SCHEMBL6883645

SCHEMBL6883645

[CH2]CCCC(=O)OC(=O)CCCCCCC

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.55
LMNA P02545 2/20 0.52
TSHR P16473 4/20 0.52
ALDH1A1 P00352 3/20 0.50
PAM P19021 2/20 0.50
MAPT P10636 2/20 0.48
MAPK1 P28482 1/20 0.48
CES2 O00748 3/20 0.48
CES1 P23141 3/20 0.48
PPARG P37231 4/20 0.46
PPARD Q03181 4/20 0.46
PPARA Q07869 4/20 0.46
GPR84 Q9NQS5 3/20 0.46
HDAC11 Q96DB2 3/20 0.46
TDP1 Q9NUW8 2/20 0.46
SLC22A6 Q4U2R8 1/20 0.46
SLC22A8 Q8TCC7 1/20 0.46
TLR2 O60603 1/20 0.46
MEN1 O00255 1/20 0.46
ESR1 P03372 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Dodecanoic Anhydride SCHEMBL27486466 0.89 DGKA (0.61) DGKALMNATSHRALDH1A1PAM
SCHEMBL62055 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM
SCHEMBL152597 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM
SCHEMBL2727904 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM
SCHEMBL20529845 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM
SCHEMBL11637246 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM
SCHEMBL7154415 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM
SCHEMBL11577267 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM
Dodecanoic Anhydride SCHEMBL468394 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM
SCHEMBL21647233 0.89 DGKA (0.67) DGKALMNATSHRALDH1A1PAM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040260039-A1 Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin MITSUI CHEMICALS, INC. (JP) 2004-12-23 US disclosed
EP-0950649-B1 A process for preparing oxyalkylene derivatives in the presence of phosphine oxides MITSUI CHEMICALS INC (JP) 2003-03-26 EP disclosed
US-6130346-A ESTERIFICATION, CARBONATION, SULFONATION, ETHERIFICATION MITSUI CHEMICALS, INC. (JP) 2000-10-10 US disclosed
EP-0950649-A1 A process for preparing oxyalkylene derivatives in the presence of phosphine oxides Mitsui Chemicals, Inc. (JP) 1999-10-20 EP disclosed