2-Methoxyethanol

2-Methoxyethanol

SCHEMBL6881752

CC(C)=O.COCCO

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109293472-B Method for preparing enol from alkynol through partial hydrogenation 万华化学集团股份有限公司 2021-12-10 CN disclosed
WO-2021066036-A1 PRESSURE-SENSITIVE ADHESIVE SHEET 王子ホールディングス株式会社 2021-04-08 WO disclosed
WO-2021066037-A1 ADHESIVE SHEET AND METHOD FOR MANUFACTURING ADHESIVE SHEET 王子ホールディングス株式会社 2021-04-08 WO disclosed
WO-2021033704-A1 ADHESIVE SHEET, ADHESIVE SHEET WITH RELEASE SHEET, LAMINATE, AND METHOD FOR PRODUCING LAMINATE 王子ホールディングス株式会社 2021-02-25 WO disclosed
WO-2020256068-A1 ADHESIVE SHEET, ADHESIVE SHEET WITH RELEASE SHEET, AND MULTILAYER BODY 王子ホールディングス株式会社 2020-12-24 WO disclosed
WO-2020256067-A1 ADHESIVE SHEET, ADHESIVE SHEET WITH RELEASE SHEET, AND MULTILAYER BODY 王子ホールディングス株式会社 2020-12-24 WO disclosed
WO-2020235460-A1 ADHESIVE SHEET, ADHESIVE SHEET WITH RELEASE SHEET, AND METHOD FOR PRODUCING LAMINATE 王子ホールディングス株式会社 (JP) 2020-11-26 WO disclosed
CN-105835360-A Three-dimensionally shaped article production member, three-dimensionally shaped article production apparatus, three-dimensionally shaped article production method, and three-dimensionally shaped article 精工爱普生株式会社 2016-08-10 CN disclosed
US-6822009-B2 Method for reclaiming waste cured resin MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2004-11-23 US disclosed
US-20020169222-A1 Method for reclaiming waste cured resin MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2002-11-14 US disclosed
US-4912011-A Polymerizable compound and color image forming substances are encapsulated FUJI PHOTO FILM CO., LTD. (JP) 1990-03-27 US disclosed
US-4902599-A CONTAINING HYDRAZIDE AND HYDROZINE COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1990-02-20 US disclosed
EP-0203613-B1 LIGHT-SENSITIVE MATERIAL CONTAINING MICROCAPSULES AND IMAGE-RECORDING METHOD USING THE SAME FUJI PHOTO FILM CO., LTD. (JP) 1989-10-25 EP disclosed
US-4792514-A LIGHT-SENSITIVE SILVER HALIDE, POLYMERIZABLE COMPOUND, COLOR-IMAGE-FORMING SUBSTANCE, AND HYDRAZINE DERIVATIVE FUJI PHOTO FILM CO., LTD. (JP) 1988-12-20 US disclosed
EP-0219087-A2 Light-sensitive material FUJI PHOTO FILM CO., LTD. (JP) 1987-04-22 EP disclosed
EP-0203613-A2 Light-sensitive material containing microcapsules and image-recording method using the same FUJI PHOTO FILM CO., LTD. (JP) 1986-12-03 EP disclosed
US-4550051-A EPOXY RESIN IMPREGNATED GLASS FIBERS EXTERIOR PLIES AND TEXTILE OROR THERMO = PLASTIC CORE DYNAMIT NOBEL AKTIENGESELLSCHAFT (DE) 1985-10-29 US disclosed
US-4201590-A Heat sensitive reactive products of hexaarylbiimidazole and antihalation dyes EASTMAN KODAK COMPANY (US) 1980-05-06 US disclosed
US-4196002-A HEXAARYLBISMIIDAZOLE, COLORLESS EASTMAN KODAK COMPANY (US) 1980-04-01 US disclosed
US-3980654-A Copper (II) complexes EASTMAN KODAK COMPANY (US) 1976-09-14 US disclosed