US | disclosed |
| US-8421247-B2 | Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-04-16 | — | — | US | disclosed |
| EP-2579329-A1 | WAVELENGTH CONVERSION-TYPE SOLAR CELL SEALING MATERIAL, AND SOLAR CELL MODULE | Hitachi Chemical Company, Ltd. (JP) | 2013-04-10 | — | — | EP | disclosed |
| EP-2308936-B1 | Insulating tape | NITTO DENKO CORP (JP) | 2013-04-03 | — | — | EP | disclosed |
| CN-103012961-A | Resin composition, method for producing the same, and molded article using the same | SUMITOMO CHEMICAL CO | 2013-04-03 | — | — | CN | disclosed |
| US-20130074928-A1 | WAVELENGTH CONVERSION TYPE PHOTOVOLTAIC CELL SEALING SHEET AND PHOTOVOLTAIC CELL MODULE | MITSUBISHI ELECTRIC CORPORATION | 2013-03-28 | — | — | US | disclosed |
| US-20130079470-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND MOLDED ARTICLE USING THE SAME | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2013-03-28 | — | — | US | disclosed |
| US-20130080116-A1 | WAVELENGTH-CONVERTING RESIN COMPOSITION FOR PHOTOVOLTAIC CELL AND PHOTOVOLTAIC CELL MODULE | Hitachi Chemical Company ,Ltd. (JP) | 2013-03-28 | — | — | US | disclosed |
| EP-2573152-A2 | Pressure-sensitive adhesive tape for battery | Nitto Denko Corporation (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-20130068299-A1 | SPHERICAL PHOSPHOR, WAVELENGTH CONVERSION-TYPE PHOTOVOLTAIC CELL SEALING MATERIAL, PHOTOVOLTAIC CELL MODULE, AND PRODUCTION METHODS THEREFOR | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-03-21 | — | — | US | disclosed |
| US-20130071740-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR BATTERY | NITTO DENKO CORPORATION (JP) | 2013-03-21 | — | — | US | disclosed |
| US-8399091-B2 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2013-03-19 | — | — | US | disclosed |
| US-20130065982-A1 | CURING-TYPE COATING-AGENT COMPOSITION | TOAGOSEI CO., LTD. (JP) | 2013-03-14 | — | — | US | disclosed |
| US-20130065062-A1 | MEMBER FOR VEHICLE AND MANUFACTURING PROCESS FOR THE SAME | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2013-03-14 | — | — | US | disclosed |
| US-8394877-B2 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKA KAISHA TOSHIBA (JP) | 2013-03-12 | — | — | US | disclosed |
| US-8389621-B2 | Thermosetting resin composition for producing color filter for CMOS image sensor, color filter comprising transparent film formed using the composition and CMOS image sensor using the color filter | CHEIL INDUSTRIES INC. (KR) | 2013-03-05 | — | — | US | disclosed |
| CN-102947395-A | Curable coating agent composition | TOYOTA JIDOSHOKKI KK | 2013-02-27 | — | — | CN | disclosed |
| EP-2557137-A1 | SPHERICAL PHOSPHOR, SEALING MATERIAL FOR WAVELENGTH CONVERSION SOLAR BATTERY, SOLAR BATTERY MODULE AND METHOD FOR PRODUCING SAME | Hitachi Chemical Company, Ltd. (JP) | 2013-02-13 | — | — | EP | disclosed |
| EP-2557600-A1 | WAVELENGTH-CONVERTING RESIN COMPOSITION FOR SOLAR CELL, AND SOLAR CELL MODULE | Hitachi Chemical Company, Ltd. (JP) | 2013-02-13 | — | — | EP | disclosed |
| CN-102933646-A | Vehicle member and process for production thereof | TOYOTA JIDOSHOKKI KK | 2013-02-13 | — | — | CN | disclosed |
| CN-102924326-A | Liquid crystalline compound, liquid crystalline composition, optical film, and optical laminate | ZEON CORP | 2013-02-13 | — | — | CN | disclosed |
| EP-2555253-A1 | WAVELENGTH-CONVERTING SOLAR CELL SEALING SHEET, AND SOLAR CELL MODULE | Hitachi Chemical Company, Ltd. (JP) | 2013-02-06 | — | — | EP | disclosed |
| CN-102918654-A | Wavelength conversion type solar cell sealing material and solar cell module | HITACHI CHEMICAL CO LTD | 2013-02-06 | — | — | CN | disclosed |
| CN-101809107-B | Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device | HITACHI CHEMICAL CO LTD | 2013-02-06 | — | — | CN | disclosed |
| US-20130030110-A1 | AQUEOUS-DISPERSION-TYPE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-01-31 | — | — | US | disclosed |
| US-20130023615-A1 | WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-01-24 | — | — | US | disclosed |
| US-20130017389-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-01-17 | — | — | US | disclosed |
| EP-2546053-A1 | Double-sided pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2013-01-16 | — | — | EP | disclosed |
| EP-2465908-B1 | Pressure-sensitive adhesive composition and use thereof | NITTO DENKO CORP (JP) | 2013-01-16 | — | — | EP | disclosed |
| EP-2543709-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE TAPE | Nitto Denko Corporation (JP) | 2013-01-09 | — | — | EP | disclosed |
| US-20130004767-A1 | ELECTROCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2013-01-03 | — | — | US | disclosed |
| US-20130005909-A1 | OPTICAL PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2013-01-03 | — | — | US | disclosed |
| US-20120328864-A1 | OPTICAL DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-12-27 | — | — | US | disclosed |
| US-20120325518-A1 | CONDUCTIVE THERMOSETTING ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2012-12-27 | — | — | US | disclosed |
| US-20120326194-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | SAMSUNG DISPLAY CO., LTD. (KR) | 2012-12-27 | — | — | US | disclosed |
| EP-2537905-A2 | Conductive thermosetting adhesive tape | Nitto Denko Corporation (JP) | 2012-12-26 | — | — | EP | disclosed |
| EP-2537893-A1 | SEALING FILM FOR PHOTOVOLTAIC MODULES AND PHOTOVOLTAIC MODULES USING SAME | Bridgestone Corporation (JP) | 2012-12-26 | — | — | EP | disclosed |
| EP-2537903-A2 | Optical double-sided pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2012-12-26 | — | — | EP | disclosed |
| US-20120313499-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-12-13 | — | — | US | disclosed |
| US-20120313508-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-12-13 | — | — | US | disclosed |
| CN-102822300-A | Water-dispersible adhesive composition and adhesive sheet | NITTO DENKO CORP | 2012-12-12 | — | — | CN | disclosed |
| CN-102822299-A | Aqueous dispersion adhesive composition and adhesive sheet | NITTO DENKO CORP | 2012-12-12 | — | — | CN | disclosed |
| US-20120308815-A1 | ELECTROCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPRATION (JP) | 2012-12-06 | — | — | US | disclosed |
| US-20120309878-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM | BRIDGESTONE CORPORATION (JP) | 2012-12-06 | — | — | US | disclosed |
| EP-2530130-A1 | CONDUCTIVE ADHESIVE TAPE | Nitto Denko Corporation (JP) | 2012-12-05 | — | — | EP | disclosed |
| EP-1190695-B1 | Catalyst for chemical polymerization of dental materials | TOKUYAMA CORP (JP) | 2012-11-14 | — | — | EP | disclosed |
| US-8304034-B2 | One-solution type thermosetting composition for protective film of color filter, and color filter using same | CHEIL INDUSTRIES INC. (KR) | 2012-11-06 | — | — | US | disclosed |
| EP-2518122-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2012-10-31 | — | — | EP | disclosed |
| US-8299156-B2 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2012-10-30 | — | — | US | disclosed |
| US-20120270042-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTROCHEMICAL DEVICE | NITTO DENKO CORPORATION (JP) | 2012-10-25 | — | — | US | disclosed |
| US-20120270036-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTROCHEMICAL DEVICE | NITTO DENKO CORPORATION (JP) | 2012-10-25 | — | — | US | disclosed |
| US-20120270002-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR FLEXIBLE PRINTED CIRCUIT | NITTO DENKO CORPORATION (JP) | 2012-10-25 | — | — | US | disclosed |
| EP-2514793-A1 | Pressure-sensitive adhesive tape for electrochemical device | Nitto Denko Corporation (JP) | 2012-10-24 | — | — | EP | disclosed |
| EP-2514794-A1 | Pressure-sensitive adhesive tape for electrochemical device | Nitto Denko Corporation (JP) | 2012-10-24 | — | — | EP | disclosed |
| EP-1717851-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2012-10-17 | — | — | EP | disclosed |
| US-20120258247-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-10-11 | — | — | US | disclosed |
| US-20120259039-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF | DIC CORPORATION (JP) | 2012-10-11 | — | — | US | disclosed |
| EP-2098545-B1 | COMPOSITION FOR OIL-RESISTANT WEATHER-RESISTANT RUBBER, AND RUBBER MOLDED BODY | JSR CORP (JP) | 2012-10-10 | — | — | EP | disclosed |
| US-20120252930-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF | DIC CORPORATION (JP) | 2012-10-04 | — | — | US | disclosed |
| US-20120244361-A1 | VEHICLE MEMBER AND PROCESS FOR PRODUCING THE SAME | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2012-09-27 | — | — | US | disclosed |
| US-20120244427-A1 | ELECTROLYTE MATERIAL, AND BATTERY MATERIAL AND SECONDARY BATTERY USING SAID ELECTROLYTE MATERIAL | NIPPON SHOKUBAI CO., LTD. (JP) | 2012-09-27 | — | — | US | disclosed |
| EP-2206758-B1 | Pressure-sensitive adhesive sheet with low emission of sulfur-containing volatile components | NITTO DENKO CORP (JP) | 2012-09-26 | — | — | EP | disclosed |
| US-8268929-B2 | Resin composition | RIKEN TECHNOS CORPORATION (JP) | 2012-09-18 | — | — | US | disclosed |
| US-20120231267-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-09-13 | — | — | US | disclosed |
| US-20120227786-A1 | CONDUCTIVE ADHESIVE, SOLAR CELL, METHOD FOR MANUFACTURING SOLAR CELL, AND SOLAR CELL MODULE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-09-13 | — | — | US | disclosed |
| EP-2497804-A1 | Double-sided pressure-sensitive adhesive sheet with polyester-polyurethane containing anchor layer | Nitto Denko Corporation (JP) | 2012-09-12 | — | — | EP | disclosed |
| US-20120225994-A1 | PROPYLENE RESIN COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-09-06 | — | — | US | disclosed |
| US-20120219835-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR BATTERY AND BATTERY USING THE PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2012-08-30 | — | — | US | disclosed |
| EP-2492320-A1 | CURABLE COATING MATERIAL COMPOSITION | Kabushiki Kaisha Toyota Jidoshokki (JP) | 2012-08-29 | — | — | EP | disclosed |
| EP-2492023-A1 | VEHICLE MEMBER AND PROCESS FOR PRODUCTION THEREOF | Kabushiki Kaisha Toyota Jidoshokki (JP) | 2012-08-29 | — | — | EP | disclosed |
| EP-2492992-A1 | Pressure-sensitive adhesive tape for battery and battery using the pressure-sensitive adhesive tape | Nitto Denko Corporation (JP) | 2012-08-29 | — | — | EP | disclosed |
| EP-2490265-A1 | CONDUCTIVE ADHESIVE, SOLAR CELL, METHOD FOR MANUFACTURING SOLAR CELL, AND SOLAR CELL MODULE | Hitachi Chemical Company, Ltd. (JP) | 2012-08-22 | — | — | EP | disclosed |
| US-20120202911-A1 | CURABLE COATING AGENT COMPOSITION | TOAGOSEI CO., LTD. (JP) | 2012-08-09 | — | — | US | disclosed |
| EP-2485271-A1 | FLUORESCENT MATERIAL FOR CONVERTING WAVELENGTHS, RESIN COMPOSITION FOR CONVERTING WAVELENGTHS CONTAINING THE FLUORESCENT MATERIAL, SOLAR CELL MODULE PRODUCED USING THE FLUORESCENT MATERIAL OR THE RESIN COMPOSITION, PROCESS FOR PRODUCING RESIN COMPOSITION FOR CONVERTING WAVELENGTHS, AND PROCESS FOR PRODUCING SOLAR CELL MODULE | Hitachi Chemical Company, Ltd. (JP) | 2012-08-08 | — | — | EP | disclosed |
| EP-2479200-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED OBJECT OBTAINED THEREFROM, FIBER-REINFORCED COMPOSITE MATERIAL, FIBER-REINFORCED MOLDED RESIN, AND PROCESS FOR PRODUCING SAME | DIC Corporation (JP) | 2012-07-25 | — | — | EP | disclosed |
| US-8227533-B2 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2012-07-24 | — | — | US | disclosed |
| US-20120180865-A1 | FLUORESCENT MATERIAL FOR CONVERTING WAVELENGTHS, RESIN COMPOSITION FOR CONVERTING WAVELENGTHS CONTAINING THE FLUORESCENT MATERIAL, SOLAR CELL MODULE PRODUCED USING THE FLUORESCENT MATERIAL OR THE RESIN COMPOSITION, PROCESS FOR PRODUCING RESIN COMPOSITION FOR CONVERTING WAVELENGTHS, AND PROCESS FOR PRODUCING SOLAR CELL MODULE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| US-20120177880-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-07-12 | — | — | US | disclosed |
| EP-2474585-A2 | Surface protective sheet for self-cleaning surface | Nitto Denko Corporation (JP) | 2012-07-11 | — | — | EP | disclosed |
| US-8211254-B2 | Can cap sealing composition and use thereof | W. R. GRACE & CO.-CONN. (US) | 2012-07-03 | — | — | US | disclosed |
| US-20120161619-A1 | ENCAPSULATION SHEET, FLAT PANEL DISPLAY DEVICE USING THE SAME, AND METHOD OF MANUFACTURING THE FLAT PANEL DISPLAY DEVICE | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-06-28 | — | — | US | disclosed |
| EP-2468793-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIALS, MOLDINGS OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF | DIC Corporation (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-8207276-B2 | DIP forming latex composition and DIP formed article | ZEON CORPORATION (JP) | 2012-06-26 | — | — | US | disclosed |
