⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL395315 | 0.87 | — | — | |
| SCHEMBL64809 | 0.86 | CES2 (0.31) | — | |
| SCHEMBL5701559 | 0.86 | — | — | |
| SCHEMBL9332249 | 0.83 | — | — | |
| SCHEMBL216518 | 0.83 | — | — | |
| SCHEMBL8414163 | 0.81 | CES2 (0.33) | — | |
| SCHEMBL5702053 | 0.81 | — | — | |
| SCHEMBL9179066 | 0.79 | — | — | |
| SCHEMBL22733938 | 0.79 | — | — | |
| SCHEMBL9302440 | 0.78 | CES2 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0802234-B1 | Silicone die attach adhesive and method for fabrication of semiconductor devices | DOW CORNING TORAY SILICONE (JP) | 2004-02-25 | — | — | EP | disclosed |
| EP-0781811-B1 | Curable silicone compositions | DOW CORNING TORAY SILICONE (JP) | 2000-06-14 | — | — | EP | disclosed |
| US-5982041-A | Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1999-11-09 | — | — | US | disclosed |
| US-5789485-A | Curable silicone compositions | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1998-08-04 | — | — | US | disclosed |
| EP-0802234-A2 | Silicone die attach adhesive and method for fabrication of semiconductor devices | Dow Corning Toray Silicone Company, Limited (JP) | 1997-10-22 | — | — | EP | disclosed |
| EP-0781811-A2 | Curable silicone compositions | Dow Corning Toray Silicone Co., Ltd. (JP) | 1997-07-02 | — | — | EP | disclosed |