SCHEMBL6880430

SCHEMBL6880430

[CH2]CCCCCCCCCC(=O)OCCCCCCCC

nearest known ligand 0.71

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.71
PRSS1 P07477 1/20 0.64
PRSS2 P07478 1/20 0.64
PRSS3 P35030 1/20 0.64
NAAA Q02083 1/20 0.60
DNM1 Q05193 1/20 0.59
HTR2C P28335 1/20 0.57
TSHR P16473 3/20 0.56
PAM P19021 2/20 0.55
MAPT P10636 1/20 0.51
RAD52 P43351 1/20 0.51
NPSR1 Q6W5P4 1/20 0.51
FAAH O00519 1/20 0.50
ALDH1A1 P00352 1/20 0.50
LMNA P02545 1/20 0.50
EPHX2 P34913 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11259258 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL10889541 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL8815441 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL7839329 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL7840375 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL7839300 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL7840371 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL7838000 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL1888899 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA
SCHEMBL7836216 1.00 DGKA (0.71) DGKAPRSS1PRSS2PRSS3NAAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100457823-C Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof MITSUI CHEMICALS INC (JP) 2009-02-04 CN disclosed
CN-1285636-C Process for producing oxyalkylene derivative MITSUI CHEMICALS INC (JP) 2006-11-22 CN disclosed
CN-1781985-A Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof MITSUI CHEMICALS INC (JP) 2006-06-07 CN disclosed
CN-1200915-C Process for preparing organic compound MITSUI CHEMICALS INC (JP) 2005-05-11 CN disclosed
CN-1592764-A Method for producing organic compound, epoxy resin composition, cured product of the epoxy resin, and semiconductor device formed using the epoxy resin MITSUI CHEMICALS INC (JP) 2005-03-09 CN disclosed
US-20040260039-A1 Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin MITSUI CHEMICALS, INC. (JP) 2004-12-23 US disclosed
EP-0950649-B1 A process for preparing oxyalkylene derivatives in the presence of phosphine oxides MITSUI CHEMICALS INC (JP) 2003-03-26 EP disclosed
US-6130346-A ESTERIFICATION, CARBONATION, SULFONATION, ETHERIFICATION MITSUI CHEMICALS, INC. (JP) 2000-10-10 US disclosed
CN-1235141-A Process for preparing organic compound MITSUI CHEMICALS INC (JP) 1999-11-17 CN disclosed
EP-0950649-A1 A process for preparing oxyalkylene derivatives in the presence of phosphine oxides Mitsui Chemicals, Inc. (JP) 1999-10-20 EP disclosed