| US-20120157593-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND USE THEREOF | NITTO DENKO CORPORATION (JP) | 2012-06-21 | — | — | US | disclosed |
| EP-2465908-A1 | Pressure-sensitive adhesive composition and use thereof | Nitto Denko Corporation (JP) | 2012-06-20 | — | — | EP | disclosed |
| US-8202613-B2 | Multilayer pellet and method for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-06-19 | — | — | US | disclosed |
| US-8202594-B2 | Double-sided adhesive tape for fixing decorative sheet for speaker and method for attaching decorative sheet for speaker to housing | NITTO DENKO CORPORATION (JP) | 2012-06-19 | — | — | US | disclosed |
| US-20120135232-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-05-31 | — | — | US | disclosed |
| US-20120135231-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-05-31 | — | — | US | disclosed |
| US-20120135229-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-05-31 | — | — | US | disclosed |
| US-20120135230-A1 | SURFACE PROTECTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-05-31 | — | — | US | disclosed |
| EP-2457967-A1 | Surface protective sheet | Nitto Denko Corporation (JP) | 2012-05-30 | — | — | EP | disclosed |
| EP-2457968-A1 | Surface protective sheet | NITTO DENKO CORPORATION (JP) | 2012-05-30 | — | — | EP | disclosed |
| EP-2457969-A1 | Surface protective sheet | Nitto Denko Corporation (JP) | 2012-05-30 | — | — | EP | disclosed |
| EP-2457970-A1 | Surface protective sheet | Nitto Denko Corporation (JP) | 2012-05-30 | — | — | EP | disclosed |
| EP-2452991-A1 | Insulating tape | Nitto Denko Corporation (JP) | 2012-05-16 | — | — | EP | disclosed |
| EP-2452989-A1 | HEAT-CURABLE ADHESIVE TAPE OR SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD | Nitto Denko Corporation (JP) | 2012-05-16 | — | — | EP | disclosed |
| EP-2065455-B1 | Pressure-sensitive adhesive tape | NITTO DENKO CORP (JP) | 2012-05-16 | — | — | EP | disclosed |
| CN-102458846-A | Laminate body | SUMITOMO CHEMICAL CO | 2012-05-16 | — | — | CN | disclosed |
| CN-102459456-A | water emulsion | SUMITOMO CHEMICAL CO | 2012-05-16 | — | — | CN | disclosed |
| US-20120114930-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| US-20120111612-A1 | THERMOSETTING ADHESIVE TAPE OR SHEET, AND FLEXIBLE PRINTED CIRCUIT BOARD | NITTO DENKO CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| US-20120114937-A1 | INSULATING TAPE | NITTO DENKO CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| EP-2450186-A1 | LAMINATE | Sumitomo Chemical Company, Limited (JP) | 2012-05-09 | — | — | EP | disclosed |
| EP-2450415-A2 | Pressure-sensitive adhesive sheet | Nitto Denko Corporation (JP) | 2012-05-09 | — | — | EP | disclosed |
| US-20120107564-A1 | ETHYLENE-UNSATURATED ESTER COPOLYMER FILM FOR FORMING LAMINATE | BRIDGESTONE CORPORATION (JP) | 2012-05-03 | — | — | US | disclosed |
| US-20120100384-A1 | LAMINATE | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-04-26 | — | — | US | disclosed |
| EP-2100937-B1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORP (JP) | 2012-04-18 | — | — | EP | disclosed |
| EP-2441799-A1 | AQUEOUS EMULSION | Sumitomo Chemical Company, Limited (JP) | 2012-04-18 | — | — | EP | disclosed |
| US-20120088111-A1 | AQUEOUS EMULSION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-04-12 | — | — | US | disclosed |
| US-8148625-B2 | Composition for solar cell sealing film, solar cell sealing film and solar cell using the sealing film | BRIDGESTONE CORPORATION (JP) | 2012-04-03 | — | — | US | disclosed |
| US-20120073656-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM | BRIDGESTONE CORPORATION (JP) | 2012-03-29 | — | — | US | disclosed |
| US-20120077399-A1 | ABNORMAL NOISE PREVENTING SHEET | TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) | 2012-03-29 | — | — | US | disclosed |
| EP-2433916-A1 | ETHYLENE-UNSATURATED ESTER COPOLYMER FILM FOR FORMING LAMINATE | Bridgestone Corporation (JP) | 2012-03-28 | — | — | EP | disclosed |
| US-8142605-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-27 | — | — | US | disclosed |
| US-20120068106-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-03-22 | — | — | US | disclosed |
| US-20120064275-A1 | OPTICAL PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-03-15 | — | — | US | disclosed |
| US-20120064276-A1 | OPTICAL PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2012-03-15 | — | — | US | disclosed |
| US-20120055700-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE FOR FIXING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD WITH THE SAME | NITTO DENKO CORPORATION (JP) | 2012-03-08 | — | — | US | disclosed |
| US-20120059079-A1 | DUAL-CURE CURABLE MATERIAL KIT | TOKUYAMA DENTAL CORPORATION (JP) | 2012-03-08 | — | — | US | disclosed |
| EP-2426152-A1 | FLAME-RETARDANT EXPANDABLE STYRENE RESIN PARTICLES AND METHOD FOR PRODUCING SAME | Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) | 2012-03-07 | — | — | EP | disclosed |
| US-20120053279-A1 | RUBBER COMPOSITION AND FUEL TANK PACKING FOR AUTOMOBILE USING THE COMPOSITION | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2012-03-01 | — | — | US | disclosed |
| US-20120052229-A1 | THERMOSETTING ADHESIVE TAPE OR SHEET | NITTO DENKO CORPORATION (JP) | 2012-03-01 | — | — | US | disclosed |
| US-20120052295-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR PROTECTING ELECTRODE PLATE | NITTO DENKO CORPORATION (JP) | 2012-03-01 | — | — | US | disclosed |
| EP-2423288-A2 | Pressure-sensitive adhesive tape for protecting electrode plate | NITTO DENKO CORPORATION (JP) | 2012-02-29 | — | — | EP | disclosed |
| US-8120189-B2 | Wiring terminal-connecting adhesive | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-20120037594-A1 | METHOD FOR MANUFACTURING POROUS STRUCTURE AND METHOD FOR FORMING PATTERN | ASAKAWA KOJI (JP) | 2012-02-16 | — | — | US | disclosed |
| US-20120041121-A1 | METHOD FOR MANUFACTURING POROUS STRUCTURE AND METHOD FOR FORMING PATTERN | ASAKAWA KOJI (JP) | 2012-02-16 | — | — | US | disclosed |
| US-20120037595-A1 | METHOD FOR MANUFACTURING POROUS STRUCTURE AND METHOD FOR FORMING PATTERN | ASAKAWA KOJI (JP) | 2012-02-16 | — | — | US | disclosed |
| US-8115322-B2 | Adhesive, method of connecting wiring terminals and wiring structure | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-14 | — | — | US | disclosed |
| EP-2412756-A1 | CURABLE COMPOSITION | CEMEDINE CO., LTD. (JP) | 2012-02-01 | — | — | EP | disclosed |
| US-20120015183-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE FOR FIXING DECORATIVE SHEET FOR SPEAKER | NITTO DENKO CORPORATION (JP) | 2012-01-19 | — | — | US | disclosed |
| US-20120015100-A1 | Pressure-Sensitive Adhesive Tape | NITTO DENKO CORPORATION (JP) | 2012-01-19 | — | — | US | disclosed |
| US-20120004371-A1 | CURABLE COMPOSITION | CEMEDINE CO., LTD. (JP) | 2012-01-05 | — | — | US | disclosed |
| US-8088864-B2 | Mixture of acrylic polymer, acrylic oligomer and silane coupling agent with crosslinking agents; fradiation transparent , foaming, bonding strength | NITTO DENKO CORPORATION (JP) | 2012-01-03 | — | — | US | disclosed |
| US-8088308-B2 | Resin composition and semiconductor device produced by using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-01-03 | — | — | US | disclosed |
| US-20110319507-A1 | FLAME-RETARDED FOAMABLE STYRENE-BASED RESIN BEADS AND PROCESS FOR PRODUCING THE SAME | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 2011-12-29 | — | — | US | disclosed |
| US-20110318573-A1 | ELECTROCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2011-12-29 | — | — | US | disclosed |
| US-20110319517-A1 | SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM | BRIDGESTONE CORPORATION (JP) | 2011-12-29 | — | — | US | disclosed |
| EP-2399968-A2 | Electroconductive pressure-sensitive adhesive tape | Nitto Denko Corporation (JP) | 2011-12-28 | — | — | EP | disclosed |
| EP-2087526-B1 | SEALING FILMS FOR SOLAR CELL | BRIDGESTONE CORP (JP) | 2011-12-21 | — | — | EP | disclosed |
| US-20110300361-A1 | Double-coated pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2011-12-08 | — | — | US | disclosed |
| EP-2393106-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIAL AND UREA COMPOUND CONTAINING (METH)ACRYLOYL GROUP | Showa Denko K.K. (JP) | 2011-12-07 | — | — | EP | disclosed |
| EP-2390273-A1 | DUAL-CURE CURABLE MATERIAL KIT | Tokuyama Dental Corporation (JP) | 2011-11-30 | — | — | EP | disclosed |
| US-20110281994-A1 | Thermoplastic Elastomer Composition | MITSUI CHEMICALS, INC. (JP) | 2011-11-17 | — | — | US | disclosed |
| US-20110281025-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIALS, AND (METH) ACRYLOYL GROUP-CONTAINING UREA COMPOUND | SHOWA DENKO K.K. (JP) | 2011-11-17 | — | — | US | disclosed |
| EP-1798029-B1 | MULTILAYERED FOAM OF POLYLACTIC ACID RESIN AND MULTILAYERED FOAMED MOLDING OF POLYLACTIC ACID RESIN | JSP CORP (JP) | 2011-11-09 | — | — | EP | disclosed |
| US-20110267403-A1 | INK JET RECORDING HEAD | CANON KABUSHIKI KAISHA (JP) | 2011-11-03 | — | — | US | disclosed |
| EP-2383321-A2 | Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process | Nitto Denko Corporation (JP) | 2011-11-02 | — | — | EP | disclosed |
| EP-2113544-B1 | Double-sided adhesive tape for fixing decorative sheet for speaker and method for attaching decorative sheet for speaker to housing | NITTO DENKO CORP (JP) | 2011-10-26 | — | — | EP | disclosed |
| US-8043520-B2 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2011-10-25 | — | — | US | disclosed |
| US-20110255272-A1 | Simulated candle apparatus | PRIVAS YVES | 2011-10-20 | — | — | US | disclosed |
| CN-102197055-A | Curable composition for transfer material and pattern formation method | SHOWA DENKO KK | 2011-09-21 | — | — | CN | disclosed |
| US-8022148-B2 | Polypropylene resin composition and film made thereof | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2011-09-20 | — | — | US | disclosed |
| US-8022125-B2 | comprising a water-dispersion type acrylic pressure-sensitive adhesive; high adhesiveness and an excellent terminal peeling resistance and small diffusing amounts of formaldehyde and toluene | NITTO DENKO CORPORATION (JP) | 2011-09-20 | — | — | US | disclosed |
| EP-2365031-A1 | THERMOPLASTIC ELASTOMER COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2011-09-14 | — | — | EP | disclosed |
| US-8016405-B2 | Ink-jet recording apparatus | BROTHER KOGYO KABUSHIKI KAISHA (JP) | 2011-09-13 | — | — | US | disclosed |
| US-8013075-B2 | Curable composition | KURARAY CO., LTD. (JP) | 2011-09-06 | — | — | US | disclosed |
| US-8007069-B2 | Ink jet recording head | CANON KABUSHIKI KAISHA (JP) | 2011-08-30 | — | — | US | disclosed |
| US-20110206834-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIALS, AND PATTERN FORMING PROCESS | SHOWA DENKO K.K. (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20110183093-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-07-28 | — | — | US | disclosed |
| EP-2345676-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIAL AND PATTERN FORMATION METHOD | SHOWA DENKO K.K. (JP) | 2011-07-20 | — | — | EP | disclosed |
| US-7980678-B2 | Ink jet recording head | CANON KABUSHIKI KAISHA (JP) | 2011-07-19 | — | — | US | disclosed |
| US-20110171479-A1 | AQUEOUS EMULSION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2011-07-14 | — | — | US | disclosed |
| US-20110159195-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-06-30 | — | — | US | disclosed |
| US-7967943-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-06-28 | — | — | US | disclosed |
| EP-1652876-B1 | Polylactic acid resin foamed molding and process for manufacturing the same | JSP CORP (JP) | 2011-06-15 | — | — | EP | disclosed |
| US-20110129689-A2 | CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION | SHOWA DENKO K.K. (JP) | 2011-06-02 | — | — | US | disclosed |
| EP-2325250-A1 | AQUEOUS EMULSION | Sumitomo Chemical Company, Limited (JP) | 2011-05-25 | — | — | EP | disclosed |
| US-7947795-B2 | Polymer for filling gaps in semiconductor substrate and coating composition using the same | CHEIL INDUSTRIES INC. (KR) | 2011-05-24 | — | — | US | disclosed |
| US-20110117362-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2011-05-19 | — | — | US | disclosed |
| US-20110114893-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2011-05-19 | — | — | US | disclosed |
| US-20110101543-A1 | CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-05 | — | — | US | disclosed |
| US-20110094771-A1 | Electroconductive pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2011-04-28 | — | — | US | disclosed |
