SCHEMBL6900971

SCHEMBL6900971

CCC(CN)CC(CC)CCCCN

nearest known ligand 0.54

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.54
TDP1 Q9NUW8 1/20 0.54
CYP3A4 P08684 2/20 0.41
DNM1 Q05193 8/20 0.35
TSHR P16473 2/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
EPHX1 P07099 1/20 0.35
NFKB1 P19838 1/20 0.32
GSR P00390 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1867273 0.88 ALDH1A1 (0.68) ALDH1A1TDP1CYP3A4DNM1TSHR
SCHEMBL17062941 0.86 ALDH1A1 (0.65) ALDH1A1TDP1CYP3A4DNM1TSHR
SCHEMBL11749060 0.86 ALDH1A1 (0.65) ALDH1A1TDP1CYP3A4DNM1TSHR
SCHEMBL21753838 0.86 ALDH1A1 (0.65) ALDH1A1TDP1CYP3A4DNM1TSHR
SCHEMBL9403090 0.86 ALDH1A1 (0.65) ALDH1A1TDP1CYP3A4DNM1TSHR
SCHEMBL31537581 0.86 ALDH1A1 (0.65) ALDH1A1TDP1CYP3A4DNM1TSHR
SCHEMBL28927672 0.86 ALDH1A1 (0.65) ALDH1A1TDP1CYP3A4DNM1TSHR
SCHEMBL18572815 0.84 ALDH1A1 (0.77) ALDH1A1TDP1CYP3A4TSHRMEN1
SCHEMBL18789658 0.83 ALDH1A1 (0.48) ALDH1A1TDP1CYP3A4DNM1TSHR
SCHEMBL829283 0.83 ALDH1A1 (0.48) ALDH1A1TDP1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4663703-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Mitsui Chemicals, Inc. (JP) 2025-12-17 EP disclosed
EP-4663374-A1 POLYAMIDE RESIN COMPOSITION FOR INSERT MOLDING, METAL RESIN COMPOSITE BODY AND METHOD FOR PRODUCING SAME Mitsui Chemicals, Inc. (JP) 2025-12-17 EP disclosed
EP-4582484-A1 POLYAMIDE RESIN COMPOSITION, METAL/RESIN JOINED BODY AND METHOD FOR PRODUCING SAME, BUS BAR UNIT, DRIVE UNIT, AND MOBILE OBJECT Mitsui Chemicals, Inc. (JP) 2025-07-09 EP disclosed
WO-2025084296-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED OBJECT 三井化学株式会社 2025-04-24 WO disclosed
CN-119744285-A Polyamide resin composition, metal resin joined body, method for producing same, bus bar unit, driving unit, and moving body 三井化学株式会社 2025-04-01 CN disclosed
WO-2024166903-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE 三井化学株式会社 2024-08-15 WO disclosed
EP-4130140-A1 SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLES THEREFROM Mitsui Chemicals, Inc. (JP) 2023-02-08 EP disclosed
CN-115175963-A Semi-aromatic polyamide resin composition and molded article thereof 三井化学株式会社 2022-10-11 CN disclosed
WO-2014106729-A1 PROCESS FOR PREPARING A POLYMER, POLYMER, DISPERSION, INK, AND USE FUJIFILM IMAGING COLORANTS LIMITED (GB) 2014-07-10 WO disclosed
EP-0864610-B1 Semiaromatic polyamide resin composition MITSUI CHEMICALS INC (JP) 2004-01-21 EP disclosed
US-6319986-B1 BLEND OF COPOLYAMIDE FROM TEREPHTHALIC ACID AND MIXTURE OF STRAIGHT-CHAIN AND BRANCH-CHAIN ALKYLENEDIAMINES; COPOLYAMIDE OF DODECANOLACTAM AND DODECANEDIOIC ACID AND DIAMINE; AND GRAFTED OLEFIN COPOLYMER MITSUI CHEMICALS (JP) 2001-11-20 US disclosed
US-6117942-A GRAFT-MODIFIED ETHYLENE-ALPHA OLEFIN COPOLYMER, A POLYTEREPHTHALAMIDE EXHIBITS EXCELLENT ANTI-CREEPING PROPERTY UNDER HIGH-TEMPERATURE AND HIGH-HUMIDITY CONDITIONS, MOLDING MATERIAL MITSUI CHEMICALS (JP) 2000-09-12 US disclosed
EP-0864610-A1 Semiaromatic polyamide resin composition Mitsui Chemicals, Inc. (JP) 1998-09-16 EP disclosed
US-4250291-A NONFUSING POWDERS FOR TEXTILES VEBA CHEMIE AKTIENGESELLSCHAFT (DE) 1981-02-10 US disclosed
US-4248654-A Securing substrates together with melt adhesives based on polyamides VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) 1981-02-03 US disclosed