SCHEMBL687878

SCHEMBL687878

CN(C)C(=O)Nc1ccc(NC(=O)N(C)C)cc1

nearest known ligand 0.83

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.79
CA12 O43570 1/20 0.68
CA1 P00915 1/20 0.68
CA2 P00918 1/20 0.68
CA9 Q16790 1/20 0.68
APEX1 P27695 1/20 0.64
MEN1 O00255 1/20 0.52
KMT2A Q03164 1/20 0.52
TDP1 Q9NUW8 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8428436 0.91 TSHR (0.68) TSHRCA12CA1CA2CA9
SCHEMBL4770587 0.91 TSHR (0.68) TSHRCA12CA1CA2CA9
Monuron SCHEMBL106717 0.89 TSHR (1.00) TSHRCA12CA1CA2CA9
SCHEMBL11747424 0.89 TSHR (0.66) TSHRCA12CA1CA2CA9
SCHEMBL6714621 0.89 TSHR (0.66) TSHRCA12CA1CA2CA9
Monuron SCHEMBL8539289 0.89 TSHR (1.00) TSHRCA12CA1CA2CA9
SCHEMBL3649968 0.89 TSHR (0.66) TSHRCA12CA1CA2CA9
SCHEMBL12292880 0.89 TSHR (0.66) TSHRCA12CA1CA2CA9
SCHEMBL148345 0.89 MEN1 (0.68) TSHRCA12CA1CA2CA9
SCHEMBL9128489 0.89 TSHR (0.66) TSHRCA12CA1CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9663609-B2 Use of N,N′-(dimethyl) urones and method for curing epoxy resin compositions ALZCHEM AG (DE) 2017-05-30 US claimed
EP-2780388-B1 USE OF N,N'-(DIMETHYL) URONS AND METHOD FOR CURING EPOXY RESIN COMPOSITIONS ALZCHEM AG (DE) 2015-05-06 EP claimed
US-20140357762-A1 USE OF N,N'-(DIMETHYL) URONES AND METHOD FOR CURING EPOXY RESIN COMPOSITIONS ALZCHEM AG (DE) 2014-12-04 US claimed
US-5214098-A Dicyandiamide, impregnation of fiber composites, prepregs CIBA-GEIGY CORPORATION (US) 1993-05-25 US claimed
EP-4526365-A1 ACRYLATE-EPOXY RESIN COMPOSITIONS Lyondellbasell Composites LLC (US) 2025-03-26 EP disclosed
US-20230416522-A1 ACRYLATE-EPOXY RESIN COMPOSITIONS LYONDELLBASELL COMPOSITES LLC (US) 2023-12-28 US disclosed
WO-2023234394-A1 ASYMMETRIC DIAMINE-CONTAINING AGENT AND RESIN, AND USE THEREOF 住友化学株式会社 2023-12-07 WO disclosed
WO-2023225151-A1 ACRYLATE-EPOXY RESIN COMPOSITIONS LYONDELLBASELL COMPOSITES LLC (US) 2023-11-23 WO disclosed
EP-3262110-B1 IMPREGNATING RESINS WHICH ARE STABLE WHEN STORED AND ELECTRO ISOLATION TAPES SIEMENS ENERGY GLOBAL GMBH & CO KG (DE) 2023-03-29 EP disclosed
US-11332607-B2 Epoxy resin formulations HEXCEL COMPOSITES LIMITED (GB) 2022-05-17 US disclosed
US-20210214550-A1 EPOXY RESIN FORMULATIONS HEXCEL COMPOSITES LIMITED (GB) 2021-07-15 US disclosed
US-20210139390-A1 PRODUCTION METHOD OF ORGANIC COMPOUND UNITIKA LTD. (JP) 2021-05-13 US disclosed
EP-0559607-A2 Epoxy resins based on triglycidyl isocyanurate CIBA-GEIGY AG (CH) 1993-09-08 EP disclosed
US-5214098-A Dicyandiamide, impregnation of fiber composites, prepregs CIBA-GEIGY CORPORATION (US) 1993-05-25 US disclosed
EP-0523001-A1 Curable epoxy resin composition containing a blocked accelerator CIBA-GEIGY AG (CH) 1993-01-13 EP disclosed
EP-0514335-A2 Curable epoxy resin mixtures containing a latent curing agent, an amine and a dithiol CIBA-GEIGY AG (CH) 1992-11-19 EP disclosed
EP-0429395-A2 Curable epoxy resin composition containing a latent curing agent, an amine and a thiol CIBA-GEIGY AG (CH) 1991-05-29 EP disclosed
EP-0024526-B1 EPOXY BASED SYNTHETIC SOLDER AMERICAN CYANAMID COMPANY (US) 1984-06-13 EP disclosed
US-4273686-A 1,1'-O-PHENYLENEBIS(3,3-DIMETHYLUREA), DICYANDIAMIDE, FILLER, QUICK-SETTING AMERICAN CYANAMID COMPANY (US) 1981-06-16 US disclosed
EP-0024526-A2 Epoxy based synthetic solder AMERICAN CYANAMID COMPANY (US) 1981-03-11 EP disclosed