| EP-2314650-A1 | Electroconductive pressure-sensitive adhesive tape with separator | Nitto Denko Corporation (JP) | 2011-04-27 | — | — | EP | disclosed |
| US-20110086219-A1 | Pressure-Sensitive Adhesive Sheet | NITTO DENKO CORPORATION (JP) | 2011-04-14 | — | — | US | disclosed |
| EP-2308936-A1 | Insulating tape | NITTO DENKO CORPORATION (JP) | 2011-04-13 | — | — | EP | disclosed |
| US-20110070430-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-03-24 | — | — | US | disclosed |
| US-20110070437-A1 | Insulating tape | NITTO DENKO CORPORATION (JP) | 2011-03-24 | — | — | US | disclosed |
| EP-2298843-A1 | An adhesive tape | NITTO EUROPE N.V (BE) | 2011-03-23 | — | — | EP | disclosed |
| US-7901764-B2 | Multi-layered polylactic acid resin foamed body and multi-layered polylactic acid resin foamed molded article | JSP CORPORATION (JP) | 2011-03-08 | — | — | US | disclosed |
| US-20110045262-A1 | BONDED MEMBER AND PROCESS FOR PRODUCING THE SAME | ALPS ELECTRIC CO., LTD. (JP) | 2011-02-24 | — | — | US | disclosed |
| US-7893167-B2 | Sealing film for solar cell and solar cell using the sealing film | BRIDGESTONE CORPORATION (JP) | 2011-02-22 | — | — | US | disclosed |
| US-20110037038-A1 | Thermosetting Resin Composition for Producing Color Filter for CMOS Image Sensor, Color Filter Comprising Transparent Film Formed Using the Composition and CMOS Image Sensor Using the Color Filter | CHEIL INDUSTRIES INC. (KR) | 2011-02-17 | — | — | US | disclosed |
| US-20110039988-A1 | Pressure-Sensitive Adhesive Sheet | NITTO DENKO CORPORATION (JP) | 2011-02-17 | — | — | US | disclosed |
| US-7888417-B2 | core or the layer includes a composition formed from a base polymer, a crosslink initiator, and at least one additive; additive has at least one carbon-oxygen-boron linkage, carbon in the linkage being a secondary or tertiary carbon; enhances coefficient of restitution and/or reduces compression of core | ACUSHNET COMPANY (US) | 2011-02-15 | — | — | US | disclosed |
| US-7879956-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-02-01 | — | — | US | disclosed |
| US-20110019307-A1 | METHOD FOR PRODUCING MAGNETIC RECORDING MEDIUM, MAGNETIC RECORDING MEDIUM AND MAGNETIC RECORDING/REPRODUCING APPARATUS | SHOWA DENKO K.K. (JP) | 2011-01-27 | — | — | US | disclosed |
| EP-2278593-A1 | CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2011-01-26 | — | — | EP | disclosed |
| US-20110014410-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2011-01-20 | — | — | US | disclosed |
| US-7867610-B2 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2011-01-11 | — | — | US | disclosed |
| US-20100330354-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2010-12-30 | — | — | US | disclosed |
| US-20100330364-A1 | ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | ARIFUKU MOTOHIRO | 2010-12-30 | — | — | US | disclosed |
| US-20100326596-A1 | ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | ARIFUKU MOTOHIRO | 2010-12-30 | — | — | US | disclosed |
| US-20100316889-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-12-16 | — | — | US | disclosed |
| US-20100310866-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2010-12-09 | — | — | US | disclosed |
| US-7847013-B2 | Glycidyl-, OH-, COOH- and aryl-(meth)acrylate copolymer for color filter | CHEIL INDUSTRIES INC. (KR) | 2010-12-07 | — | — | US | disclosed |
| US-20100304961-A1 | DENTAL CHEMICAL POLYMERIZATION CATALYST AND DENTAL CURABLE COMPOSITION CONTAINING THE SAME CATALYST | TOKUYAMA DENTAL CORPORATION (JP) | 2010-12-02 | — | — | US | disclosed |
| US-20100298456-A1 | POLYPROPYLENE RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND FOAM MOLDED ARTICLE | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2010-11-25 | — | — | US | disclosed |
| US-20100288431-A1 | AN ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2010-11-18 | — | — | US | disclosed |
| US-20100288347-A1 | SEALING FILM FOR SOLAR CELL | BRIDGESTONE CORPORATION (JP) | 2010-11-18 | — | — | US | disclosed |
| EP-2033998-B1 | Pressure sensitive adhesive composition, product using the same, and display using the product | NITTO DENKO CORP (JP) | 2010-11-10 | — | — | EP | disclosed |
| EP-2100933-B1 | Double-sided pressure-sensitive adhesive sheet and method for fixing plastic film | NITTO DENKO CORP (JP) | 2010-10-20 | — | — | EP | disclosed |
| US-20100261144-A1 | Dental Curable Composition | TOKUYAMA DENTAL CORPORATION (JP) | 2010-10-14 | — | — | US | disclosed |
| US-20100258983-A1 | EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-14 | — | — | US | disclosed |
| CN-101329420-B | Thermosetting resin composition for preparing color filter and color filter as well as sensor | CHEIL IND INC | 2010-10-13 | — | — | CN | disclosed |
| US-20100255253-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET, PRODUCTION METHOD OF DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET, PRESSURE-SENSITIVE ADHESION TYPE OPTICAL FUNCTIONAL FILM AND PRESSURE-SENSITIVE ADHESION TYPE HARD COAT FILM | NITTO DENKO CORPORATION (JP) | 2010-10-07 | — | — | US | disclosed |
| US-20100255241-A1 | PRESSURE-SENSITIVE ADHESIVE PRODUCT | NITTO DENKO CORPORATION (JP) | 2010-10-07 | — | — | US | disclosed |
| US-20100255297-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD OF MANUFACTURE THEREOF | NITTO DENKO CORPORATION (JP) | 2010-10-07 | — | — | US | disclosed |
| US-20100247833-A1 | Pressure-Sensitive Adhesive Sheet | NITTO DENKO CORPORATION (JP) | 2010-09-30 | — | — | US | disclosed |
| US-20100239804-A1 | Pressure-Sensitive Adhesive Sheet | NITTO DENKO CORPORATION (JP) | 2010-09-23 | — | — | US | disclosed |
| US-7799844-B2 | Active energy beam-curable composition for optical material | TOAGOSEI CO., LTD. (JP) | 2010-09-21 | — | — | US | disclosed |
| US-20100229946-A1 | COMPOSITION FOR SOLAR CELL SEALING FILM, SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM | BRIDGESTONE CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| CN-101827906-A | Self adhesive tape | NITTO EUROP NV | 2010-09-08 | — | — | CN | disclosed |
| CN-101104660-B | One solution-type thermosetting compositions for color filter protective films and color filters using the same | CHEIL IND INC | 2010-09-08 | — | — | CN | disclosed |
| US-20100215955-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET AND PRESSURE-SENSITIVE ADHESIVE FUNCTIONAL FILM | NITTO DENKO CORPORATION (JP) | 2010-08-26 | — | — | US | disclosed |
| EP-1795567-B1 | Light-shielding pressure-sensitive adhesive sheet | NITTO DENKO CORP (JP) | 2010-08-25 | — | — | EP | disclosed |
| US-20100209699-A1 | ELECTROCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2010-08-19 | — | — | US | disclosed |
| EP-2218724-A1 | EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIAL, AND FINE PATTERN FORMING METHOD USING THE COMPOSITION | Showa Denko K.K. (JP) | 2010-08-18 | — | — | EP | disclosed |
| CN-101809107-A | Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device | HITACHI CHEMICAL CO LTD | 2010-08-18 | — | — | CN | disclosed |
| US-7777335-B2 | Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-08-17 | — | — | US | disclosed |
| US-20100204369-A1 | POLYPROPYLENE RESIN COMPOSITION AND FILM THEREOF | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2010-08-12 | — | — | US | disclosed |
| EP-2216349-A1 | CHEMICAL POLYMERIZATION CATALYST FOR DENTAL USE AND CURABLE DENTAL COMPOSITIONS CONTAINING THE CATALYST | Tokuyama Dental Corporation (JP) | 2010-08-11 | — | — | EP | disclosed |
| EP-2213275-A1 | CURABLE COMPOSITION FOR DENTAL APPLICATIONS | Tokuyama Dental Corporation (JP) | 2010-08-04 | — | — | EP | disclosed |
| EP-2212393-A1 | AN ADHESIVE TAPE | NITTO EUROPE N.V (BE) | 2010-08-04 | — | — | EP | disclosed |
| US-7758958-B2 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2010-07-20 | — | — | US | disclosed |
| US-20100178500-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2206758-A1 | Pressure-sensitive adhesive sheet with low emission of sulfur-containing volatile components | Nitto Denko Corporation (JP) | 2010-07-14 | — | — | EP | disclosed |
| US-7754781-B2 | Active energy beam-curable composition | TOAGOSEI CO., LTD. (JP) | 2010-07-13 | — | — | US | disclosed |
| US-20100168278-A1 | One-Solution Type Thermosetting Composition for Protective Film of Color Filter, and Color Filter Using Same | CHEIL INDUSTRIES INC. (KR) | 2010-07-01 | — | — | US | disclosed |
| US-20100163156-A1 | Can Cap Sealing Composition And Use Thereof | W.R. GRACE & CO.-CONN. | 2010-07-01 | — | — | US | disclosed |
| US-20100160568-A1 | DIP FORMING LATEX COMPOSITION AND DIP FORMED ARTICLE | KODAMA KAZUMI | 2010-06-24 | — | — | US | disclosed |
| US-20100148160-A1 | ORGANIC ELECTRONIC DEVICES PROTECTED BY ELASTOMERIC LAMINATING ADHESIVE | HENKEL AG & CO. KGAA (DE) | 2010-06-17 | — | — | US | disclosed |
| EP-1449882-B1 | IMPACT-RESISTANT CYCLIC OLEFIN BASED RESIN COMPOSITION AND MOLDINGS | POLYPLASTICS CO (JP) | 2010-06-02 | — | — | EP | disclosed |
| US-7727606-B2 | Polylactic acid resin foamed molding and process for manufacturing the same | JSP CORPORATION (JP) | 2010-06-01 | — | — | US | disclosed |
| US-7722932-B2 | One solution-type thermosetting compositions for color filter protective films and color filters using the same | CHEIL INDUSTRIES, INC. (KR) | 2010-05-25 | — | — | US | disclosed |
| US-20100119737-A1 | LIQUID CRYSTALLINE COMPOUND, LIQUID CRYSTALLINE COMPOSITION, OPTICAL FILM, AND OPTICAL LAMINATE | ZEON CORPORATION (JP) | 2010-05-13 | — | — | US | disclosed |
| EP-1571191-B1 | Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same | NITTO DENKO CORP (JP) | 2010-05-12 | — | — | EP | disclosed |
| US-20100101723-A1 | ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITION, ACRYLIC PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHODS FOR BONDING THE SHEET TO AUTOMOTIVE COATING | NITTO DENKO CORPORATION (JP) | 2010-04-29 | — | — | US | disclosed |
| US-7704659-B2 | Toner | CANON KABUSHIKI KAISHA (JP) | 2010-04-27 | — | — | US | disclosed |
| US-20100097715-A1 | NANOIMPRINTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-04-22 | — | — | US | disclosed |
| EP-1569013-B1 | Curable composition for optical parts | NIPPON CATALYTIC CHEM IND (JP) | 2010-04-14 | — | — | EP | disclosed |
| US-20100087584-A1 | THERMOPLASTIC ELASTOMER COMPOSITION | RIKEN TECHNOS CORPORATION (JP) | 2010-04-08 | — | — | US | disclosed |
| US-20100086758-A1 | FOAMED SHEET OF POLYLACTIC ACID RESIN, FOAM MOLDING OF POLYLACTIC ACID RESIN AND METHOD OF PREPARING FOAM MOLDING | JSP CORPORATION (JP) | 2010-04-08 | — | — | US | disclosed |
| EP-2171010-A1 | CAN CAP SEALING COMPOSITION AND USE THEREOF | W. R. Grace & Co.-Conn (US) | 2010-04-07 | — | — | EP | disclosed |
| US-20100080991-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR OPTICAL MEMBER ADHESION | NITTO DENKO CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| EP-2169024-A1 | Pressure-sensitive adhesive sheet for optical member adhesion | Nitto Denko Corporation (JP) | 2010-03-31 | — | — | EP | disclosed |
| EP-1772471-B1 | Radiation-curable composition and cured product thereof | NIPPON CATALYTIC CHEM IND (JP) | 2010-03-03 | — | — | EP | disclosed |
| US-20100048803-A1 | METHOD FOR PRODUCING POLYMER FOR OIL-RESISTANT RUBBER, POLYMER FOR OIL-RESISTANT RUBBER, COMPOSITION FOR OIL-RESISTANT WEATHER-RESISTANT RUBBER, AND RUBBER MOLDED BODY | JSR CORPORATION (JP) | 2010-02-25 | — | — | US | disclosed |
| US-20100035073-A1 | AQUEOUS EMULSION OF OLEFIN COPOLYMER | SUMIKA CHEMTEX COMPANY, LIMITED (JP) | 2010-02-11 | — | — | US | disclosed |
| US-20100028653-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET, FOAM FIXING METHOD AND LAMINATE | NITTO DENKO CORPORATION (JP) | 2010-02-04 | — | — | US | disclosed |
| US-20100028671-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPROATION | 2010-02-04 | — | — | US | disclosed |
| US-20100028654-A1 | Multi-Layerd Polylactic Acid Resin Foamed Body And Multi-Layered Polylactic Acid Resin Foamed Molded Article | JSP CORPORATION (JP) | 2010-02-04 | — | — | US | disclosed |
| CN-101631769-A | liquid crystal compound, liquid crystal composition, optical film and optical laminate | ZEON CORP | 2010-01-20 | — | — | CN | disclosed |
| US-20100009205-A1 | COMPOSITION FOR FORMING INTERMEDIATE FILM FOR LAMINATED GLASS, INTERMEDIATE FILM FOR LAMINATED GLASS AND LAMINATED GLASS | BRIDGESTONE CORPORATION (JP) | 2010-01-14 | — | — | US | disclosed |
| US-7645810-B2 | organic peroxide ( dicumyl peroxide) modified polylactic acid having high heat resistance and thermoforming; biodegradable polymer; cost efficiency; environmentally friendly | JSP CORPORATION (JP) | 2010-01-12 | — | — | US | disclosed |
