Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 8/20 | 0.71 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.45 |
| ▸ | ATM | Q13315 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.40 |
| ▸ | CA2 | P00918 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
| ▸ | RECQL | P46063 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 3/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.37 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.37 |
| ▸ | PRSS1 | P07477 | 1/20 | 0.36 |
| ▸ | PRSS2 | P07478 | 1/20 | 0.36 |
| ▸ | PRSS3 | P35030 | 1/20 | 0.36 |
| ▸ | CA1 | P00915 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | MMP9 | P14780 | 1/20 | 0.35 |
| ▸ | MMP8 | P22894 | 1/20 | 0.35 |
| ▸ | MMP14 | P50281 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1931959 | 0.96 | TSHR (0.76) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| SCHEMBL29141898 | 0.96 | TSHR (0.76) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| Acrylic Acid Ethyl Ester SCHEMBL1546928 | 0.94 | TSHR (0.63) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| Acrylic Acid Methyl Ester SCHEMBL18660168 | 0.94 | TSHR (0.72) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| Acrylic Acid Ethyl Ester SCHEMBL15281939 | 0.93 | TSHR (0.62) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| Acrylic Acid SCHEMBL2462157 | 0.93 | TSHR (0.71) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| Methacrylic Acid SCHEMBL8956686 | 0.93 | TSHR (0.71) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| Acrylic Acid Ethyl Ester SCHEMBL27425849 | 0.92 | TSHR (0.60) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| SCHEMBL5059316 | 0.92 | TSHR (0.69) | TSHRCYP3A4TDP1ATMALDH1A1 | |
| SCHEMBL6568874 | 0.91 | TSHR (0.76) | TSHRCYP3A4TDP1ATMALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3779933-B1 | LAMINATE AND ADHESIVE LABEL | YUPO CORP (JP) | 2024-04-10 | — | — | EP | disclosed |
| EP-2865520-B1 | ELECTROSTATICALLY ADSORPTIVE SHEET AND METHOD FOR PRODUCING THE SAME | YUPO CORP (JP) | 2023-09-06 | — | — | EP | disclosed |
| US-11148393-B2 | Electrostatic adsorbable laminated sheet and display material | YUPO CORPORATION (JP) | 2021-10-19 | — | — | US | disclosed |
| CN-107892882-B | Dicing tape-integrated adhesive sheet | 日东电工株式会社 | 2021-08-31 | — | — | CN | disclosed |
| US-20210114338-A1 | LAMINATE AND ADHESIVE LABEL | YUPO CORPORATION (JP) | 2021-04-22 | — | — | US | disclosed |
| EP-3779933-A1 | LAMINATE AND ADHESIVE LABEL | Yupo Corporation (JP) | 2021-02-17 | — | — | EP | disclosed |
| WO-2020145408-A1 | RECORDING PAPER, USE THEREOF, AND METHOD FOR PRODUCING RECORDING PAPER | 株式会社ユポ・コーポレーション | 2020-07-16 | — | — | WO | disclosed |
| US-20190344535-A1 | ELECTROSTATIC ADSORBABLE LAMINATED SHEET AND DISPLAY MATERIAL | YUPO CORPORATION (JP) | 2019-11-14 | — | — | US | disclosed |
| EP-3483868-A1 | ELECTROSTATIC ADSORPTION MULTILAYER SHEET AND DISPLAY | Yupo Corporation (JP) | 2019-05-15 | — | — | EP | disclosed |
| US-9636857-B2 | Label for in-mold forming | YUPO CORPORATION (JP) | 2017-05-02 | — | — | US | disclosed |
| US-20050048271-A1 | Recording paper and label paper using the same | YUPO CORPORATION (JP) | 2005-03-03 | — | — | US | disclosed |
| EP-1486528-A1 | RECORDING PAPER AND LABEL PAPER USING SAME | Yupo Corporation (JP) | 2004-12-15 | — | — | EP | disclosed |
| CN-1537329-A | Method of heat-peeling chip cut piexes from heat peel type adhesive sheet, electronic part, and circuit board | �ն��繤��ʽ���� | 2004-10-13 | — | — | CN | disclosed |
| US-20040177918-A1 | Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit board | NITTO DENKO CORPORATION (JP) | 2004-09-16 | — | — | US | disclosed |
| EP-1429378-A1 | METHOD OF HEAT−PEELING CHIP CUT PIECES FROM HEAT PEEL TYPE ADHESIVE SHEET, ELECTRONIC PART, AND CIRCUIT BOARD | NITTO DENKO CORPORATION (JP) | 2004-06-16 | — | — | EP | disclosed |
| EP-1156093-B1 | Heat-peelable pressure-sensitive adhesive sheet | NITTO DENKO CORP (JP) | 2004-04-07 | — | — | EP | disclosed |
| US-20030203193-A1 | Heat-peelable pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION | 2003-10-30 | — | — | US | disclosed |
| US-20010055678-A1 | Heat-peelable pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION | 2001-12-27 | — | — | US | disclosed |
| EP-1156093-A2 | Heat-peelable pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2001-11-21 | — | — | EP | disclosed |
| EP-1097977-A2 | Heat-peelable pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2001-05-09 | — | — | EP | disclosed |