Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 3/20 | 0.44 |
| ▸ | CA1 | P00915 | 3/20 | 0.44 |
| ▸ | CA2 | P00918 | 3/20 | 0.44 |
| ▸ | CA7 | P43166 | 3/20 | 0.44 |
| ▸ | CA9 | Q16790 | 3/20 | 0.44 |
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.44 |
| ▸ | TPMT | P51580 | 3/20 | 0.42 |
| ▸ | TP53 | P04637 | 2/20 | 0.42 |
| ▸ | CA3 | P07451 | 2/20 | 0.42 |
| ▸ | CA4 | P22748 | 2/20 | 0.42 |
| ▸ | CA6 | P23280 | 2/20 | 0.42 |
| ▸ | CA5A | P35218 | 2/20 | 0.42 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | LMNA | P02545 | 1/20 | 0.42 |
| ▸ | MAPT | P10636 | 1/20 | 0.42 |
| ▸ | SELL | P14151 | 1/20 | 0.42 |
| ▸ | HPGD | P15428 | 1/20 | 0.42 |
| ▸ | SELP | P16109 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27043123 | 0.95 | CA12 (0.44) | CA12CA1CA2CA7CA9 | |
| SCHEMBL2709094 | 0.95 | CA12 (0.44) | CA12CA1CA2CA7CA9 | |
| Hydrochloric Acid SCHEMBL2709004 | 0.93 | CA12 (0.42) | CA12CA1CA2CA7CA9 | |
| Hydrochloric Acid SCHEMBL4432908 | 0.93 | CA12 (0.42) | CA12CA1CA2CA7CA9 | |
| SCHEMBL21151179 | 0.89 | MRGPRX4 (0.43) | CA12CA1CA2CA7CA9 | |
| SCHEMBL5669171 | 0.89 | GLRA3 (0.42) | CA12CA1CA2CA7CA9 | |
| Hydrochloric Acid SCHEMBL6923143 | 0.87 | GLRA3 (0.41) | CA12CA1CA2CA7CA9 | |
| SCHEMBL13671476 | 0.85 | TPMT (0.61) | CA12CA1CA2CA7CA9 | |
| SCHEMBL13671453 | 0.85 | KDM4E (0.42) | CA12CA1CA2CA7CA9 | |
| SCHEMBL2768367 | 0.85 | HCAR1 (0.53) | CA12CA1CA2CA7CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 167 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115869785-A | Ultrafast preparation method of graphite alkyne composite membrane | 北京化工大学 | 2023-03-31 | — | — | CN | claimed |
| EP-3248997-A1 | POLYARYLENE MATERIALS | Rohm and Haas Electronic Materials LLC (US) | 2017-11-29 | — | — | EP | claimed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| WO-2025137293-A2 | ENHANCEMENT OF NUCLEIC ACID POLYMERIZATION BY AROMATIC COMPOUNDS | Roche Sequencing Solutions, Inc. (US) | 2025-06-26 | — | — | WO | disclosed |
| EP-4553100-A1 | POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-14 | — | — | EP | disclosed |
| EP-1508837-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM | TORAY INDUSTRIES, INC. (JP) | 2005-02-23 | — | — | EP | disclosed |
| CN-1577088-A | Photosensitive resin precursor composition | TORAY INDUSTRIES (JP) | 2005-02-09 | — | — | CN | disclosed |
| US-20050014876-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-20 | — | — | US | disclosed |
| EP-1496395-A2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-12 | — | — | EP | disclosed |
| EP-1475665-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-11-10 | — | — | EP | disclosed |
| CN-1536442-A | Positive photosensitive resin composition | 东丽株式会社 | 2004-10-13 | — | — | CN | disclosed |
| US-20040197703-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-10-07 | — | — | US | disclosed |
| US-20040053156-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | CA12 3244/4885CA1 2608/4885CA2 3174/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | CA12 2017/4885CA1 1162/4885CA2 1038/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.