SCHEMBL6907701

SCHEMBL6907701

CCCNC(N)(CC)[SiH](OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8579978 0.72 EPHX1 (0.34)
SCHEMBL158201 0.71
SCHEMBL22716483 0.68
SCHEMBL17330322 0.64
SCHEMBL28929948 0.64 ALDH1A1 (0.30)
SCHEMBL27766906 0.64
SCHEMBL22472107 0.64
SCHEMBL17648 0.64
SCHEMBL28740295 0.64
SCHEMBL19384097 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111234136-A Preparation method of photocuring organic silicon resin system and photocuring film 佛山市天宝利硅工程科技有限公司 2020-06-05 CN disclosed
EP-0857772-B1 The use of alkylalkoxysilanes to increase the resilience of joint sealing compounds WACKER CHEMIE GMBH (DE) 2004-09-01 EP disclosed
US-6184274-B1 Jointing compounds with improved resilience WACKER - CHEMIE GMBH (DE) 2001-02-06 US disclosed
EP-0857772-A1 Joint sealing compounds with high resilience Wacker-Chemie GmbH (DE) 1998-08-12 EP disclosed