⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1348680 | 0.79 | POLB (0.32) | — | |
| SCHEMBL11177188 | 0.70 | MAPT (0.34) | — | |
| SCHEMBL122561 | 0.69 | POLB (0.38) | — | |
| SCHEMBL316065 | 0.69 | POLB (0.35) | — | |
| SCHEMBL2228297 | 0.69 | POLB (0.42) | — | |
| SCHEMBL14989252 | 0.67 | GLRA3 (0.43) | — | |
| SCHEMBL8723137 | 0.67 | POLB (0.40) | — | |
| SCHEMBL14989129 | 0.66 | GLRA3 (0.46) | — | |
| SCHEMBL7065132 | 0.66 | GLRA3 (0.46) | — | |
| SCHEMBL10142193 | 0.66 | POLB (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |