Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | UHRF1 | Q96T88 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8912720 | 0.81 | UHRF1 (0.32) | UHRF1 | |
| SCHEMBL16475157 | 0.75 | HTT (0.33) | — | |
| SCHEMBL22421333 | 0.65 | — | — | |
| SCHEMBL16475146 | 0.65 | HTT (0.33) | — | |
| SCHEMBL7760687 | 0.65 | — | — | |
| SCHEMBL1133874 | 0.64 | IDO1 (0.46) | KDM4EALDH1A1 | |
| SCHEMBL13514472 | 0.63 | — | — | |
| SCHEMBL7841596 | 0.63 | — | — | |
| SCHEMBL2285780 | 0.63 | — | — | |
| SCHEMBL4583821 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117487162-A | Polyimide precursor capable of being cured at low temperature and preparation method thereof | 南通晶爱微电子科技有限公司 | 2024-02-02 | — | — | CN | claimed |
| CN-107001629-B | Resin and photosensitive polymer combination | 东丽株式会社 | 2019-09-24 | — | — | CN | claimed |
| EP-2555053-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2017-10-18 | — | — | EP | claimed |
| EP-2555053-A1 | Positive-type photosensitive resin composition | Toray Industries, Inc. (JP) | 2013-02-06 | — | — | EP | claimed |
| CN-117487162-A | Polyimide precursor capable of being cured at low temperature and preparation method thereof | 南通晶爱微电子科技有限公司 | 2024-02-02 | — | — | CN | disclosed |
| CN-114895527-A | Positive photosensitive resin precursor composition, preparation method and application thereof | 南通晶爱微电子科技有限公司 | 2022-08-12 | — | — | CN | disclosed |
| CN-107407878-B | Photosensitive resin composition | 东丽株式会社 | 2020-11-17 | — | — | CN | disclosed |
| CN-111830786-A | Photosensitive resin composition containing silane coupling agent | 波米科技有限公司 | 2020-10-27 | — | — | CN | disclosed |
| CN-105579907-B | Radiation-sensitive composition and pattern production method | 东京应化工业株式会社 | 2019-12-17 | — | — | CN | disclosed |
| EP-1296540-B1 | DISPLAY | TORAY INDUSTRIES (JP) | 2019-10-16 | — | — | EP | disclosed |
| CN-110333647-A | A kind of positive type photosensitive organic compound | 北京波米科技有限公司 | 2019-10-15 | — | — | CN | disclosed |
| CN-107001629-B | Resin and photosensitive polymer combination | 东丽株式会社 | 2019-09-24 | — | — | CN | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |
| EP-1365289-A1 | PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME | TORAY INDUSTRIES, INC. (JP) | 2003-11-26 | — | — | EP | disclosed |
| US-20030194631-A1 | Precursor composition for positive photosensitive resin and display made with the same | TORAY INDUSTRIES, INC. (JP) | 2003-10-16 | — | — | US | disclosed |
| EP-1296540-A1 | DISPLAY | TORAY INDUSTRIES, INC. (JP) | 2003-03-26 | — | — | EP | disclosed |
| US-6524764-B1 | Alkali-developable; polyamide, phenol compound and/or ester of a naphthoquinone diazide sulphonic acid | TORAY INDUSTRIES, INC. (JP) | 2003-02-25 | — | — | US | disclosed |
| US-20020162998-A1 | Display | TORAY INDUSTRIES, INC. (JP) | 2002-11-07 | — | — | US | disclosed |
| EP-1132773-A1 | POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2001-09-12 | — | — | EP | disclosed |
| EP-1037112-A1 | POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION AND PROCESS FOR PRODUCING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2000-09-20 | — | — | EP | disclosed |