| EP-2141210-A1 | ACRYLIC ADHESIVE COMPOSITION, ACRYLIC ADHESIVE SHEET, AND METHOD FOR BONDING THE ADHESIVE SHEET TO COATED SURFACE OF AUTOMOBILE | Nitto Denko Corporation (JP) | 2010-01-06 | — | — | EP | disclosed |
| US-20090326123-A1 | POLYPROPYLENE RESIN COMPOSITION AND MOLDED ARTICLE MADE THEREOF | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-12-31 | — | — | US | disclosed |
| US-7629050-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| US-7629056-B2 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| EP-2119698-A1 | LIQUID CRYSTALLINE COMPOUND, LIQUID CRYSTALLINE COMPOSITION, OPTICAL FILM, AND OPTICAL LAMINATE | ZEON CORPORATION (JP) | 2009-11-18 | — | — | EP | disclosed |
| US-7618713-B2 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-11-17 | — | — | US | disclosed |
| US-20090278284-A1 | PROCESS FOR MAKING A DIP-FORMING COMPOSITION AND A DIP-FORMED ARTICLE | KODAMA KAZUMI | 2009-11-12 | — | — | US | disclosed |
| US-20090272491-A1 | DOUBLE-SIDED ADHESIVE TAPE FOR FIXING DECORATIVE SHEET FOR SPEAKER AND METHOD FOR ATTACHING DECORATIVE SHEET FOR SPEAKER TO HOUSING | NITTO DENKO CORPORATION (JP) | 2009-11-05 | — | — | US | disclosed |
| EP-2113544-A1 | Double-sided adhesive tape for fixing decorative sheet for speaker and method for attaching decorative sheet for speaker to housing | Nitto Denko Corporation (JP) | 2009-11-04 | — | — | EP | disclosed |
| EP-2112209-A1 | Thermosetting adhesive or pressure-sensitive adhesive tape or sheet | NITTO DENKO CORPORATION (JP) | 2009-10-28 | — | — | EP | disclosed |
| US-20090264039-A1 | Pressure-Sensitive Adhesive Sheet | NITTO DENKO CORPORATION | 2009-10-22 | — | — | US | disclosed |
| US-20090263606-A1 | THERMOSETTING ADHESIVE OR PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET | NITTO DENKO CORPORATION (JP) | 2009-10-22 | — | — | US | disclosed |
| CN-100551934-C | The composition of active energy ray-curable | TOAGOSEI CO LTD (JP) | 2009-10-21 | — | — | CN | disclosed |
| US-7604868-B2 | Interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; superior low temperature rapid curability and a long pot life | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-10-20 | — | — | US | disclosed |
| EP-2108685-A1 | Pressure-sensitive adhesive sheet and production method thereof | Nitto Denko Corporation (JP) | 2009-10-14 | — | — | EP | disclosed |
| EP-1752508-B1 | Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board | NITTO DENKO CORP (JP) | 2009-10-14 | — | — | EP | disclosed |
| US-7600865-B2 | Ink-jet recording apparatus | BROTHER KOGYO KABUSHIKI KAISHA (JP) | 2009-10-13 | — | — | US | disclosed |
| US-20090253850-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET AND PRODUCTION METHOD THEREOF | NITTO DENKO CORPORATION (JP) | 2009-10-08 | — | — | US | disclosed |
| EP-2105483-A1 | Light-shielding pressure-sensitive adhesive sheet | Nitto Denko Corporation (JP) | 2009-09-30 | — | — | EP | disclosed |
| US-7591921-B2 | Heat-decaying materials, transfer sheet using the same, and patterning method | SEKISUI CHEMICAL CO., LTD. (JP) | 2009-09-22 | — | — | US | disclosed |
| US-20090229733-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR FIXING PLASTIC FILM | NITTO DENKO CORPORATION (JP) | 2009-09-17 | — | — | US | disclosed |
| EP-2100933-A1 | Double-sided pressure-sensitive adhesive sheet and method for fixing plastic film | NITTO DENKO CORPORATION (JP) | 2009-09-16 | — | — | EP | disclosed |
| EP-2100937-A2 | Pressure-sensitive adhesive sheet | Nitto Denko Corporation (JP) | 2009-09-16 | — | — | EP | disclosed |
| EP-2098545-A1 | METHOD FOR PRODUCING POLYMER FOR OIL-RESISTANT RUBBER, POLYMER FOR OIL-RESISTANT RUBBER, COMPOSITION FOR OIL-RESISTANT WEATHER-RESISTANT RUBBER, AND RUBBER MOLDED BODY | JSR Corporation (JP) | 2009-09-09 | — | — | EP | disclosed |
| EP-2096138-A1 | AQUEOUS EMULSION OF OLEFIN COPOLYMER | Sumika Chemtex Company, Limited (JP) | 2009-09-02 | — | — | EP | disclosed |
| US-7582401-B2 | Toner with hybrid binder resin | CANON KABUSHIKI KAISHA (JP) | 2009-09-01 | — | — | US | disclosed |
| EP-2093268-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2009-08-26 | — | — | EP | disclosed |
| US-20090209705-A1 | THERMOPLASTIC RESIN COMPOSITION, OPTICAL FILM AND RETARDATION FILM | JSR CORPORATION (JP) | 2009-08-20 | — | — | US | disclosed |
| US-20090197193-A1 | TONER | CANON KABUSHIKI KAISHA (JP) | 2009-08-06 | — | — | US | disclosed |
| EP-1647586-B1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORP (JP) | 2009-07-29 | — | — | EP | disclosed |
| US-20090186232-A1 | AQUEOUS EMULSION OF OLEFIN COPOLYMER OR MODIFIED MATERIAL THEREOF | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-07-23 | — | — | US | disclosed |
| US-7560498-B2 | Process of producing foamed molding from expanded polypropylene resin beads and process of producing expanded polypropylene resin beads | JSP CORPORATION (JP) | 2009-07-14 | — | — | US | disclosed |
| US-7556850-B2 | Wiring circuit board | NITTO DENKO CORPORATION (JP) | 2009-07-07 | — | — | US | disclosed |
| US-7553890-B2 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-06-30 | — | — | US | disclosed |
| US-20090159129-A1 | SEALING FILM FOR SOLAR CELL AND SOLAR CELL USING THE SEALING FILM | BRIDGESTONE CORPORATION (JP) | 2009-06-25 | — | — | US | disclosed |
| US-20090142593-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2009-06-04 | — | — | US | disclosed |
| US-20090141080-A1 | INK JET RECORDING HEAD | CANON KABUSHIKI KAISHA (JP) | 2009-06-04 | — | — | US | disclosed |
| EP-2065455-A1 | Pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2009-06-03 | — | — | EP | disclosed |
| US-20090130380-A1 | METHOD FOR MANUFACTURING POUROUS STRUCTURE AND METHOD FOR FORMING PATTERN | ASAKAWA KOJI | 2009-05-21 | — | — | US | disclosed |
| EP-2056356-A1 | COMPOSITION FOR SOLAR CELL SEALING FILM, SOLAR CELL SEALING FILM, AND SOLAR CELL USING THE SEALING FILM | BRIDGESTONE CORPORATION (JP) | 2009-05-06 | — | — | EP | disclosed |
| US-20090101279-A1 | ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | ARIFUKI MOTOHIRO | 2009-04-23 | — | — | US | disclosed |
| WO-2009049651-A1 | AN ADHESIVE TAPE | NITTO EUROPE NV (BE) | 2009-04-23 | — | — | WO | disclosed |
| US-20090105424-A1 | DIP Forming Latex Composition and DIP Formed Article | ZEON CORPORATION (JP) | 2009-04-23 | — | — | US | disclosed |
| US-20090098376-A1 | Double-Sided Adhesive Tape for Securing Polishing-Pad | SEKISUI CHEMICAL CO., LTD. ET AL. (JP) | 2009-04-16 | — | — | US | disclosed |
| US-20090095516-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR USE IN WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION (JP) | 2009-04-16 | — | — | US | disclosed |
| EP-2048210-A1 | Double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board and wiring circuit board | Nitto Denko Corporation (JP) | 2009-04-15 | — | — | EP | disclosed |
| US-7517466-B2 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2009-04-14 | — | — | US | disclosed |
| US-20090068459-A1 | Pressure sensitive adhesive composition, product using the same, and display using the product | NITTO DENKO CORPORATION (JP) | 2009-03-12 | — | — | US | disclosed |
| EP-2033942-A1 | COMPOSITION FOR FORMING INTERLAYER FOR LAMINATED GLASS, INTERLAYER FOR LAMINATED GLASS, AND LAMINATED GLASS | BRIDGESTONE CORPORATION (JP) | 2009-03-11 | — | — | EP | disclosed |
| EP-2033998-A2 | Pressure sensitive adhesive composition, product using the same, and display using the product | Nitto Denko Corporation (JP) | 2009-03-11 | — | — | EP | disclosed |
| EP-2030778-A1 | Decorative laminated glass | BRIDGESTONE CORPORATION (JP) | 2009-03-04 | — | — | EP | disclosed |
| US-7491771-B2 | Olefinic rubber composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2009-02-17 | — | — | US | disclosed |
| CN-100460476-C | Adhesive composition for plant fiber board and method for producing plant fiber board used therein | NIPPON POLYURETHANE KOGYO KK (JP) | 2009-02-11 | — | — | CN | disclosed |
| US-7488776-B2 | Thermoplastic crosslinked rubber composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2009-02-10 | — | — | US | disclosed |
| WO-2009011481-A1 | ONE-SOLUTION TYPE THERMOSETTING COMPOSITION FOR PROTECTIVE FILM OF COLOR FILTER, AND COLOR FILTER USING SAME | CHEIL INDUSTRIES INC. (KR) | 2009-01-22 | — | — | WO | disclosed |
| EP-2014719-A1 | AQUEOUS EMULSION OF OLEFIN COPOLYMER OR MODIFIED PRODUCT OF THE OLEFIN COPOLYMER | Sumitomo Chemical Company, Limited (JP) | 2009-01-14 | — | — | EP | disclosed |
| US-20080319145-A1 | Thermosetting Resin Composition for Producing Color Filter for CMOS Image Sensor, Color Filter Comprising Transparent Film Formed Using the Composition and CMOS Image Sensor Using the Color Filter | CHEIL INDUSTRIES INC. (KR) | 2008-12-25 | — | — | US | disclosed |
| WO-2008157217-A1 | CAN CAP SEALING COMPOSITION AND USE THEREOF | W.R. GRACE & CO.-CONN. (US) | 2008-12-24 | — | — | WO | disclosed |
| CN-101329420-A | Thermosetting resin composition for preparing color filter and color filter as well as sensor | CHEIL IND INC (KR) | 2008-12-24 | — | — | CN | disclosed |
| EP-1568748-B1 | Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet | NITTO DENKO CORP (JP) | 2008-12-17 | — | — | EP | disclosed |
| EP-2003701-A1 | SEALING FILM FOR SOLAR CELL AND SOLAR CELL USING SUCH SEALING FILM | BRIDGESTONE CORPORATION (JP) | 2008-12-17 | — | — | EP | disclosed |
| EP-2000518-A1 | Pressure-sensitive adhesive Composition, and pressure-sensitive adhesive product and display using the same | NITTO DENKO CORPORATION (JP) | 2008-12-10 | — | — | EP | disclosed |
| WO-2008144080-A1 | ORGANIC ELECTRONIC DEVICES PROTECTED BY ELASTOMERIC LAMINATING ADHESIVE | HENKEL AG & CO. KGAA (DE) | 2008-11-27 | — | — | WO | disclosed |
| US-20080291234-A1 | INK JET RECORDING HEAD | CANON KABUSHIKI KAISHA (JP) | 2008-11-27 | — | — | US | disclosed |
| EP-1715388-B1 | Toner | CANON KK (JP) | 2008-11-19 | — | — | EP | disclosed |
| US-20080281047-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, AND PRESSURE-SENSITIVE ADHESIVE PRODUCT AND DISPLAY USING THE SAME | NITTO DENKO CORPORATION (JP) | 2008-11-13 | — | — | US | disclosed |
| US-7442435-B2 | Long-fiber-reinforced polypropylene compositions and door shield module plate produced with the same | HYUNDAI MOTOR COMPANY (KR) | 2008-10-28 | — | — | US | disclosed |
| US-20080261722-A1 | COMPOSITIONS FOR USE IN GOLF BALLS | ACUSHNET COMPANY | 2008-10-23 | — | — | US | disclosed |
| US-20080227567-A1 | COMPOSITIONS FOR USE IN GOLF BALLS | ACUSHNET COMPANY | 2008-09-18 | — | — | US | disclosed |
| US-20080220245-A1 | Transparent Sealing Material For Organic El Device | JSR CORPORATION (JP) | 2008-09-11 | — | — | US | disclosed |
| US-20080194727-A1 | Active Energy Beam-Curable Composition | TOAGOSEI CO., LTD. (JP) | 2008-08-14 | — | — | US | disclosed |
| EP-1441004-B1 | Halogen-free flame-retardant resin composition | SHINETSU CHEMICAL CO (JP) | 2008-08-13 | — | — | EP | disclosed |
| US-20080177002-A1 | Thermoplastic Resin Composition, Optical Film, And Process For Producing Film | JSR CORPORATION (JP) | 2008-07-24 | — | — | US | disclosed |
| US-20080176678-A1 | Compositions for Use in Golf Balls | ACUSHNET COMPANY | 2008-07-24 | — | — | US | disclosed |
| US-7399498-B2 | Material composition for producing optical waveguide and method for producing optical waveguide | TOYODA GOSEI CO., LTD. (JP) | 2008-07-15 | — | — | US | disclosed |
| US-7396627-B2 | Method of preparing a toner, developer including the toner, container containing the toner, and image forming method and process cartridge using the toner | RICOH COMPANY, LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-7390544-B2 | Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same | NITTO DENKO CORPORATION (JP) | 2008-06-24 | — | — | US | disclosed |
| EP-1485241-B1 | COMPOSITE FOAMED POLYPROPYLENE RESIN MOLDING AND METHOD OF PRODUCING SAME | JSP CORP (JP) | 2008-05-28 | — | — | EP | disclosed |
| CN-100384895-C | Actinic-energy-ray-curable composition for optical material | TOAGOSEI CO LTD (JP) | 2008-04-30 | — | — | CN | disclosed |
| US-20080095955-A1 | Thermoplastic Resin Composition and Optical Films Made Therefrom | JSR CORPORATION (JP) | 2008-04-24 | — | — | US | disclosed |
| US-7361711-B2 | Compositions for use in golf balls | ACUSHNET COMPANY (US) | 2008-04-22 | — | — | US | disclosed |
| US-7358310-B2 | Compositions for use in golf balls | ACUSHNET COMPANY (US) | 2008-04-15 | — | — | US | disclosed |
| US-7358309-B2 | core or the layer includes a composition formed from a base polymer, a crosslink initiator, and at least one additive; additive has at least one carbon-oxygen-boron linkage, carbon in the linkage being a secondary or tertiary carbon; enhances coefficient of restitution and/or reduces compression of core | ACUSHNET COMPANY (US) | 2008-04-15 | — | — | US | disclosed |
