⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8968836 | 0.82 | ESR1 (0.31) | — | |
| SCHEMBL17456821 | 0.78 | ESR1 (0.32) | — | |
| SCHEMBL952880 | 0.73 | MAPT (0.38) | — | |
| SCHEMBL26185015 | 0.71 | MAPT (0.36) | — | |
| SCHEMBL23879680 | 0.71 | MAPT (0.36) | — | |
| SCHEMBL28137896 | 0.70 | — | — | |
| SCHEMBL31410715 | 0.70 | TSHR (0.42) | — | |
| SCHEMBL15006539 | 0.69 | — | — | |
| SCHEMBL124891 | 0.69 | MAPT (0.38) | — | |
| SCHEMBL19603995 | 0.66 | ESR1 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 249 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026097701-A1 | PHOTOSENSITIVE POLYIMIDE COMPOSITION, PATTERN MANUFACTURING METHOD, CURED PRODUCT, AND ELECTRONIC COMPONENT | 江苏艾森半导体材料股份有限公司 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026097702-A1 | PHOTOSENSITIVE COMPOSITION, METHOD FOR PREPARING PATTERN, CURED PRODUCT, AND ELECTRONIC COMPONENT | 江苏艾森半导体材料股份有限公司 | 2026-05-15 | — | — | WO | disclosed |
| EP-4692937-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, HOLLOW STRUCTURE, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER | Toray Industries, Inc. (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4651185-A1 | LAMINATE, SEMICONDUCTOR ELEMENT, AND MEMS ELEMENT | Toray Industries, Inc. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4651186-A1 | METHOD FOR PRODUCING MULTILAYER BODY, AND RESIN COMPOSITION | Toray Industries, Inc. (JP) | 2025-11-19 | — | — | EP | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| EP-1496395-A2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-12 | — | — | EP | disclosed |
| US-20040053156-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |
| EP-1365289-A1 | PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME | TORAY INDUSTRIES, INC. (JP) | 2003-11-26 | — | — | EP | disclosed |
| US-20030194631-A1 | Precursor composition for positive photosensitive resin and display made with the same | TORAY INDUSTRIES, INC. (JP) | 2003-10-16 | — | — | US | disclosed |
| US-6593043-B2 | Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. | TORAY INDUSTRIES, INC. (JP) | 2003-07-15 | — | — | US | disclosed |
| US-6524764-B1 | Alkali-developable; polyamide, phenol compound and/or ester of a naphthoquinone diazide sulphonic acid | TORAY INDUSTRIES, INC. (JP) | 2003-02-25 | — | — | US | disclosed |
| US-20020090564-A1 | Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. | TORAY INDUSTRIES, INC. (JP) | 2002-07-11 | — | — | US | disclosed |
| EP-1209523-A2 | Composition of positive photosensitive resin precursor, and display device made thereof | TORAY INDUSTRIES, INC. (JP) | 2002-05-29 | — | — | EP | disclosed |
| EP-1132773-A1 | POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2001-09-12 | — | — | EP | disclosed |