SCHEMBL690212

SCHEMBL690212

Nc1cccc2cc(S)ccc12

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.54
HSD17B10 Q99714 4/20 0.54
CYP3A4 P08684 3/20 0.54
HPGD P15428 3/20 0.54
TSHR P16473 2/20 0.54
KEAP1 Q14145 1/20 0.54
TDP1 Q9NUW8 2/20 0.44
LMNA P02545 2/20 0.44
CYP2C9 P11712 2/20 0.44
CYP2C19 P33261 2/20 0.44
CYP1A2 P05177 2/20 0.44
CYP2D6 P10635 1/20 0.44
KDM4E B2RXH2 3/20 0.42
POLB P06746 3/20 0.42
KMT2A Q03164 3/20 0.42
GAA P10253 2/20 0.42
RCE1 Q9Y256 2/20 0.42
NPC1 O15118 1/20 0.42
GLA P06280 1/20 0.42
PTBP1 P26599 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31157824 1.00 ALDH1A1 (0.54) ALDH1A1HSD17B10CYP3A4HPGDTSHR
SCHEMBL689374 0.83 ALDH1A1 (0.54) ALDH1A1HSD17B10CYP3A4HPGDTSHR
SCHEMBL14097333 0.79 HPRT1 (0.35) ALDH1A1HSD17B10CYP3A4HPGDTSHR
SCHEMBL30772980 0.77 CYP1A2 (0.35) ALDH1A1HSD17B10HPGDTSHRCYP1A2
SCHEMBL7756731 0.77 CYP1A2 (0.35) ALDH1A1HSD17B10HPGDTSHRCYP1A2
SCHEMBL25412417 0.77 CYP1A2 (0.35) ALDH1A1HSD17B10HPGDTSHRCYP1A2
SCHEMBL690094 0.77 ALDH1A1 (0.52) ALDH1A1HSD17B10CYP3A4HPGDTSHR
SCHEMBL31157796 0.77 ALDH1A1 (0.52) ALDH1A1HSD17B10CYP3A4HPGDTSHR
SCHEMBL29498391 0.77 PLAU (0.63) ALDH1A1HSD17B10CYP3A4HPGDTSHR
SCHEMBL29404930 0.77 PLAU (0.63) ALDH1A1HSD17B10CYP3A4HPGDTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 142 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP claimed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
EP-4636485-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-10-22 EP disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 CN disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
US-20040053156-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-03-18 US disclosed
EP-1388758-A1 Photosensitive heat resistant resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-02-11 EP disclosed
EP-1365289-A1 PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME TORAY INDUSTRIES, INC. (JP) 2003-11-26 EP disclosed
US-20030194631-A1 Precursor composition for positive photosensitive resin and display made with the same TORAY INDUSTRIES, INC. (JP) 2003-10-16 US disclosed
US-6593043-B2 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2003-07-15 US disclosed
US-20020090564-A1 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2002-07-11 US disclosed
EP-1209523-A2 Composition of positive photosensitive resin precursor, and display device made thereof TORAY INDUSTRIES, INC. (JP) 2002-05-29 EP disclosed
US-6365736-B1 TREATMENT OF NERVOUS SYSTEM DISORDERS, CARDIOVASCULAR DISORDERS AND FOR ACTIVITY AS NO-SYNTHASES (NOS) INHIBITORS. SCHERING AKTIENGESELLSCHAFT (DE) 2002-04-02 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR ALDH1A1 3706/4885HSD17B10 4284/4885CYP3A4 2409/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 ALDH1A1 3281/4885HSD17B10 4119/4885CYP3A4 3318/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.