| US-7358308-B2 | Compositions for use in golf balls | ACUSHNET COMPANY (US) | 2008-04-15 | — | — | US | disclosed |
| US-7358302-B2 | Composition for light-scattering film and light-scattering film using the same | TOYO INK MFG. CO., LTD. (JP) | 2008-04-15 | — | — | US | disclosed |
| US-20080081873-A1 | Thermoplastic Elastomer Composition And Method For Producing Same | JSR CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| US-20080076310-A1 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080071029-A1 | RESIN COMPOSITION | RIKEN TECHNOS CORPORATION (JP) | 2008-03-20 | — | — | US | disclosed |
| EP-1520878-B1 | Rubber hose material | TOKAI RUBBER IND LTD (JP) | 2008-03-19 | — | — | EP | disclosed |
| US-20080064233-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-13 | — | — | US | disclosed |
| US-20080054225-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20080051498-A1 | Dip-Forming Composition and Dip-Formed Article | ZEON CORPORATION (JP) | 2008-02-28 | — | — | US | disclosed |
| EP-1890324-A2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-02-20 | — | — | EP | disclosed |
| CN-101128490-A | Active energy ray-curable composition | TOAGOSEI CO LTD (JP) | 2008-02-20 | — | — | CN | disclosed |
| EP-1574557-B1 | Transparent double-sided pressure-sensitive adhesive tape or sheet and touch panel | NITTO DENKO CORP (JP) | 2008-02-13 | — | — | EP | disclosed |
| US-20080033076-A1 | Olefin Polymer Composition Powder and Modified Olefin Polymer | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-02-07 | — | — | US | disclosed |
| US-20080015283-A1 | ONE SOLUTION-TYPE THERMOSETTING COMPOSITIONS FOR COLOR FILTER PROTECTIVE FILMS AND COLOR FILTERS USING THE SAME | KPX CHEMICAL CO., LTD. (KR) | 2008-01-17 | — | — | US | disclosed |
| CN-101104660-A | One solution-type thermosetting compositions for color filter protective films and color filters using the same | CHEIL IND INC (KR) | 2008-01-16 | — | — | CN | disclosed |
| US-20070299172-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2007-12-27 | — | — | US | disclosed |
| US-7312280-B2 | Process for producing modified ethylene-vinylcyclohexane copolymer resin | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2007-12-25 | — | — | US | disclosed |
| US-7312270-B2 | Fuel cell hose | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2007-12-25 | — | — | US | disclosed |
| US-20070282077-A1 | Thermoplastic Resin Composition, Optical Film And Oriented Film | JSR CORPORATION (JP) | 2007-12-06 | — | — | US | disclosed |
| EP-1243615-B1 | THERMOPLASTIC CROSSLINKED RUBBER COMPOSITIONS | ASAHI CHEMICAL IND (JP) | 2007-11-28 | — | — | EP | disclosed |
| EP-1857469-A1 | ACTIVE ENERGY RAY-CURABLE COMPOSITION | TOAGOSEI CO., LTD. (JP) | 2007-11-21 | — | — | EP | disclosed |
| EP-1847567-A1 | THERMOPLASTIC RESIN COMPOSITION, OPTICAL FILM AND ORIENTED FILM | JSR Corporation (JP) | 2007-10-24 | — | — | EP | disclosed |
| EP-1535960-B1 | Oil resistant and weather resistant rubber composition and molded product using the same | JSR CORP (JP) | 2007-10-24 | — | — | EP | disclosed |
| EP-1837374-A1 | THERMOPLASTIC RESIN COMPOSITION, OPTICAL FILM, AND PROCESS FOR PRODUCING FILM | JSR Corporation (JP) | 2007-09-26 | — | — | EP | disclosed |
| EP-1834992-A1 | THERMOPLASTIC RESIN COMPOSITION AND OPTICAL FILMS MADE THEREFROM | JSR Corporation (JP) | 2007-09-19 | — | — | EP | disclosed |
| US-20070213467-A1 | Resin Composition and Semiconductor Device Produced By Using the Same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2007-09-13 | — | — | US | disclosed |
| US-20070207312-A1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2007-09-06 | — | — | US | disclosed |
| EP-1829947-A2 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2007-09-05 | — | — | EP | disclosed |
| EP-1826236-A1 | COMPOSITION FOR DIP FORMING AND DIP-FORMED MOLDING | ZEON CORPORATION (JP) | 2007-08-29 | — | — | EP | disclosed |
| US-20070197731-A1 | Process for producing thermoplastic resin composition | SUMITOMO CHEMICAL COMPANY, LIMITED | 2007-08-23 | — | — | US | disclosed |
| US-20070191535-A1 | Two-pack type acrylic sol compostion | MITSUBISHI RAYON CO., LTD. (JP) | 2007-08-16 | — | — | US | disclosed |
| EP-1816163-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND METHOD FOR PRODUCING SAME | JSR Corporation (JP) | 2007-08-08 | — | — | EP | disclosed |
| US-7247678-B2 | Rubbery polymer composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2007-07-24 | — | — | US | disclosed |
| US-7241644-B2 | Adhesive, method of connecting wiring terminals and wiring structure | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-07-10 | — | — | US | disclosed |
| US-20070141286-A1 | Foamed sheet of polylactic acid resin, foam molding of polylactic acid resin and method of preparing foam molding | JSP CORPORATION (JP) | 2007-06-21 | — | — | US | disclosed |
| EP-1798029-A1 | MULTILAYERED FOAM OF POLYLACTIC ACID RESIN AND MULTILAYERED FOAMED MOLDING OF POLYLACTIC ACID RESIN | JSP CORPORATION (JP) | 2007-06-20 | — | — | EP | disclosed |
| US-20070135576-A1 | Thermoplastic elastomer composition | RIKEN TECHNOS CORPORATION (JP) | 2007-06-14 | — | — | US | disclosed |
| EP-1795567-A2 | Light-shielding pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2007-06-13 | — | — | EP | disclosed |
| EP-1795559-A1 | THERMOPLASTIC RESIN COMPOSITION, OPTICAL FILM AND RETARDATION FILM | JSR Corporation (JP) | 2007-06-13 | — | — | EP | disclosed |
| US-7226974-B2 | Olefinic rubber composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2007-06-05 | — | — | US | disclosed |
| EP-1598398-B1 | CURABLE COMPOSITION | KURARAY CO (JP) | 2007-05-09 | — | — | EP | disclosed |
| US-20070100084-A1 | Polymer for filling gaps in semiconductor substrate and coating composition using the same | CHEIL INDUSTRIES, INC. (KR) | 2007-05-03 | — | — | US | disclosed |
| US-20070093606-A1 | Method for producing modified polyolefin resin | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2007-04-26 | — | — | US | disclosed |
| US-20070087193-A1 | Long-fiber-reinforced polypropylene compositions and door shield module plate produced with the same | SAMBARK LFT CO., LTD. (KR) | 2007-04-19 | — | — | US | disclosed |
| EP-1772471-A1 | Radiation-curable composition and cured product thereof | Nippon Shokubai Co.,Ltd. (JP) | 2007-04-11 | — | — | EP | disclosed |
| US-20070059546-A1 | One solution-type thermosetting compositions for color filter protective films and color filters using the same | CHEIL INDUSTRIES, INC. | 2007-03-15 | — | — | US | disclosed |
| US-20070049655-A1 | Radiation-curable composition and cured product thereof | NIPPON SHOKUBAI CO., LTD. (JP) | 2007-03-01 | — | — | US | disclosed |
| US-7182896-B2 | Composite foamed polypropylene resin molding and method of producing same | JSP CORPORATION (JP) | 2007-02-27 | — | — | US | disclosed |
| US-20070043143-A1 | Active energy beam-curable composition for optical material | THOMSON LICENSING (FR) | 2007-02-22 | — | — | US | disclosed |
| EP-1239332-B1 | PHOTOSENSITIVE POLYSILAZANE COMPOSITION, METHOD OF FORMING PATTERN THEREFROM, AND METHOD OF BURNING COATING FILM THEREOF | AZ ELECTRONIC MATERIALS USA (US) | 2007-02-21 | — | — | EP | disclosed |
| US-20070036954-A1 | Wiring circuit board | NITTO DENKO CORPORATION | 2007-02-15 | — | — | US | disclosed |
| US-20070036953-A1 | Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board | NITTO DENKO CORPORATION | 2007-02-15 | — | — | US | disclosed |
| US-20070035588-A1 | Ink-jet recording apparatus | BROTHER KOGYO KABUSHIKI KAISHA (JP) | 2007-02-15 | — | — | US | disclosed |
| EP-1753277-A2 | Wiring circuit board | NITTO DENKO CORPORATION (JP) | 2007-02-14 | — | — | EP | disclosed |
| EP-1752508-A1 | Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board. | NITTO DENKO CORPORATION (JP) | 2007-02-14 | — | — | EP | disclosed |
| US-20070030301-A1 | Ink-jet recording apparatus | BROTHER KOGYO KABUSHIKI KAISHA (JP) | 2007-02-08 | — | — | US | disclosed |
| US-20070026218-A1 | Composite foamed polypropylene resin molding and method of producing same | JSP CORPORATION | 2007-02-01 | — | — | US | disclosed |
| US-20070020474-A1 | Adhesive composition, double-coated adhesive sheet, adhesion method and portable electronic devices | NITTO DENKO CORPORATION (JP) | 2007-01-25 | — | — | US | disclosed |
| EP-1746140-A1 | Adhesive composition, double-coated adhesive sheet, adhesion method and portable electronic devices | NITTO DENKO CORPORATION (JP) | 2007-01-24 | — | — | EP | disclosed |
| US-7163982-B2 | Process for preparing fluorine-containing polymer and method of forming fine pattern using same | DAIKI INDUSTRIES, LTD. (JP) | 2007-01-16 | — | — | US | disclosed |
| EP-1302507-B1 | Thermoplastic elastomer composition, moldings using the same | JSR CORP (JP) | 2006-12-27 | — | — | EP | disclosed |
| EP-1736520-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME | Sumitomo Bakelite Company, Ltd. (JP) | 2006-12-27 | — | — | EP | disclosed |
| US-20060281586-A1 | Compositions for use in golf balls | JPMORGAN CHASE BANK, N.A., AS SUCCESSOR ADMINISTRATIVE AGENT | 2006-12-14 | — | — | US | disclosed |
| US-20060281587-A1 | Compositions for use in golf balls | JPMORGAN CHASE BANK, N.A., AS SUCCESSOR ADMINISTRATIVE AGENT | 2006-12-14 | — | — | US | disclosed |
| EP-1302313-B1 | Lithographic printing plate precursor | FUJI PHOTO FILM CO LTD (JP) | 2006-12-13 | — | — | EP | disclosed |
| CN-1875041-A | Actinic-energy-ray-curable composition for optical material | TOAGOSEI CO LTD (JP) | 2006-12-06 | — | — | CN | disclosed |
| US-20060263603-A1 | Multilayer pellet and method for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED | 2006-11-23 | — | — | US | disclosed |
| EP-1167025-B1 | Polymeric material for laser processing | JSR CORP (JP) | 2006-11-08 | — | — | EP | disclosed |
| EP-1717851-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | Hitachi Chemical Co., Ltd. (JP) | 2006-11-02 | — | — | EP | disclosed |
| US-20060240352-A1 | Toner | CANON KABUSHIKI KAISHA (JP) | 2006-10-26 | — | — | US | disclosed |
| EP-1715388-A1 | Toner | CANON KABUSHIKI KAISHA (JP) | 2006-10-25 | — | — | EP | disclosed |
| US-20060235155-A1 | OLEFINIC RUBBER COMPOSITION | MITSUI CHEMICALS, INC. (JP) | 2006-10-19 | — | — | US | disclosed |
| US-20060231525-A1 | Forming microphase-separated structure in film of graft or block copolymer with a chain of polyacrylonitrile, polycyclohexadiene derivative, polybutadiene, polysilane, polysiloxane, polyamic acid or polyaniline and thermally decomposable polymer chain; heating to decompose the decomposable phase; etching | ASAKAWA KOJI | 2006-10-19 | — | — | US | disclosed |
| EP-1229095-B1 | ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | HITACHI CHEMICAL CO LTD (JP) | 2006-10-18 | — | — | EP | disclosed |
| EP-1697426-A1 | ADHERENT, MODIFIED THERMOPLASTIC ELASTOMERIC BLENDS, ARTICLES, AND METHODS | Solvay Engineered Polymers, Inc. (US) | 2006-09-06 | — | — | EP | disclosed |
| US-20060194923-A1 | Curable composition | KURARAY CO., LTD. (JP) | 2006-08-31 | — | — | US | disclosed |
| US-7097781-B2 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2006-08-29 | — | — | US | disclosed |
| US-20060182958-A1 | Pressure-sensitive adhesive tape and pressure-sensitive adhesive composition | NITTO DENKO CORPORATION | 2006-08-17 | — | — | US | disclosed |
| EP-1690907-A2 | Pressure-sensitive adhesive tape and pressure-sensitive adhesive composition | NITTO DENKO CORPORATION (JP) | 2006-08-16 | — | — | EP | disclosed |
| US-7090784-B2 | Forming pattern using graft polymer containing metal particles; overcoating substrates; removal polymer | KABUSHIKI KAISHA TOSHIBA (JP) | 2006-08-15 | — | — | US | disclosed |
| US-20060160014-A1 | Photosensitive composition for interlayer dielectric and method of forming patterned interlayer dielectric | NAGAHARA TATSURO | 2006-07-20 | — | — | US | disclosed |
| US-7073277-B2 | Shoe having an inner sole incorporating microspheres | TAYLOR MADE GOLF COMPANY, INC. (US) | 2006-07-11 | — | — | US | disclosed |
| EP-1670292-A1 | TRANSPARENT SEALING MATERIAL FOR ORGANIC EL DEVICE | JSR Corporation (JP) | 2006-06-14 | — | — | EP | disclosed |
| US-7055552-B2 | Rubber hose material and rubber hose using the same | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2006-06-06 | — | — | US | disclosed |
| US-20060116434-A1 | Process of producing foamed molding from expanded polypropylene resin beads and process of producing expanded polypropylene resin beads | JSP CORPORATION (JP) | 2006-06-01 | — | — | US | disclosed |
