SCHEMBL6900969

SCHEMBL6900969

CCNOC(=O)/C=C\C(=O)NCC

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GFPT1 Q06210 1/20 0.39
ZDHHC20 Q5W0Z9 2/20 0.36
ZDHHC2 Q9UIJ5 2/20 0.36
HCAR2 Q8TDS4 4/20 0.36
KEAP1 Q14145 1/20 0.36
NFE2L2 Q16236 1/20 0.36
MAPT P10636 3/20 0.35
RAB9A P51151 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
SLC6A19 Q695T7 1/20 0.35
ALDH1A1 P00352 2/20 0.33
ATM Q13315 1/20 0.32
LMNA P02545 1/20 0.32
MDM2 Q00987 1/20 0.32
AURKA O14965 1/20 0.32
CACNA1B Q00975 1/20 0.31
APBA1 Q02410 1/20 0.31
MMP1 P03956 1/20 0.30
MMP2 P08253 1/20 0.30
MMP3 P08254 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27469854 0.87 HCAR2 (0.46) HCAR2KEAP1NFE2L2MAPTRAB9A
SCHEMBL28311327 0.87 HCAR2 (0.46) HCAR2KEAP1NFE2L2MAPTRAB9A
SCHEMBL11529758 0.81 HCAR2 (0.59) GFPT1ZDHHC20ZDHHC2HCAR2KEAP1
SCHEMBL22010351 0.81 HCAR2 (0.59) GFPT1ZDHHC20ZDHHC2HCAR2KEAP1
SCHEMBL11529751 0.81 HCAR2 (0.59) GFPT1ZDHHC20ZDHHC2HCAR2KEAP1
SCHEMBL2535335 0.80 SLC6A19 (0.44) GFPT1ZDHHC20ZDHHC2SLC6A19ALDH1A1
SCHEMBL1395636 0.80 SLC6A19 (0.44) GFPT1ZDHHC20ZDHHC2SLC6A19ALDH1A1
SCHEMBL1395660 0.80 SLC6A19 (0.44) GFPT1ZDHHC20ZDHHC2SLC6A19ALDH1A1
SCHEMBL21511147 0.79 HCAR2 (0.54) HCAR2KEAP1NFE2L2MAPTALDH1A1
SCHEMBL11528608 0.78 HCAR2 (0.57) GFPT1ZDHHC20ZDHHC2HCAR2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200230854-A1 ADHESIVE AND METHOD OF BONDING TO RIGID SUBSTRATES LORD CORP (US) 2020-07-23 US disclosed
WO-2018152497-A1 ADHESIVE AND METHOD OF BONDING TO RIGID SUBSTRATES LORD CORPORATION (US) 2018-08-23 WO disclosed
WO-2013004646-A1 LAMINATE FOR PACKAGING UNILEVER N.V. (NL) 2013-01-10 WO disclosed
EP-0864610-B1 Semiaromatic polyamide resin composition MITSUI CHEMICALS INC (JP) 2004-01-21 EP disclosed
EP-0758675-B1 Adhesive polypropylene resin composition and multi-layer laminate body using the resin composition MITSUI CHEMICALS INC (JP) 2001-01-31 EP disclosed
US-6117942-A GRAFT-MODIFIED ETHYLENE-ALPHA OLEFIN COPOLYMER, A POLYTEREPHTHALAMIDE EXHIBITS EXCELLENT ANTI-CREEPING PROPERTY UNDER HIGH-TEMPERATURE AND HIGH-HUMIDITY CONDITIONS, MOLDING MATERIAL MITSUI CHEMICALS (JP) 2000-09-12 US disclosed
EP-0864610-A1 Semiaromatic polyamide resin composition Mitsui Chemicals, Inc. (JP) 1998-09-16 EP disclosed
US-5695838-A GRAFT-MODIFIED WITH UNSATURATED ACID AND ACID ANHYDRIDE; IMPROVED ADHESION MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1997-12-09 US disclosed
EP-0758675-A2 Adhesive polypropylene resin composition and multi-layer laminate body using the resin composition MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1997-02-19 EP disclosed
EP-0479561-B1 Process for heat-treating a polyolefin coating on metal in the presence of a treating agent MITSUI PETROCHEMICAL IND (JP) 1995-08-23 EP disclosed
US-5275848-A Process for preparing a laminate of metal and a polyolefin resin MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1994-01-04 US disclosed
EP-0479561-A2 Process for heat-treating a polyolefin coating on metal in the presence of a treating agent MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1992-04-08 EP disclosed