SCHEMBL6900407

SCHEMBL6900407

C1=CC(C2C=CCCCCCCCC2)CCCCCCCC1

nearest known ligand 0.37

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
KDM4E B2RXH2 1/20 0.37
HSD17B10 Q99714 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8903874 1.00 ALDH1A1 (0.37) ALDH1A1KDM4EHSD17B10
SCHEMBL4752145 1.00 ALDH1A1 (0.37) ALDH1A1KDM4EHSD17B10
SCHEMBL6900404 1.00 ALDH1A1 (0.37) ALDH1A1KDM4EHSD17B10
SCHEMBL1232859 0.97 KDM4E (0.38) ALDH1A1KDM4E
SCHEMBL595872 0.88 ALDH1A1 (0.44) ALDH1A1KDM4E
SCHEMBL1463656 0.87 KDM4E (0.34) ALDH1A1KDM4E
SCHEMBL11030411 0.84 KDM4E (0.31) ALDH1A1KDM4E
SCHEMBL152148 0.83 KDM4E (0.33) ALDH1A1KDM4E
SCHEMBL7783728 0.81 ALDH1A1 (0.38) ALDH1A1KDM4E
SCHEMBL14759776 0.81 ALDH1A1 (0.38) ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6777817-B2 SEMICONDUCTOR BONDED TO CHIP CARRIER OR HEAT SPREADER WITH REWORKABLE ADHESIVE COMPRISING CURED REACTION PRODUCT FROM DIEPOXIDE AND CYCLIC ANHYDRIDE; AND FILLER INTERNATIONAL BUSINESS MACHINES CORPORATION 2004-08-17 US disclosed
US-6617698-B2 Reworkable and thermally conductive adhesive and use thereof INTERNATIONAL BUSINESS MACHINES CORPORATION 2003-09-09 US disclosed