Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 4/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 7/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 4/20 | 0.37 |
| ▸ | ACHE | P22303 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 11/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 5/20 | 0.36 |
| ▸ | TSHR | P16473 | 3/20 | 0.35 |
| ▸ | TP53 | P04637 | 3/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.33 |
| ▸ | NPC1 | O15118 | 2/20 | 0.33 |
| ▸ | RAB9A | P51151 | 2/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.33 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.33 |
| ▸ | RELA | Q04206 | 1/20 | 0.33 |
| ▸ | TEAD4 | Q15561 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31410715 | 0.82 | TSHR (0.42) | MAPTMEN1KMT2ATDP1MAPK1 | |
| SCHEMBL8916640 | 0.76 | CYP2A6 (0.38) | MAPK1ALDH1A1ALOX15 | |
| SCHEMBL127697 | 0.75 | MAPT (0.42) | MAPTMEN1KMT2ATDP1MAPK1 | |
| SCHEMBL810787 | 0.75 | ESR1 (0.39) | MAPTACHETSHRLMNA | |
| SCHEMBL9472831 | 0.74 | TDP1 (0.32) | MAPTMEN1KMT2ATDP1MAPK1 | |
| SCHEMBL8387696 | 0.74 | CYP3A4 (0.42) | TDP1ALDH1A1CYP3A4TSHRTP53 | |
| SCHEMBL9577405 | 0.73 | ESR1 (0.38) | MAPT | |
| SCHEMBL689802 | 0.73 | — | — | |
| SCHEMBL22151187 | 0.73 | CYP3A4 (0.43) | MAPTTDP1MAPK1ALDH1A1CYP3A4 | |
| SCHEMBL124891 | 0.71 | MAPT (0.38) | MAPTMEN1KMT2ATDP1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 187 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119613717-B | Thermosetting polyimide resin with high heat resistance and preparation method thereof | SICHUAN UNIVERSITY (CN) | 2026-05-26 | — | — | CN | claimed |
| CN-119613717-A | Thermosetting polyimide resin with high heat resistance and preparation method thereof | 四川大学 | 2025-03-14 | — | — | CN | claimed |
| CN-115073732-B | Block type photosensitive polyimide precursor resin, preparation method thereof and block type photosensitive resin composition | 波米科技有限公司 | 2023-06-02 | — | — | CN | claimed |
| CN-114805810-B | Photosensitive polyimide precursor resin, preparation method and photosensitive resin composition | 波米科技有限公司 | 2023-06-02 | — | — | CN | claimed |
| CN-115073732-A | Block type photosensitive polyimide precursor resin, preparation method thereof and block type photosensitive resin composition | 波米科技有限公司 | 2022-09-20 | — | — | CN | claimed |
| CN-114805810-A | Photosensitive polyimide precursor resin, preparation method thereof and photosensitive resin composition | 波米科技有限公司 | 2022-07-29 | — | — | CN | claimed |
| CN-111704719-B | Thermosetting polyimide resin, prepolymer, preparation method and application | 中国科学院化学研究所 | 2021-07-20 | — | — | CN | claimed |
| EP-0330456-B1 | Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom | CHISSO CORP (JP) | 1994-09-07 | — | — | EP | claimed |
| JP-10087822-A | — | — | None | — | — | JP | disclosed |
| CN-119613717-B | Thermosetting polyimide resin with high heat resistance and preparation method thereof | SICHUAN UNIVERSITY (CN) | 2026-05-26 | — | — | CN | disclosed |
| US-20250291248-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2025-09-18 | — | — | US | disclosed |
| CN-112771447-B | Positive photosensitive resin composition, photosensitive resin film using the same, and electronic device | 三星SDI株式会社 | 2025-06-03 | — | — | CN | disclosed |
| CN-119613717-A | Thermosetting polyimide resin with high heat resistance and preparation method thereof | 四川大学 | 2025-03-14 | — | — | CN | disclosed |
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| US-4687836-A | FROM 3,3*-DIAMINOBENZOPHENONE AND BENZOPHENONETETRACARBOXYLIC ACID | MITSUI TOATSU CHEMICALS, INC. (JP) | 1987-08-18 | — | — | US | disclosed |
| EP-0231953-A2 | Light-absorbing resins for display device, display devices using the resin and method of manufacturing the same | KABUSHIKI KAISHA TOSHIBA (JP) | 1987-08-12 | — | — | EP | disclosed |
| EP-0179604-A2 | Polyimide adhesives, coats and prepreg | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1986-04-30 | — | — | EP | disclosed |
| US-4124651-A | Process for the production of polyamide-polyamide-acid copolymers | CIBA-GEIGY CORPORATION (US) | 1978-11-07 | — | — | US | disclosed |
| US-3950308-A | POLYAMIDES, POLYIMIDES, POLYAMIDE-IMIDES | CIBA-GEIGY CORPORATION (US) | 1976-04-13 | — | — | US | disclosed |
| US-3948835-A | POLYAMIDE, POLYAMIDE-ACID OR POLYAMIDE-AMIDE-ACIDS | CIBA-GEIGY CORPORATION (US) | 1976-04-06 | — | — | US | disclosed |