SCHEMBL1348680

SCHEMBL1348680

CC(C)(C)c1c(C(=O)OO)c(C(=O)OO)cc(C(=O)OO)c1C(=O)OO

nearest known ligand 0.32

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.32
MAPT P10636 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.31
GLRA3 O75311 1/20 0.31
GLRB P48167 1/20 0.31
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1348416 0.82 KMT2A (0.33) POLBMAPTKMT2A
SCHEMBL6901667 0.79
SCHEMBL316065 0.78 POLB (0.35) POLBMAPTGLRA3GLRBKMT2A
SCHEMBL11177188 0.77 MAPT (0.34) POLBMAPTL3MBTL1KMT2A
SCHEMBL122561 0.74 POLB (0.38) POLBMAPTGLRA3GLRBKMT2A
SCHEMBL1348417 0.74 POLB (0.35) POLBMAPTGLRA3GLRB
SCHEMBL1348862 0.73 MAPT (0.39) POLBMAPTL3MBTL1KMT2A
SCHEMBL11331912 0.72 CES2 (0.35) MAPTL3MBTL1
SCHEMBL11216809 0.71 TDP1 (0.40) POLBMAPT
SCHEMBL11334616 0.70 CA12 (0.32) POLBMAPTL3MBTL1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8063245-B2 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2011-11-22 US disclosed
US-20100218984-A1 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20060199920-A1 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof KANEKA CORPORATION (JP) 2006-09-07 US disclosed
US-20060142542-A1 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2006-06-29 US disclosed