SCHEMBL6905051

SCHEMBL6905051

CCC(CCCN)CC(C)CN

nearest known ligand 0.46

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.46
TDP1 Q9NUW8 1/20 0.46
CYP3A4 P08684 2/20 0.40
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8393175 0.94 ALDH1A1 (0.45) ALDH1A1TDP1CYP3A4TSHR
SCHEMBL24293266 0.89 ALDH1A1 (0.43) ALDH1A1TDP1CYP3A4TSHR
SCHEMBL21900573 0.87 ALDH1A1 (0.64) ALDH1A1TDP1CYP3A4TSHR
SCHEMBL14387206 0.86 ALDH1A1 (0.39) ALDH1A1TDP1CYP3A4
SCHEMBL10765288 0.86 ALDH1A1 (0.39) ALDH1A1TDP1CYP3A4
SCHEMBL22653567 0.85 ALDH1A1 (0.45) ALDH1A1TDP1CYP3A4TSHR
SCHEMBL6903881 0.83 ALDH1A1 (0.46) ALDH1A1TDP1CYP3A4
SCHEMBL18963498 0.82 ALDH1A1 (0.44) ALDH1A1TDP1CYP3A4TSHR
SCHEMBL23609870 0.82 ALDH1A1 (0.44) ALDH1A1TDP1CYP3A4TSHR
SCHEMBL18789658 0.81 ALDH1A1 (0.48) ALDH1A1TDP1CYP3A4TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4663703-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Mitsui Chemicals, Inc. (JP) 2025-12-17 EP disclosed
EP-4663374-A1 POLYAMIDE RESIN COMPOSITION FOR INSERT MOLDING, METAL RESIN COMPOSITE BODY AND METHOD FOR PRODUCING SAME Mitsui Chemicals, Inc. (JP) 2025-12-17 EP disclosed
EP-4582484-A1 POLYAMIDE RESIN COMPOSITION, METAL/RESIN JOINED BODY AND METHOD FOR PRODUCING SAME, BUS BAR UNIT, DRIVE UNIT, AND MOBILE OBJECT Mitsui Chemicals, Inc. (JP) 2025-07-09 EP disclosed
WO-2025084296-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED OBJECT 三井化学株式会社 2025-04-24 WO disclosed
CN-119744285-A Polyamide resin composition, metal resin joined body, method for producing same, bus bar unit, driving unit, and moving body 三井化学株式会社 2025-04-01 CN disclosed
WO-2024166903-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE 三井化学株式会社 2024-08-15 WO disclosed
EP-4130140-A1 SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLES THEREFROM Mitsui Chemicals, Inc. (JP) 2023-02-08 EP disclosed
CN-115175963-A Semi-aromatic polyamide resin composition and molded article thereof 三井化学株式会社 2022-10-11 CN disclosed
EP-0864610-B1 Semiaromatic polyamide resin composition MITSUI CHEMICALS INC (JP) 2004-01-21 EP disclosed
US-6319986-B1 BLEND OF COPOLYAMIDE FROM TEREPHTHALIC ACID AND MIXTURE OF STRAIGHT-CHAIN AND BRANCH-CHAIN ALKYLENEDIAMINES; COPOLYAMIDE OF DODECANOLACTAM AND DODECANEDIOIC ACID AND DIAMINE; AND GRAFTED OLEFIN COPOLYMER MITSUI CHEMICALS (JP) 2001-11-20 US disclosed
US-6117942-A GRAFT-MODIFIED ETHYLENE-ALPHA OLEFIN COPOLYMER, A POLYTEREPHTHALAMIDE EXHIBITS EXCELLENT ANTI-CREEPING PROPERTY UNDER HIGH-TEMPERATURE AND HIGH-HUMIDITY CONDITIONS, MOLDING MATERIAL MITSUI CHEMICALS (JP) 2000-09-12 US disclosed
EP-0864610-A1 Semiaromatic polyamide resin composition Mitsui Chemicals, Inc. (JP) 1998-09-16 EP disclosed
EP-0615997-A1 Block copolyamides BASF Aktiengesellschaft (DE) 1994-09-21 EP disclosed
EP-0400428-A1 Thermoplastic mouldings of partially aromatic and amorphous copolyamides BASF Aktiengesellschaft (DE) 1990-12-05 EP disclosed
US-4062828-A PHOSPHINYLPHOSPHINIC ACID HOECHST AKTIENGESELLSCHAFT (DT) 1977-12-13 US disclosed
US-4014957-A Thermoplastic polyamide moulding compositions HOECHST AKTIENGESELLSCHAFT (DT) 1977-03-29 US disclosed
US-3992360-A Transparent polyamides from 1,3-bis-(aminomethyl)-cyclohexane and aliphatic amino carboxylic acid HOECHST AKTIENGESELLSCHAFT (DT) 1976-11-16 US disclosed
US-3974234-A IMPACT STRENGTH HOECHST AKTIENGESELLSCHAFT (DT) 1976-08-10 US disclosed