SCHEMBL690649

SCHEMBL690649

Nc1c(S)ccc2ccccc12

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 7/20 0.50
ALDH1A1 P00352 6/20 0.50
TSHR P16473 3/20 0.50
CYP2A6 P11509 3/20 0.50
TDP1 Q9NUW8 2/20 0.50
HPGD P15428 4/20 0.46
CYP3A4 P08684 1/20 0.46
KEAP1 Q14145 1/20 0.46
HPRT1 P00492 2/20 0.46
KDM4E B2RXH2 2/20 0.44
GLA P06280 2/20 0.44
MEN1 O00255 1/20 0.44
POLB P06746 1/20 0.44
GAA P10253 1/20 0.44
MAPT P10636 1/20 0.44
KMT2A Q03164 1/20 0.44
ATM Q13315 1/20 0.44
CYP1B1 Q16678 2/20 0.42
HIF1A Q16665 1/20 0.42
CYP1A2 P05177 3/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2059503 0.89 HPRT1 (0.58) HSD17B10ALDH1A1TSHRCYP2A6TDP1
SCHEMBL11838582 0.80 ALDH1A1 (0.45) HSD17B10ALDH1A1TSHRCYP2A6TDP1
SCHEMBL29705759 0.75 ALDH1A1 (0.55) HSD17B10ALDH1A1TSHRCYP2A6TDP1
SCHEMBL64806 0.75 ALDH1A1 (0.56) HSD17B10ALDH1A1TSHRCYP2A6TDP1
SCHEMBL6062322 0.75 ALDH1A1 (0.55) HSD17B10ALDH1A1TSHRCYP2A6TDP1
SCHEMBL31390038 0.75 ALDH1A1 (0.56) HSD17B10ALDH1A1TSHRCYP2A6TDP1
SCHEMBL561071 0.75 ALDH1A1 (0.55) HSD17B10ALDH1A1TSHRCYP2A6TDP1
SCHEMBL467413 0.75 HSD17B10 (0.55) HSD17B10ALDH1A1TSHRCYP2A6TDP1
SCHEMBL10348051 0.73
Hydrochloric Acid SCHEMBL430346 0.73 ALDH1A1 (0.54) HSD17B10ALDH1A1TSHRCYP2A6TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 214 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP claimed
US-4772678-A HIGH-MOLECULAR-WEIGHT CHAIN-EXTENDED N-HETEROCYCLIC POLYMERS PREPARED USING A NON-OXIDIZING STRONG ACID AS SOLVENT; HIGH-STRENGTH FIBERS, FILMS, FIBRIDS AND STRUCTURES COMMTECH INTERNATIONAL MANAGEMENT CORPORATION (US) 1988-09-20 US claimed
US-4703103-A POLYPHOSPHORIC ACID CATALYST COMMTECH INTERNATIONAL (US) 1987-10-27 US claimed
WO-1985004178-A1 LIQUID CRYSTALLINE POLYMER COMPOSITIONS, PROCESS, AND PRODUCTS SRI INTERNATIONAL (US) 1985-09-26 WO claimed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636485-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-10-22 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
US-4758639-A Process for production of vinyl polymer SHIN-ETSU CHEMICAL CO., LTD. (JP) 1988-07-19 US disclosed
US-4757124-A Suspension or emulsion polymerizing vinyl chloride monomer or mixture of vinyl chloride with vinyl monomer copolymerizable therewith in reactor with walls coated with antiscaling compound containing dye or pigments SHIN-ETSU CHEMICAL CO., LTD. (JP) 1988-07-12 US disclosed
EP-0231373-A1 A PROCESS FOR THE PRODUCTION OF A LIQUID CRYSTALLINE EXTENDED CHAIN POLYMER COMPOSITION. COMMTECH INT (US) 1987-08-12 EP disclosed
WO-1987000844-A1 A PROCESS FOR THE PRODUCTION OF A LIQUID CRYSTALLINE EXTENDED CHAIN POLYMER COMPOSITION COMMTECH INTERNATIONAL (US) 1987-02-12 WO disclosed
EP-0172427-A2 Process for production of vinyl chloride polymer Shin-Etsu Chemical Co., Ltd. (JP) 1986-02-26 EP disclosed
WO-1985004178-A1 LIQUID CRYSTALLINE POLYMER COMPOSITIONS, PROCESS, AND PRODUCTS SRI INTERNATIONAL (US) 1985-09-26 WO disclosed
US-4150240-A Method for preparing d-penicillamine and salts thereof TAISHO PHARMACEUTICAL CO., LTD. (JP) 1979-04-17 US disclosed
US-3972890-A ACID CATALYST BAYER AKTIENGESELLSCHAFT (DT) 1976-08-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR HSD17B10 4284/4885ALDH1A1 3706/4885TSHR 3214/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 HSD17B10 4119/4885ALDH1A1 3281/4885TSHR 3402/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.