Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.96 |
| ▸ | MAPT | P10636 | 5/20 | 0.59 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.59 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.59 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.59 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.59 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.57 |
| ▸ | MEN1 | O00255 | 1/20 | 0.52 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.52 |
| ▸ | IGF1R | P08069 | 1/20 | 0.50 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.49 |
| ▸ | NPC1 | O15118 | 2/20 | 0.47 |
| ▸ | RAB9A | P51151 | 2/20 | 0.47 |
| ▸ | RAD52 | P43351 | 1/20 | 0.46 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.45 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.45 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.45 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.45 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Dyrene SCHEMBL133054 | 0.98 | TSHR (1.00) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL1903290 | 0.98 | TSHR (1.00) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL6750152 | 0.98 | TSHR (1.00) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL29364667 | 0.98 | TSHR (1.00) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL8166670 | 0.98 | TSHR (1.00) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL13280 | 0.98 | TSHR (1.00) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL1763275 | 0.96 | TSHR (0.96) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL827164 | 0.96 | TSHR (0.96) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL2501660 | 0.96 | TSHR (0.96) | TSHRMAPTKMT2AKDM4EALDH1A1 | |
| Dyrene SCHEMBL21061705 | 0.96 | TSHR (0.96) | TSHRMAPTKMT2AKDM4EALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 337 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117916083-A | Method for producing laminated body | 国立大学法人岩手大学 | 2024-04-19 | — | — | CN | claimed |
| CN-117136106-A | Triazine silane compounds and their use as adhesion promoters | 德国艾托特克有限两合公司 | 2023-11-28 | — | — | CN | claimed |
| CN-113736292-A | Inorganic nano long-acting antifogging self-cleaning coating and preparation method and application thereof | 上海保耐舒新材料技术有限公司 | 2021-12-03 | — | — | CN | claimed |
| CN-111690323-B | Polyimide varnish, preparation method and application thereof | 住井工业（湖南）有限公司 | 2021-09-10 | — | — | CN | claimed |
| CN-111690323-A | Polyimide varnish, preparation method and application thereof | 住井工业（湖南）有限公司 | 2020-09-22 | — | — | CN | claimed |
| CN-118317921-A | Hollow silica particles and method for producing same | ＡＧＣ株式会社 | 2024-07-09 | — | — | CN | disclosed |
| WO-2024142675-A1 | PHOTOSENSITIVE COMPOSITION, CURED FILM, PHOTOSENSITIVE TRANSFER MATERIAL, FILM, AND LAMINATE | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| CN-118265952-A | Photosensitive resin composition, display panel manufactured using the same, and manufacturing method thereof | 三星显示有限公司 | 2024-06-28 | — | — | CN | disclosed |
| US-20240179851-A1 | MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR USAGE FOR INCREASING ADHESION STRENGTH BETWEEN COPPER AND AN ORGANIC MATERIAL AND REDUCING HALO AND WEDGE VOID FORMATION | Atotech Deutschland GmbH & Co. KG (DE) | 2024-05-30 | — | — | US | disclosed |
| CN-118019880-A | Roughened copper foil, copper-clad laminate, and method for producing printed wiring board | 三井金属矿业株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117916083-A | Method for producing laminated body | 国立大学法人岩手大学 | 2024-04-19 | — | — | CN | disclosed |
| CN-117916083-A | Method for producing laminated body | 国立大学法人岩手大学 | 2024-04-19 | — | — | CN | disclosed |
| US-20070098910-A1 | Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape | MITSUI MINING & SMELTING CO., LTD. (JP) | 2007-05-03 | — | — | US | disclosed |
| CN-1942310-A | Process for producing double-sided metal clad laminate and double-sided metal clad laminate produced by the process | MITSUI MINING & SMELTING CO (JP) | 2007-04-04 | — | — | CN | disclosed |
| CN-1925982-A | Electrolytic copper foil with carrier foil having resin layer for forming insulating layer, copper-clad laminate, printed wiring board, method for producing multilayer copper-clad laminate, and method for producing printed wiring board | MITSUI MINING & SMELTING CO (JP) | 2007-03-07 | — | — | CN | disclosed |
| CN-1301046-C | Flexible printed wiring board for chip on film | MITSUI MINING & SMELTING CO (JP) | 2007-02-14 | — | — | CN | disclosed |
| CN-1762186-A | Multilayer printed wiring board and method for manufacturing the multilayer printed wiring board | MITSUI MINING & SMELTING CO (JP) | 2006-04-19 | — | — | CN | disclosed |
| CN-1723745-A | Copper foil with extremely thin adhesive layer and method for producing the copper foil with extremely thin adhesive layer | MITSUI MINING & SMELTING CO (JP) | 2006-01-18 | — | — | CN | disclosed |
| US-20040241487-A1 | Electrodeposited copper foil with carrier foil | MITSUI MINING & SMELTING CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |
| CN-1533686-A | Flexible printed wiring board for chip on film | ���������kҵ��ʽ���� | 2004-09-29 | — | — | CN | disclosed |