SCHEMBL690525

SCHEMBL690525

Nc1ccc(S)c2ccccc12

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.52
ALDH1A1 P00352 3/20 0.52
HPGD P15428 3/20 0.52
TSHR P16473 2/20 0.52
HSD17B10 Q99714 2/20 0.52
TDP1 Q9NUW8 2/20 0.52
IDO1 P14902 2/20 0.52
EP300 Q09472 2/20 0.52
KAT8 Q9H7Z6 2/20 0.52
HDAC3 O15379 1/20 0.52
KAT2B Q92831 1/20 0.52
NCOR2 Q9Y618 1/20 0.52
CHEK1 O14757 1/20 0.46
NEK2 P51955 1/20 0.46
LIMK1 P53667 1/20 0.46
DYRK1A Q13627 1/20 0.46
CLK4 Q9HAZ1 1/20 0.46
KEAP1 Q14145 2/20 0.44
CRHBP P24387 1/20 0.43
CRHR2 Q13324 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31157830 1.00 CYP3A4 (0.52) CYP3A4ALDH1A1HPGDTSHRHSD17B10
SCHEMBL31157812 0.84 ALDH1A1 (0.68) CYP3A4ALDH1A1HPGDTSHRHSD17B10
SCHEMBL688017 0.84 ALDH1A1 (0.68) CYP3A4ALDH1A1HPGDTSHRHSD17B10
SCHEMBL29404342 0.83 ALDH1A1 (0.73) CYP3A4ALDH1A1HPGDTSHRHSD17B10
SCHEMBL331123 0.83 CYP2A6 (0.39) ALDH1A1TSHRHSD17B10TDP1IDO1
SCHEMBL29649174 0.83 CYP2A6 (0.39) ALDH1A1TSHRHSD17B10TDP1IDO1
SCHEMBL201893 0.83 ALDH1A1 (0.73) CYP3A4ALDH1A1HPGDTSHRHSD17B10
Hydrochloric Acid SCHEMBL7191297 0.80 CYP3A4 (0.69) CYP3A4ALDH1A1HPGDTSHRHSD17B10
SCHEMBL21854609 0.77 ALDH1A1 (0.87) CYP3A4ALDH1A1HPGDTSHRHSD17B10
SCHEMBL30851475 0.75 ALDH1A1 (0.61) CYP3A4ALDH1A1HPGDTSHRHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 144 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115814955-A Zinc collector for improving recovery rate of zinc and rare metal germanium and beneficiation method 广东省科学院资源利用与稀土开发研究所 2023-03-21 CN claimed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP claimed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
EP-4636485-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-10-22 EP disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 CN disclosed
US-20040053156-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-03-18 US disclosed
EP-1388758-A1 Photosensitive heat resistant resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-02-11 EP disclosed
EP-1365289-A1 PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME TORAY INDUSTRIES, INC. (JP) 2003-11-26 EP disclosed
US-20030194631-A1 Precursor composition for positive photosensitive resin and display made with the same TORAY INDUSTRIES, INC. (JP) 2003-10-16 US disclosed
US-6593043-B2 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2003-07-15 US disclosed
US-20020090564-A1 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2002-07-11 US disclosed
EP-1209523-A2 Composition of positive photosensitive resin precursor, and display device made thereof TORAY INDUSTRIES, INC. (JP) 2002-05-29 EP disclosed
US-6303822-B1 Aromatic hydroxythiol synthesis using diazonium salts ALLIEDSIGNAL INC. 2001-10-16 US disclosed
US-6054622-A Aromatic hydroxythiol synthesis using diazonium salts ALLIEDSIGNAL INC (US) 2000-04-25 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR CYP3A4 2409/4885ALDH1A1 3706/4885HPGD 3438/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 CYP3A4 3318/4885ALDH1A1 3281/4885HPGD 4313/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.