Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PSMD14 | O00487 | 4/20 | 0.61 |
| ▸ | COPS5 | Q92905 | 4/20 | 0.61 |
| ▸ | NR4A2 | P43354 | 3/20 | 0.61 |
| ▸ | NCF1 | P14598 | 2/20 | 0.48 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.47 |
| ▸ | HSP90AB1 | P08238 | 2/20 | 0.47 |
| ▸ | IDO1 | P14902 | 1/20 | 0.47 |
| ▸ | PSMB5 | P28074 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.41 |
| ▸ | TSHR | P16473 | 3/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.41 |
| ▸ | HPGD | P15428 | 2/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | MMP14 | P50281 | 1/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | APAF1 | O14727 | 1/20 | 0.38 |
| ▸ | TDP2 | O95551 | 1/20 | 0.38 |
| ▸ | CASP3 | P42574 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31157800 | 1.00 | PSMD14 (0.61) | PSMD14COPS5NR4A2NCF1HSP90AA1 | |
| SCHEMBL689296 | 0.84 | HSP90AA1 (0.61) | PSMD14COPS5NR4A2NCF1HSP90AA1 | |
| SCHEMBL31157835 | 0.84 | HSP90AA1 (0.61) | PSMD14COPS5NR4A2NCF1HSP90AA1 | |
| SCHEMBL30668493 | 0.81 | NR4A2 (0.68) | NR4A2NCF1HSP90AA1HSP90AB1IDO1 | |
| SCHEMBL6629560 | 0.81 | NR4A2 (0.68) | NR4A2NCF1HSP90AA1HSP90AB1IDO1 | |
| SCHEMBL15703126 | 0.76 | PSMD14 (1.00) | PSMD14COPS5NR4A2HSP90AA1ALDH1A1 | |
| SCHEMBL6615706 | 0.76 | NR4A2 (0.61) | NR4A2NCF1HSP90AA1HSP90AB1IDO1 | |
| SCHEMBL440408 | 0.76 | NR4A2 (0.61) | NR4A2NCF1HSP90AA1HSP90AB1IDO1 | |
| SCHEMBL11160796 | 0.76 | NR4A2 (0.61) | PSMD14COPS5NR4A2NCF1HSP90AA1 | |
| SCHEMBL10009591 | 0.76 | NR4A2 (1.00) | NR4A2NCF1HSP90AA1HSP90AB1IDO1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 140 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1630605-B1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2017-10-11 | — | — | EP | claimed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4553100-A1 | POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-14 | — | — | EP | disclosed |
| CN-119955091-A | Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-05-09 | — | — | CN | disclosed |
| EP-1496395-A2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-12 | — | — | EP | disclosed |
| EP-1475665-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-11-10 | — | — | EP | disclosed |
| US-20040197703-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-10-07 | — | — | US | disclosed |
| US-20040053156-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |
| EP-1365289-A1 | PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME | TORAY INDUSTRIES, INC. (JP) | 2003-11-26 | — | — | EP | disclosed |
| US-20030194631-A1 | Precursor composition for positive photosensitive resin and display made with the same | TORAY INDUSTRIES, INC. (JP) | 2003-10-16 | — | — | US | disclosed |
| US-6593043-B2 | Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. | TORAY INDUSTRIES, INC. (JP) | 2003-07-15 | — | — | US | disclosed |
| US-20020090564-A1 | Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. | TORAY INDUSTRIES, INC. (JP) | 2002-07-11 | — | — | US | disclosed |
| EP-1209523-A2 | Composition of positive photosensitive resin precursor, and display device made thereof | TORAY INDUSTRIES, INC. (JP) | 2002-05-29 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | PSMD14 277/4885COPS5 1170/4885NR4A2 963/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | PSMD14 1742/4885COPS5 2995/4885NR4A2 1062/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.