| US-20060116455-A1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION | 2006-06-01 | — | — | US | disclosed |
| EP-1661962-A1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2006-05-31 | — | — | EP | disclosed |
| EP-1559538-B1 | Heat resistant air hose | TOKAI RUBBER IND LTD (JP) | 2006-05-10 | — | — | EP | disclosed |
| US-20060091576-A1 | Polylactic acid resin foamed molding and process for manufacturing the same | JSP CORPORATION (JP) | 2006-05-04 | — | — | US | disclosed |
| EP-1652876-A2 | Polylactic acid resin foamed molding and process for manufacturing the same | JSP CORPORATION (JP) | 2006-05-03 | — | — | EP | disclosed |
| US-20060084736-A1 | Thermosetting one-solution type composition for protective film of color filter and color filter using the same | CHEIL INDUSTRIES, INC. (KR) | 2006-04-20 | — | — | US | disclosed |
| US-20060084735-A1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION | 2006-04-20 | — | — | US | disclosed |
| EP-1647586-A1 | Pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2006-04-19 | — | — | EP | disclosed |
| US-7026407-B2 | Process for producing modified polyolefin resin | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-04-11 | — | — | US | disclosed |
| US-7026399-B2 | Golf ball incorporating a polymer network comprising silicone | TAYLOR MADE GOLF COMPANY, INC. (US) | 2006-04-11 | — | — | US | disclosed |
| US-20060060969-A1 | Electronic circuit including circuit-connecting material | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-23 | — | — | US | disclosed |
| US-20060063366-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-23 | — | — | US | disclosed |
| EP-1633791-A1 | CO-AGENTS FOR THE PREPARATION OF THERMOPLASTIC ELASTOMERIC BLENDS OF RUBBER AND POLYOLEFINS | Solvay Engineered Polymers, Inc. (US) | 2006-03-15 | — | — | EP | disclosed |
| EP-1491604-B1 | Pressure-sensitive adhesive composition and pressure-sensitive adhesive product | NITTO DENKO CORP (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050287469-A1 | Photosensitive composition for interlayer dielectric and method of forming patterned interlayer dielectric | NAGAHARA TATSURO | 2005-12-29 | — | — | US | disclosed |
| US-20050277044-A1 | Method of preparing a toner, developer including the toner, container containing the toner, and image forming method and process cartridge using the toner | RICOH COMPANY, LTD. (JP) | 2005-12-15 | — | — | US | disclosed |
| US-20050277045-A1 | Method for preparing resin and particulate material, toner prepared by the method, developer including the toner, toner container, and process cartridge, image forming method and apparatus using the developer | RICOH COMPANY LIMITED (JP) | 2005-12-15 | — | — | US | disclosed |
| US-20050276934-A1 | Thermally vanishing material, transfer sheet using the same, and method for forming pattern | SEKISUI CHEMICAL CO., LTD. (JP) | 2005-12-15 | — | — | US | disclosed |
| US-20050277061-A1 | Polymeric material for laser processing and a laminated body for laser processing thereof, flexographic printing plate and the method of producing the same, and a seal material | JSR CORPORATION (JP) | 2005-12-15 | — | — | US | disclosed |
| EP-1322698-B1 | EXPANDED POLYPROPYLENE RESIN BEAD AND PROCESS OF PREPARATION | JSP CORP (JP) | 2005-11-30 | — | — | EP | disclosed |
| EP-1598398-A1 | CURABLE COMPOSITION | KURARAY CO., LTD. (JP) | 2005-11-23 | — | — | EP | disclosed |
| US-6963015-B2 | Ethylene-hexafluoropropylene copolymer elastomer | DAIKIN INDUSTRIES, LTD (JP) | 2005-11-08 | — | — | US | disclosed |
| US-20050245652-A1 | Compositions for use in golf balls | JPMORGAN CHASE BANK, N.A., AS SUCCESSOR ADMINISTRATIVE AGENT | 2005-11-03 | — | — | US | disclosed |
| US-20050245657-A1 | Compositions for use in golf balls | JPMORGAN CHASE BANK, N.A., AS SUCCESSOR ADMINISTRATIVE AGENT | 2005-11-03 | — | — | US | disclosed |
| US-6956067-B2 | Expanded polypropylene resin bead and process of producing same | JSP CORPORATION (JP) | 2005-10-18 | — | — | US | disclosed |
| EP-0949088-B1 | PLATE FOR DIRECT THERMAL LITHOGRAPHY AND PROCESS FOR PRODUCING THE SAME | FUJI PHOTO FILM CO LTD (JP) | 2005-10-12 | — | — | EP | disclosed |
| US-20050221132-A1 | Rubber composition for fuel reforming system and rubber hose for fuel reforming system using the rubber composition | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| EP-1580021-A2 | Direct, heat sensitive, lithoprinting plate and process for producing the same | FUJI PHOTO FILM CO., LTD. (JP) | 2005-09-28 | — | — | EP | disclosed |
| US-6946089-B2 | Method for producing foam | JSR CORPORATION (JP) | 2005-09-20 | — | — | US | disclosed |
| US-20050202238-A1 | Transparent double-sided pressure-sensitive adhesive tape or sheet and touch panel | NITTO DENKO CORPORATION | 2005-09-15 | — | — | US | disclosed |
| EP-1574557-A1 | Transparent double-sided pressure-sensitive adhesive tape or sheet and touch panel | NITTO DENKO CORPORATION (JP) | 2005-09-14 | — | — | EP | disclosed |
| US-20050196574-A1 | Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same | NITTO DENKO CORPORATION | 2005-09-08 | — | — | US | disclosed |
| EP-1571191-A2 | Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same | NITTO DENKO CORPORATION (JP) | 2005-09-07 | — | — | EP | disclosed |
| US-6939911-B2 | Pressure-sensitive adhesive composition and pressure-sensitive adhesive product | NITTO DENKO CORPORATION (JP) | 2005-09-06 | — | — | US | disclosed |
| US-6939913-B1 | Adhesive agent, method of connecting wiring terminals and wiring structure | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2005-09-06 | — | — | US | disclosed |
| US-20050192373-A1 | Curable composition for optical parts | NIPPON SHOKUBAI CO., LTD. | 2005-09-01 | — | — | US | disclosed |
| EP-1568748-A1 | Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet | NITTO DENKO CORPORATION (JP) | 2005-08-31 | — | — | EP | disclosed |
| EP-1568484-A1 | Heat-resistant hose | Tokai Rubber Industries, Ltd. (JP) | 2005-08-31 | — | — | EP | disclosed |
| EP-1569013-A2 | Curable composition for optical parts | NIPPON SHOKUBAI CO., LTD. (JP) | 2005-08-31 | — | — | EP | disclosed |
| US-20050187348-A1 | Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet | NITTO DENKO CORPORATION | 2005-08-25 | — | — | US | disclosed |
| EP-1566410-A1 | THERMALLY VANISHING MATERIAL, TRANSFER SHEET USING THE SAME, AND METHOD FOR FORMING PATTERN | SEKISUI CHEMICAL CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-6933343-B2 | Styrene polymer resin and composition thereof | PS JAPAN CORPORATION (JP) | 2005-08-23 | — | — | US | disclosed |
| US-20050178502-A1 | Adhesive, method of connecting wiring terminals and wiring structure | ARIFUKU MOTOHIRO (JP) | 2005-08-18 | — | — | US | disclosed |
| EP-1564272-A2 | Pressure-sensitive adhesive sheets for removal of solvent-containing substance | NITTO DENKO CORPORATION (JP) | 2005-08-17 | — | — | EP | disclosed |
| US-20050176882-A1 | Adhesive, method of connecting wiring terminals and wiring structure | ARIFUKU MOTOHIRO (JP) | 2005-08-11 | — | — | US | disclosed |
| US-20050175833-A1 | Pressure-sensitive adhesive sheets for removal of solvent-containing substance | NITTO DENKO CORPORATION | 2005-08-11 | — | — | US | disclosed |
| US-20050171284-A1 | Process for producing modified polyolefin resin | SUMITOMO CHEMICAL COMPANY, LIMITED | 2005-08-04 | — | — | US | disclosed |
| EP-1560069-A1 | PHOTOSENSITIVE COMPOSITION FOR INTERLAYER DIELECTRIC AND METHOD OF FORMING PATTERNED INTERLAYER DIELECTRIC | AZ Electronic Materials (Japan) K.K. (JP) | 2005-08-03 | — | — | EP | disclosed |
| EP-1559538-A1 | Heat resistant air hose | Tokai Rubber Industries, Ltd. (JP) | 2005-08-03 | — | — | EP | disclosed |
| WO-2005061558-A1 | ADHERENT, MODIFIED THERMOPLASTIC ELASTOMERIC BLENDS, ARTICLES, AND METHODS | SOLVAY ENGINEERED POLYMERS, INC. (US) | 2005-07-07 | — | — | WO | disclosed |
| EP-1548499-A1 | PHOTOSENSITIVE COMPOSITION FOR INTERLAYER DIELECTRIC AND METHOD OF FORMING PATTERNED INTERLAYER DIELECTRIC | AZ Electronic Materials (Japan) K.K. (JP) | 2005-06-29 | — | — | EP | disclosed |
| US-20050130063-A1 | Composition for light-scattering film and light-scattering film using the same | TOYO INK MFG. CO., LTD. (JP) | 2005-06-16 | — | — | US | disclosed |
| US-20050131156-A1 | Oil resistant and weather resistant rubber composition and molded product using the same | JSR CORPORATION (JP) | 2005-06-16 | — | — | US | disclosed |
| EP-1542273-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | Hitachi Chemical Co., Ltd. (JP) | 2005-06-15 | — | — | EP | disclosed |
| US-6902875-B2 | Photosensitive polysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof | CLARIANT FINANCE (BVI) LIMITED (VG) | 2005-06-07 | — | — | US | disclosed |
| EP-1535960-A1 | Oil resistant and weather resistant rubber composition and molded product using the same | JSR Corporation (JP) | 2005-06-01 | — | — | EP | disclosed |
| US-20050080198-A1 | Process for producing modified polyolefin resin | SUMITOMO CHEMICAL COMPANY, LIMITED | 2005-04-14 | — | — | US | disclosed |
| EP-1520878-A1 | Rubber hose material | Tokai Rubber Industries, Ltd. (JP) | 2005-04-06 | — | — | EP | disclosed |
| US-6875823-B2 | Process for producing modified polyolefin resin | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2005-04-05 | — | — | US | disclosed |
| US-20050067036-A1 | Rubber hose material and rubber hose using the same | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2005-03-31 | — | — | US | disclosed |
| US-20050056957-A1 | Composite foamed polypropylene resin molding and method of producing same | JSP CORPORATION (JP) | 2005-03-17 | — | — | US | disclosed |
| US-20050049374-A1 | Process for preparing fluorine-containing polymer and method of forming fine pattern using same | DAIKIN INDUSTRIES, LTD | 2005-03-03 | — | — | US | disclosed |
| EP-1510544-A1 | Hose material for fuel cell and hose manufactured by using the same | Tokai Rubber Industries, Ltd. (JP) | 2005-03-02 | — | — | EP | disclosed |
| US-6858763-B2 | Process for preparing elastomeric ethylene-hexafluoropropylene copolymer | DAIKIN INDUSTRIES, LTD. (JP) | 2005-02-22 | — | — | US | disclosed |
| US-6852469-B2 | Lithographic printing plate precursor | FUJI PHOTO FILM CO., LTD. (JP) | 2005-02-08 | — | — | US | disclosed |
| US-20050026023-A1 | Hose material for fuel cell and hose manufactured by using the same | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2005-02-03 | — | — | US | disclosed |
| US-20050027025-A1 | Shoe components and methods of manufacture | TAYLOR MADE GOLF COMPANY, INC. | 2005-02-03 | — | — | US | disclosed |
| US-6846872-B2 | Elastomer composition containing a softening agent | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2005-01-25 | — | — | US | disclosed |
| US-20050014898-A1 | Impact-resistant cyclic olefin based resin composition and mouldings | POLYPLASTICS CO., LTD. (JP) | 2005-01-20 | — | — | US | disclosed |
| US-20050004313-A1 | Mixture of hydrogenated copolymer and thermoplastic resin | MITSUI CHEMICALS, INC. (JP) | 2005-01-06 | — | — | US | disclosed |
| US-20040260009-A1 | Pressure-sensitive adhesive composition and pressure-sensitive adhesive product | NITTO DENKO CORPORATION | 2004-12-23 | — | — | US | disclosed |
| WO-2004108773-A1 | CO-AGENTS FOR THE PREPARATION OF THERMOPLASTIC ELASTOMERIC BLENDS OF RUBBER AND POLYOLEFINS | SOLVAY ENGINEERED POLYMERS, INC. (US) | 2004-12-16 | — | — | WO | disclosed |
| CN-1548495-A | Adhesive composition for plant fiber board and method for producing plant fiber board used therein | 日本聚氨酯工业株式会社 | 2004-11-24 | — | — | CN | disclosed |
| US-6815470-B2 | FOR DENTAL RESTORATIVE, DOES NOT CAUSE THE CURED PRODUCT TO BE TINTED OR DISCOLORED | TOKUYAMA CORPORATION (JP) | 2004-11-09 | — | — | US | disclosed |
| US-6815506-B2 | DYNAMICALLY CROSSLINKED MIXTURE OF OLEFIN RESIN; UNSATURATED ACRYLIC RUBBER FROM DIUNSATURATED MONOMER, ALKYL OR ALKOXYALKYL ACRYLATE, AND ACRYLONITRILE; AND INORGANIC FILLER | JSR CORPORATION (JP) | 2004-11-09 | — | — | US | disclosed |
| US-20040214973-A1 | Process for preparing elastomeric ethylene-hexafluoropropylene copolymer | DAIKIN INDUSTRIES, LTD. (JP) | 2004-10-28 | — | — | US | disclosed |
| US-20040198921-A1 | Process for producing modified polyolefin resin | SUMITOMO CHEMICAL COMPANY, LIMITED | 2004-10-07 | — | — | US | disclosed |
| US-6800693-B2 | CROSSLINKED RUBBER AND ETHYLENE-ALPHA-OLEFIN COPOLYMER BLEND PRODUCED BY METALLOCENE CATALYST; AND HYDROGENATED CONJUGATED DIENE RUBBER; MECHANICAL STRENGTH, APPEARANCE AND MOLDABILITY | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2004-10-05 | — | — | US | disclosed |
