SCHEMBL6881386

SCHEMBL6881386

[CH2]CCCCCCCC(=O)OC1CCCCC1

nearest known ligand 0.70

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 2/20 0.70
SMN1; SMN2 Q16637 1/20 0.47
CYP2C19 P33261 1/20 0.45
HTT P42858 2/20 0.42
CYP19A1 P11511 2/20 0.41
EPHX1 P07099 2/20 0.40
EPHX2 P34913 1/20 0.38
ALDH1A1 P00352 4/20 0.37
LMNA P02545 2/20 0.37
KDM4E B2RXH2 1/20 0.37
HPGD P15428 1/20 0.37
RAB9A P51151 1/20 0.35
GAA P10253 1/20 0.34
PDE3B Q13370 1/20 0.34
PDE3A Q14432 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8894596 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL7695902 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL8894124 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL8896978 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL7691549 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL7694024 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL8893818 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL8894303 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL8895102 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1
SCHEMBL8896532 1.00 NAAA (0.70) NAAASMN1; SMN2CYP2C19HTTCYP19A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100457823-C Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof MITSUI CHEMICALS INC (JP) 2009-02-04 CN disclosed
CN-1285636-C Process for producing oxyalkylene derivative MITSUI CHEMICALS INC (JP) 2006-11-22 CN disclosed
CN-1781985-A Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof MITSUI CHEMICALS INC (JP) 2006-06-07 CN disclosed
CN-1200915-C Process for preparing organic compound MITSUI CHEMICALS INC (JP) 2005-05-11 CN disclosed
CN-1592764-A Method for producing organic compound, epoxy resin composition, cured product of the epoxy resin, and semiconductor device formed using the epoxy resin MITSUI CHEMICALS INC (JP) 2005-03-09 CN disclosed
US-20040260039-A1 Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin MITSUI CHEMICALS, INC. (JP) 2004-12-23 US disclosed
EP-0950649-B1 A process for preparing oxyalkylene derivatives in the presence of phosphine oxides MITSUI CHEMICALS INC (JP) 2003-03-26 EP disclosed
US-6130346-A ESTERIFICATION, CARBONATION, SULFONATION, ETHERIFICATION MITSUI CHEMICALS, INC. (JP) 2000-10-10 US disclosed
CN-1235141-A Process for preparing organic compound MITSUI CHEMICALS INC (JP) 1999-11-17 CN disclosed
EP-0950649-A1 A process for preparing oxyalkylene derivatives in the presence of phosphine oxides Mitsui Chemicals, Inc. (JP) 1999-10-20 EP disclosed
US-5670563-A ORGANOTIN COMPOUND, PHOSPHORUS COMPOUND CIBA-SPECIALTY CHEMICALS CORPORATION (US) 1997-09-23 US disclosed