| US-20040192844-A1 | Styrene polymer resin and composition thereof | PS JAPAN CORPORATION (JP) | 2004-09-30 | — | — | US | disclosed |
| US-20040185199-A1 | Hose material for fuel cell system and hose manufactured by using the same | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2004-09-23 | — | — | US | disclosed |
| EP-1459872-A2 | Hose material for fuel cell system and hose manufactured by using the same | Tokai Rubber Industries, Ltd. (JP) | 2004-09-22 | — | — | EP | disclosed |
| EP-1057843-B1 | Aqueous emulsion, process for producing the same and aqueous paint and aqueous printing ink comprising the same | NIPPON POLYURETHANE KOGYO KK (JP) | 2004-09-15 | — | — | EP | disclosed |
| US-20040176540-A1 | Olefinic rubber composition | MITSUI CHEMICALS, INC. (JP) | 2004-09-09 | — | — | US | disclosed |
| EP-1449882-A1 | IMPACT-RESISTANT CYCLIC OLEFIN BASED RESIN COMPOSITION AND MOLDINGS | Polyplastics Co Ltd (JP) | 2004-08-25 | — | — | EP | disclosed |
| EP-1441004-A2 | Halogen-free flame-retardant resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-07-28 | — | — | EP | disclosed |
| EP-1416301-A9 | Material composition for producing optical waveguide and method for producing optical waveguide | Toyoda Gosei Co., Ltd. (JP) | 2004-07-14 | — | — | EP | disclosed |
| US-20040132620-A1 | Melt knead graft polymerization with polar functionalized monomer; high level of incorporation | SUMITOMO CHEMICAL COMPANY, LIMITED | 2004-07-08 | — | — | US | disclosed |
| US-20040116605-A1 | Olefin polymer composition | MITSUI CHEMICALS, INC. (JP) | 2004-06-17 | — | — | US | disclosed |
| US-6747094-B2 | CROSSLINKED SATURATED RUBBER-LIKE POLYMER AND A POLYOLEFINIC RESIN AND/OR A POLYSTYRENE BASED RESIN, AND A THERMOPLASTIC RESIN BEING A POLYSTYRENE-, POLYAMIDE-, OR POLYESTER-BASED RESINS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2004-06-08 | — | — | US | disclosed |
| US-6733695-B2 | SILVER POWDER AND THERMOSETTING RESIN | SUMITOMO BAKELITE COMPANY LTD. (JP) | 2004-05-11 | — | — | US | disclosed |
| EP-1416301-A1 | Material composition for producing optical-waveguide and method for producing optical waveguide | Toyoda Gosei Co., Ltd. (JP) | 2004-05-06 | — | — | EP | disclosed |
| US-20040081912-A1 | Photosensitive polysilazane composition and method of forming patterned polysilazane film | AZ ELECTRONIC MATERIALS USA CORP. | 2004-04-29 | — | — | US | disclosed |
| US-20040063803-A1 | Polymer networks comprising silicone and methods for making them | TAYLOR MADE GOLF COMPANY, INC. | 2004-04-01 | — | — | US | disclosed |
| US-20040050816-A1 | Forming pattern using graft polymer containing metal particles; overcoating substrates; removal polymer | KABUSHIKI KAISHA TOSHIBA (JP) | 2004-03-18 | — | — | US | disclosed |
| US-20040039108-A1 | Elastomer composition containing a softening agent | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2004-02-26 | — | — | US | disclosed |
| EP-0771848-B1 | THERMOPLASTIC RESIN COMPOSITION AND PROCESS FOR PRODUCTION THEREOF | POLYPLASTICS CO (JP) | 2004-02-18 | — | — | EP | disclosed |
| CN-1475526-A | Composite material of polyolefin resin and filling and moulded product made thereof | ס�ѻ�ѧ��ҵ��ʽ���� | 2004-02-18 | — | — | CN | disclosed |
| US-20040030049-A1 | Ethylene/hexafluoropropylene copolymer elastomer | DAIKIN INDUSTRIES, LTD. (JP) | 2004-02-12 | — | — | US | disclosed |
| US-20040006154-A1 | Deantal catalyst for chemical polymerization and use thereof | IBARAGI KAZUYA (JP) | 2004-01-08 | — | — | US | disclosed |
| US-20040002569-A1 | Composite material of polyolefin resin and filler and molded article made from the same | SUMITOMO CHEMICAL COMPANY, LIMITED | 2004-01-01 | — | — | US | disclosed |
| US-6660784-B2 | Adhesives; mixture of peroxy compounds and tetraphenylborate as catalyst | TOKUYAMA CORPORATION (JP) | 2003-12-09 | — | — | US | disclosed |
| US-20030222048-A1 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-12-04 | — | — | US | disclosed |
| US-6653401-B2 | Polystyrene, rubber blend; wear resistance; dynamic crosslinking | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2003-11-25 | — | — | US | disclosed |
| EP-1350610-A1 | METHOD AND DEVICE FOR PRODUCING FOAM | JSR Corporation (JP) | 2003-10-08 | — | — | EP | disclosed |
| US-20030181594-A1 | Thermoplastic crosslinked rubber composition | ASAHI KASEI KABUSHIKI KAISHA | 2003-09-25 | — | — | US | disclosed |
| US-20030162012-A1 | Expanded polypropylene resin bead and process of producing same | JSP CORPORATION (JP) | 2003-08-28 | — | — | US | disclosed |
| EP-1078727-B1 | Polyolefin blend containing delustering agent and molded product therefrom having varied wall thickness | TOYODA GOSEI KK (JP) | 2003-08-06 | — | — | EP | disclosed |
| US-20030124335-A1 | Expanded polypropylene resin bead and process of producing same | JSP CORPORATION (JP) | 2003-07-03 | — | — | US | disclosed |
| US-20030122257-A1 | Electrically conductive paste and semiconductor device prepared by using the paste | RENESAS ELECTRONICS CORPORATION (JP) | 2003-07-03 | — | — | US | disclosed |
| US-20030113666-A1 | Lithographic printing plate precursor | FUJI PHOTO FILM CO., LTD. | 2003-06-19 | — | — | US | disclosed |
| US-20030113657-A1 | Photosensitive ploysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof | MERCK PATENT GMBH (DE) | 2003-06-19 | — | — | US | disclosed |
| US-6569950-B2 | Peroxy curing agent | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-05-27 | — | — | US | disclosed |
| US-20030096071-A1 | Oil-resistant thermoplastic elastomer composition and moldings using the same | JSR CORPORATION (JP) | 2003-05-22 | — | — | US | disclosed |
| US-6565763-B1 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-05-20 | — | — | US | disclosed |
| US-6555624-B2 | Optionally hydrogenated, crystalline, crosslinked diene rubber; olefinic thermoplastic resin | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2003-04-29 | — | — | US | disclosed |
| EP-1302313-A2 | Lithographic printing plate precursor | FUJI PHOTO FILM CO., LTD. (JP) | 2003-04-16 | — | — | EP | disclosed |
| EP-1302507-A2 | Thermoplastic elastomer composition, moldings using the same | JSR Corporation (JP) | 2003-04-16 | — | — | EP | disclosed |
| EP-0870800-B1 | THERMOPLASTIC ELASTOMER COMPOSITIONS, HOSE MADE BY USING THERMOPLASTIC ELASTOMER COMPOSITION, AND PROCESS FOR THE PRODUCTION THEREOF | YOKOHAMA RUBBER CO LTD (JP) | 2003-03-05 | — | — | EP | disclosed |
| US-20030032714-A1 | Rubber composition for roller and recording medium feeding roller using the same | KAWASAKI HIROSHI (JP) | 2003-02-13 | — | — | US | disclosed |
| US-6506839-B1 | An elastomer composition obtained by crosslinking 1-99 parts by weight of a crosslinkable rubber-like polymer (A) and 1-99 parts by weight of a polypropylene resin (B) (the total amount of (A) and (B) being 100 parts by weight), crosslinking type | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2003-01-14 | — | — | US | disclosed |
| US-20020195735-A1 | Method and device for producing foam | JSR CORPORATION (JP) | 2002-12-26 | — | — | US | disclosed |
| US-6495249-B2 | SKIN LAYER AND CUSHIONING LAYER AND/OR A REINFORCING LAYER; SKIN LAYER A THERMOPLASTIC ELASTOMER OF CROSSLINKED COPOLYMER OF ETHYLENE AND ALPHA OLEFIN MADE WITH METALLOCENE CATALYST, AND A PROPYLENE POLYMER; FLEXIBILITY, WEAR RESISTANCE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-12-17 | — | — | US | disclosed |
| EP-1259574-A2 | LAMINAR ARTICLES CONTAINING LAYERS OF ETHYLENE CONTAINING POLYMER ELASTOMERS CONTAINING AROMATIC RESINS | ExxonMobil Chemical Patents Inc. (US) | 2002-11-27 | — | — | EP | disclosed |
| US-20020161131-A1 | Process for producing acid modified polypropylene resin | SUMITOMO CHEMICAL COMPANY, LIMITED | 2002-10-31 | — | — | US | disclosed |
| US-20020136914-A1 | Skin layer and cushioning layer and/or a reinforcing layer; skin layer a thermoplastic elastomer of crosslinked copolymer of ethylene and alpha olefin made with metallocene catalyst, and a propylene polymer; flexibility, wear resistance | MITSUI CHEMICALS, INC. (JP) | 2002-09-26 | — | — | US | disclosed |
| EP-1243615-A1 | THERMOPLASTIC CROSSLINKED RUBBER COMPOSITIONS | Asahi Kasei Kabushiki Kaisha (JP) | 2002-09-25 | — | — | EP | disclosed |
| US-20020132951-A1 | Dental catalyst for chemical polymerization and use thereof | TOKUYAMA CORPORATION | 2002-09-19 | — | — | US | disclosed |
| US-6451910-B1 | Acrylic premix, acrylic artificial marble and production method thereof | MITSUBISHI RAYON CO., LTD. (JP) | 2002-09-17 | — | — | US | disclosed |
| EP-1239332-A1 | PHOTOSENSITIVE POLYSILAZANE COMPOSITION, METHOD OF FORMING PATTERN THEREFROM, AND METHOD OF BURNING COATING FILM THEREOF | CLARIANT INTERNATIONAL LTD. (CH) | 2002-09-11 | — | — | EP | disclosed |
| EP-1233014-A1 | ASYMMETRIC ORGANIC PEROXIDE, CROSSLINKING AGENT COMPRISING THE SAME, AND METHOD OF CROSSLINKING WITH THE SAME | NOF CORPORATION (JP) | 2002-08-21 | — | — | EP | disclosed |
| US-6433089-B1 | CROSSLINKING | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-08-13 | — | — | US | disclosed |
| EP-1229095-A1 | ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-08-07 | — | — | EP | disclosed |
| US-6417271-B1 | VULCANIZED BLEND OF ETHYLENE-A-OLEFIN COPOLYMER, POLYPROPYLENE, AND POLYSILOXANE; WEAR RESISTANCE; APPLIANCES, AUTOMOBILES, SPORTS EQUIPMENT | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-07-09 | — | — | US | disclosed |
| US-6403716-B1 | WITH SUPERIOR MECHANICAL STRENGTH AND WEAR RESISTANCE WHILE MAINTAINING APPEARANCE AND FLEXIBILITY; CROSSLINKABLE RUBBER AND TWO POLYPROPYLENE RESINS WITH SPECIFIED MELT TORQUES | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-06-11 | — | — | US | disclosed |
| US-6384143-B1 | COMPOSITION WHICH CONTAINS THERMOPLASTIC CROSSLINKED PRODUCT COMPRISING ETHYLENE-ALPHA-OLEFIN COPOLYMER PREPARED USING METALLOCENE CATALYST AND OLEFIN RESIN, AND THERMOPLASTIC ELASTOMER ADDED LATER TO CROSSLINKED PRODUCT | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-05-07 | — | — | US | disclosed |
| US-20020045710-A1 | Thermoplastic crosslinked rubber composition | MITSUI CHEMICALS, INC. (JP) | 2002-04-18 | — | — | US | disclosed |
| EP-1197523-A1 | METHOD FOR PRODUCING ACRYLIC BMC, METHOD FOR PRODUCING ACRYLIC SYRUP, AND METHOD FOR PRODUCING ACRYLIC MOLDED ARTICLE | Mitsubishi Rayon Co., Ltd. (JP) | 2002-04-17 | — | — | EP | disclosed |
| US-20020037965-A1 | High impact thermoplastic resin composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-03-28 | — | — | US | disclosed |
| EP-1190695-A1 | Catalyst for chemical polymerization of dental materials | TOKUYAMA CORPORATION (JP) | 2002-03-27 | — | — | EP | disclosed |
| US-20020018958-A1 | For engraving; odor/fume free; low adhesion of the worked surface for seals | JSR CORPORATION (JP) | 2002-02-14 | — | — | US | disclosed |
| EP-1167025-A2 | Polymeric material for laser processing | JSR Corporation (JP) | 2002-01-02 | — | — | EP | disclosed |
| CN-1077048-C | Lithographic printing original plate and method for making plate using the same | ASAHI CHEMICAL IND (JP) | 2002-01-02 | — | — | CN | disclosed |
| US-20010053816-A1 | Thermoplastic elastomer composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2001-12-20 | — | — | US | disclosed |
| EP-1164435-A1 | PHOTOSENSITIVE POLYSILAZANE COMPOSITION AND METHOD OF FORMING PATTERNED POLYSILAZANE FILM | TonenGeneral Sekiyu K.K. (JP) | 2001-12-19 | — | — | EP | disclosed |
| US-6323300-B1 | ELECTRICAL CHARACTERISTICS SUCH AS A LOW DIELECTRIC CONSTANT, HEAT RESISTANCE, FILM-FORMING PROPERTIES, WATER ABSORPTION PROPERTIES AND ADHESION TO OTHER MATERIALS, FOR ELECTRONIC PARTS | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 2001-11-27 | — | — | US | disclosed |
| US-6316548-B1 | FOR PRODUCING ARTIFICIAL MARBLE; APPEARANCE, DIMENSION STABILITY, HOT WATER RESISTANCE, WEATHERABILITY | MITSUBISHI RAYON CO., LTD. (JP) | 2001-11-13 | — | — | US | disclosed |
| US-20010036558-A1 | Laminar articles containing layers of ethylene containing polymer elastomers containing resins | EXXONMOBILE CHEMICAL PATENTS INC. | 2001-11-01 | — | — | US | disclosed |
| US-6306947-B1 | Printing ink and paint composed of an aqueous emulsion of self-emulsifiable urethane copolymer | NIPPON POLYURETHANE INDUSTRY CO., LTD. (JP) | 2001-10-23 | — | — | US | disclosed |
| EP-1146023-A1 | ACRYLIC SMC OR BMC, PROCESS FOR PRODUCING THE SAME, PROCESS FOR PRODUCING ARTIFICIAL ACRYLIC MARBLE, AND THICKENER | Mitsubishi Rayon Co., Ltd. (JP) | 2001-10-17 | — | — | EP | disclosed |
| US-20010021750-A1 | Polymer compound, method of producing the same, photosensitive composition, and pattern formation method | TOYO GOSEI KOGYO CO., LTD. (JP) | 2001-09-13 | — | — | US | disclosed |
| US-6288191-B1 | TRANSITION METAL CATALYST COMPLEX INCLUDES ORGANOALUMINUM AND ORGANOBORON COMPOUNDS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-09-11 | — | — | US | disclosed |
| WO-2001051280-A2 | LAMINAR ARTICLES CONTAINING LAYERS OF ETHYLENE CONTAINING POLYMER ELASTOMERS CONTAINING AROMATIC RESINS | EXXONMOBIL CHEMICAL PATENTS, INC. (US) | 2001-07-19 | — | — | WO | disclosed |
| EP-1117005-A1 | Polymer compound, method of producing the same, photosensitive composition, and pattern formation method | Toyo Gosei Kogyo Co., Ltd. (JP) | 2001-07-18 | — | — | EP | disclosed |
| US-6225424-B1 | USED IN THE INDUSTRIAL FIELDS FOR PRODUCTION OF SEMICONDUCTOR UNITS AND FINE MACHINING PARTS, OR IN PRODUCTION OF CHEMICALS | TOSOH CORPORATION (JP) | 2001-05-01 | — | — | US | disclosed |
| EP-1081111-A1 | ACRYLIC PREMIX, ACRYLIC ARTIFICIAL MARBLE, AND PROCESS FOR PRODUCING THE SAME | Mitsubishi Rayon Co., Ltd. (JP) | 2001-03-07 | — | — | EP | disclosed |
| US-6197895-B1 | ADDING A CERTAIN AMOUNT OF AN ORGANIC PEROXIDE INTO THE REACTION VESSEL TO SHORTEN THE TIME FOR CHLORINATION REACTION WITHOUT SACRIFICING THE INITIAL COLORING AND THE HEAT STABILITY | KANEKA CORPORATION (JP) | 2001-03-06 | — | — | US | disclosed |
| EP-1078727-A1 | Polyolefin blend containing delustering agent and molded product therefrom having varied wall thickness | TOYODA GOSEI CO., LTD. (JP) | 2001-02-28 | — | — | EP | disclosed |
| US-6171748-B1 | COMPRISING SUPPORT AND RECORDING LAYER WHICH COMPRISES A POLYVALENT METAL ION AND HYDROPHILIC BINDER POLYMER HAVING LEWIS BASE PORTION CONTAINING NITROGEN, OXYGEN OR SULFUR AND WHICH HAS OLEOPHILIC IMAGE AREA AND HYDROPHILIC NON-IMAGE AREA | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 2001-01-09 | — | — | US | disclosed |
| US-6166143-A | Thermoplastic elastomer composition, hose comprising thermoplastic elastomer composition and process of production thereof | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2000-12-26 | — | — | US | disclosed |
| EP-1057843-A1 | Aqueous emulsion, process for producing the same and aqueous paint and aqueous printing ink comprising the same | NIPPON POLYURETHANE INDUSTRY CO. LTD. (JP) | 2000-12-06 | — | — | EP | disclosed |
| US-6084046-A | ETHYLENE-ALPHA OLEFIN-BRANCHED CONJUGATED POLYVALENT OLEFIN TERPOLYMER HAVING NARROW MOLECULAR WEIGHT DISTRIBUTION; CROSSLINKED POLYMER HAVING HEAT RESISTANCE; MADE USING A COMPLEX OF A GROUP 4 TRANSITION METAL AS CATAYST | SUMITOMO CHEMICAL COMPANY, LIMTED (JP) | 2000-07-04 | — | — | US | disclosed |
| EP-0976786-A1 | (METH)ACRYLIC PREMIX, (METH)ACRYLIC SMC OR BMC, AND PROCESS FOR PRODUCING (METH)ACRYLIC ARTIFICIAL MARBLE | MITSUBISHI RAYON COMPANY, LTD. (JP) | 2000-02-02 | — | — | EP | disclosed |
| EP-0949088-A1 | PLATE FOR DIRECT THERMAL LITHOGRAPHY AND PROCESS FOR PRODUCING THE SAME | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0940419-A1 | AROMATIC COPOLYMER AND COMPOSITION CONTAINING THE SAME | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1999-09-08 | — | — | EP | disclosed |
| EP-0685521-B1 | Rubber composition | IDEMITSU PETROCHEMICAL CO (JP) | 1998-12-23 | — | — | EP | disclosed |
| US-5852135-A | Thermoplastic resin compositions and a method of producing the same | POLYPLASTICS CO., LTD. (JP) | 1998-12-22 | — | — | US | disclosed |
| EP-0870800-A1 | THERMOPLASTIC ELASTOMER COMPOSITIONS, HOSE MADE BY USING THERMOPLASTIC ELASTOMER COMPOSITION, AND PROCESS FOR THE PRODUCTION THEREOF | THE YOKOHAMA RUBBER CO., LTD. (JP) | 1998-10-14 | — | — | EP | disclosed |
| EP-0646476-B1 | LITHOGRAPHIC PRINTING ORIGINAL PLATE AND METHOD FOR PRODUCING THE SAME | ASAHI CHEMICAL IND (JP) | 1998-06-24 | — | — | EP | disclosed |
| EP-0771848-A1 | THERMOPLASTIC RESIN COMPOSITION AND PROCESS FOR PRODUCTION THEREOF | POLYPLASTICS CO. LTD. (JP) | 1997-05-07 | — | — | EP | disclosed |
| US-5569573-A | Lithographic printing original plates and platemaking process using the same | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1996-10-29 | — | — | US | disclosed |
| US-5569716-A | COMPRISING A HYDROCARBON RUBBER, A VULCANIZING OR CROSSLINKING AGENT AND A HYDROGENATED PETROLEUM RESIN | IDEMITSU PETROCHEMICAL CO., LTD. (JP) | 1996-10-29 | — | — | US | disclosed |
| EP-0453204-B1 | Composition for cross-linking of ethylene-polymer, method for cross-linking ethylene-polymer, and cross-linkable composition | NIPPON OILS & FATS CO LTD (JP) | 1996-07-24 | — | — | EP | disclosed |
| EP-0685521-A1 | Rubber composition | IDEMITSU PETROCHEMICAL CO., LTD. (JP) | 1995-12-06 | — | — | EP | disclosed |
| CN-1107276-A | Lithographic printing original plate and method for making plate using the same | ASAHI CHEMICAL IND (JP) | 1995-08-23 | — | — | CN | disclosed |
| EP-0646476-A1 | LITHOGRAPHIC PRINTING ORIGINAL PLATE AND METHOD FOR PRODUCING THE SAME | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1995-04-05 | — | — | EP | disclosed |
| US-5346926-A | Small diameter electric wire insulated with highly expanded cellular polyethylene and production thereof | NIPPON UNICAR COMPANY LIMITED (JP) | 1994-09-13 | — | — | US | disclosed |
| US-5298564-A | Crosslinker is 2,4-diphenyl-4-methyl-1-pentene | NIPPON OIL & FATS CO., LTD. (JP) | 1994-03-29 | — | — | US | disclosed |
| EP-0310304-B1 | Visible light-curing polyester resin composition | NIPPON OILS & FATS CO LTD (JP) | 1993-11-18 | — | — | EP | disclosed |
| US-5214103-A | ETHYLENE-PROPYLENE TYPE RUBBER COMPOSITION | TOYODA GOSEI CO., LTD. (JP) | 1993-05-25 | — | — | US | disclosed |
| EP-0453204-A1 | Composition for cross-linking of ethylene-polymer, method for cross-linking ethylene-polymer, and cross-linkable composition | NIPPON OIL AND FATS COMPANY, LIMITED (JP) | 1991-10-23 | — | — | EP | disclosed |
| US-5017626-A | Photocuring agent, unsaturated polyester | NIPPON OIL & FATS CO., LTD. (JP) | 1991-05-21 | — | — | US | disclosed |
| EP-0310304-A2 | Visible light-curing polyester resin composition | NIPPON OIL AND FATS COMPANY, LIMITED (JP) | 1989-04-05 | — | — | EP | disclosed |
| US-4093786-A | CYCLODODECANONE AND TERT-BUTYLHYDROPEROXIDE, USED AS CROSSLINKING AGENT | NIHON YUSHI CO., LTD. (JA) | 1978-06-06 | — | — | US | disclosed |
| US-4093786-A | CYCLODODECANONE AND TERT-BUTYLHYDROPEROXIDE, USED AS CROSSLINKING AGENT | NIHON YUSHI CO., LTD. (JA) | 1978-06-06 | — | — | US | disclosed |
| US-4093786-A | CYCLODODECANONE AND TERT-BUTYLHYDROPEROXIDE, USED AS CROSSLINKING AGENT | NIHON YUSHI CO., LTD. (JA) | 1978-06-06 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (48 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20210070683-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | RER1, RTN4, FEM1B | TSHR 4095/4885TDP1 4348/4885 |
| US-12565608-B2 | Thermally conductive resin composition | ITGAM, RAE1, FCGR1A | TSHR 3863/4885TDP1 1752/4885 |
| US-20260079418-A1 | BLACK TONER | DOT1L, ZFR, HEATR1 | TSHR 1283/4885TDP1 580/4885 |
| US-20040006154-A1 | Deantal catalyst for chemical polymerization and use thereof | MPO, DBN1, BRD1 | TSHR 3239/4885TDP1 262/4885 |
| US-12590653-B2 | Fuel hose | HAO2, HOGA1, FGB | TSHR 4349/4885TDP1 3061/4885 |
| US-12566404-B2 | Process cartridge | C5AR1, C5AR2, C1R | TSHR 94/4885TDP1 1227/4885 |
| US-20210003921-A1 | COMPOUND, RESIN, COMPOSITION, AND FILM FORMING MATERIAL FOR LITHOGRAPHY USING THE SAME | COL1A1, MLLT3, F12 | TSHR 2642/4885TDP1 4068/4885 |
| US-12584047-B2 | Electrically peelable adhesive composition, electrically peelable adhesive product, and utilization thereof | FGB, FN1, EPCAM | TSHR 1494/4885TDP1 2780/4885 |
| US-12535751-B2 | Toner particle having hydrotalcite particle containing fluorine | H1-2, H1-4, H1-0 | TSHR 57/4885TDP1 222/4885 |
| US-20200361843-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD, CIRCUIT PATTERN FORMATION METHOD AND METHOD FOR PURIFYING RESIN | C5, C9, C1R | TSHR 2036/4885TDP1 4403/4885 |
| US-20260109860-A1 | HEAT-CURABLE RESIN COMPOSITION | RAD51, COL2A1, SEM1 | TSHR 3628/4885TDP1 810/4885 |
| US-12577432-B2 | Organosilicon compound, production method therefor, and curable composition | ASH2L, DOT1L, DNMT3L | TSHR 4783/4885TDP1 3128/4885 |
| US-20180171038-A1 | CURABLE COMPOSITION | KAT2B, ACR, GK | TSHR 3925/4885TDP1 1587/4885 |
| US-20210070727-A1 | COMPOUND, RESIN, COMPOSITION AND PATTERN FORMATION METHOD | RDX, RTN4, CROCC | TSHR 4686/4885TDP1 3972/4885 |
| US-20190278180-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | RER1, RTN4, NBAS | TSHR 2526/4885TDP1 4782/4885 |
| US-20180187026-A1 | CURABLE COMPOSITION | AZI2, KAT2A, KAT2B | TSHR 3370/4885TDP1 1072/4885 |
| US-11013668-B2 | Two-package dental adhesive composition | ITGB2, ITGA2, ITGA2B | TSHR 4323/4885TDP1 4278/4885 |
| US-20100119737-A1 | LIQUID CRYSTALLINE COMPOUND, LIQUID CRYSTALLINE COMPOSITION, OPTICAL FILM, AND OPTICAL LAMINATE | PYM1, TCF4, CRYAA | TSHR 4378/4885TDP1 2969/4885 |
| US-20210070685-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | RER1, RTN4, FEM1B | TSHR 4095/4885TDP1 4348/4885 |
| US-20160297951-A1 | GLYCOLURILS HAVING FUNCTIONAL GROUPS AND USE THEREOF | ELOVL5, DEGS1, ACSL5 | TSHR 2777/4885TDP1 4707/4885 |
| US-20200247739-A1 | COMPOUND, RESIN, COMPOSITION, PATTERN FORMATION METHOD, AND PURIFICATION METHOD | CROCC, RDX, RBBP9 | TSHR 4572/4885TDP1 3169/4885 |
| US-12529971-B2 | Process cartridge | LBR, TECR, MYH2 | TSHR 128/4885TDP1 1512/4885 |
| US-10611856-B2 | Curable composition | ACR, KAT2B, KAT5 | TSHR 3296/4885TDP1 1521/4885 |
| US-20150038614-A1 | POWDER-LIQUID DENTAL CURABLE MATERIAL KIT | PRKD1, SETDB1, HELZ | TSHR 3173/4885TDP1 1889/4885 |
| US-20130274426-A1 | DENTAL CURABLE COMPOSITION | BAZ2B, BRPF3, SHH | TSHR 3521/4885TDP1 3467/4885 |
| US-12624140-B2 | Composition containing compound having polyoxyalkylene chain | PIEZO1, HVCN1, TAF11 | TSHR 3431/4885TDP1 875/4885 |
| US-20250388767-A1 | METHOD FOR PRODUCING VARNISH-LIKE CYCLIC OLEFIN COPOLYMER COMPOSITION, CYCLIC OLEFIN COPOLYMER COMPOSITION, CROSSLINKED PRODUCT, FILM, OR SHEET, LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND PREPREG | RB1, RAD1, MALT1 | TSHR 1578/4885TDP1 2150/4885 |
| US-20190240117-A1 | TWO-PACKAGE DENTAL ADHESIVE COMPOSITION | ITGB2, ITGA2, ITGA2B | TSHR 4323/4885TDP1 4278/4885 |
| US-20110281025-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIALS, AND (METH) ACRYLOYL GROUP-CONTAINING UREA COMPOUND | METTL14, METTL3, ALKBH5 | TSHR 4452/4885TDP1 4107/4885 |
| US-12617940-B2 | Curable composition and cured material | MAT2B, MMAB, RAD51 | TSHR 3577/4885TDP1 1524/4885 |
| US-12545815-B2 | Protective sheet | ACR, CDH1, ICAM1 | TSHR 4608/4885TDP1 1698/4885 |
| US-20260118791-A1 | TONER | MSR1, H1-2, TAAR1 | TSHR 165/4885TDP1 90/4885 |
| US-12631982-B2 | Toner | H1-2, H1-0, H1-4 | TSHR 108/4885TDP1 806/4885 |
| US-12606723-B2 | Thermosetting resin composition, semiconductor device and electrical/electronic component | RPS3A, SEM1, DAP3 | TSHR 2169/4885TDP1 1515/4885 |
| US-12541172-B2 | Process cartridge | MSR1, C1R, C5AR1 | TSHR 209/4885TDP1 628/4885 |
| US-10000622-B2 | Glycolurils having functional groups and use thereof | ELOVL5, DEGS1, ACSL5 | TSHR 2777/4885TDP1 4707/4885 |
| US-20260064023-A1 | DEVELOPING APPARATUS, PROCESS CARTRIDGE, AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS | TECR, LBR, EZR | TSHR 1306/4885TDP1 807/4885 |
| US-20040132620-A1 | Melt knead graft polymerization with polar functionalized monomer; high level of incorporation | PPID, GRIN2D, KLHDC2 | TSHR 4045/4885TDP1 3818/4885 |
| US-20260002054-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | COL2A1, COL1A1, SMC2 | TSHR 4507/4885TDP1 2119/4885 |
| US-20240059929-A1 | ORGANOSILICON COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE COMPOSITION | CYP51A1, CYP4F11, FAR1 | TSHR 4303/4885TDP1 2536/4885 |
| US-12585209-B2 | Toner | EWSR1, MLLT3, AFF4 | TSHR 47/4885TDP1 210/4885 |
| US-12596315-B2 | Toner | EWSR1, RUNX1, VMA21 | TSHR 190/4885TDP1 485/4885 |
| US-10619058-B2 | Curable composition | ZMYND8, AZI2, KAT2A | TSHR 3179/4885TDP1 837/4885 |
| US-20120059079-A1 | DUAL-CURE CURABLE MATERIAL KIT | KIT, DSTYK, H1-5 | TSHR 4729/4885TDP1 3096/4885 |
| US-12596325-B2 | Process cartridge | VMA21, VSIR, C1R | TSHR 314/4885TDP1 914/4885 |
| US-12624141-B2 | Composition set containing compound having polyoxyalkylene chain | SET, SETD1B, SETDB1 | TSHR 3995/4885TDP1 2220/4885 |
| US-20130197123-A1 | DIENE-BASED CARBOXYLATE ANION AND SALT THEREOF, AND POLYMERIZABLE OR CURABLE COMPOSITION THEREOF | MIF, DCTN1, CDH1 | TSHR 4643/4885TDP1 2367/4885 |
| US-20200166844-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | LIPA, LCLAT1, LCAT | TSHR 4660/4885TDP1 1648/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.