SCHEMBL691186

SCHEMBL691186

C=CC(=O)OC(C)COC(=O)C1CCCCC1C(=O)OCC(C)OC(=O)C=C

nearest known ligand 0.46

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.46
TP53 P04637 3/20 0.38
CYP3A4 P08684 3/20 0.38
ADRB2 P07550 1/20 0.32
ADRB1 P08588 1/20 0.32
ADRB3 P13945 1/20 0.32
ALDH1A1 P00352 4/20 0.31
HIF1A Q16665 2/20 0.31
MAPK1 P28482 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
HPGD P15428 1/20 0.31
CTSK P43235 2/20 0.30
CTSL P07711 1/20 0.30
CTSB P07858 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30
RAB9A P51151 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1151516 0.94 TSHR (0.41) TSHRTP53CYP3A4ALDH1A1RAB9A
SCHEMBL20598681 0.88 TSHR (0.54) TSHRTP53CYP3A4ALDH1A1HIF1A
SCHEMBL6430337 0.83 TSHR (0.49) TSHRTP53CYP3A4ALDH1A1HIF1A
SCHEMBL6930405 0.82 TSHR (0.37) TSHRTP53CYP3A4ADRB2ADRB1
SCHEMBL12804129 0.80 TSHR (0.47) TSHRTP53CYP3A4ADRB2ADRB1
SCHEMBL1152046 0.79 TSHR (0.44) TSHRADRB2ADRB1ADRB3RAB9A
SCHEMBL27702308 0.79 TSHR (0.46) TSHRTP53CYP3A4ALDH1A1HIF1A
SCHEMBL28029410 0.78 TSHR (0.46) TSHRTP53CYP3A4ALDH1A1HIF1A
SCHEMBL268430 0.78 TSHR (0.73) TSHRTP53CYP3A4ALDH1A1HIF1A
SCHEMBL234626 0.78 TP53 (0.48) TSHRTP53CYP3A4ADRB2ADRB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117363183-A UV adhesive composition, preparation process and polarizing plate thereof 福州恒美光电材料有限公司 2024-01-09 CN claimed
JP-5202347-A None JP disclosed
US-12091537-B2 Composition and molded article containing fluorine-containing polymer DAIKIN INDUSTRIES, LTD. (JP) 2024-09-17 US disclosed
CN-118053799-A Method for manufacturing semiconductor device 株式会社力森诺科 2024-05-17 CN disclosed
CN-117363183-A UV adhesive composition, preparation process and polarizing plate thereof 福州恒美光电材料有限公司 2024-01-09 CN disclosed
CN-117157733-A Method for manufacturing semiconductor device and dicing die-bonding integrated film 株式会社力森诺科 2023-12-01 CN disclosed
US-20230340259-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND MACROMONOMER COPOLYMER MITSUBISHI CHEMICAL CORPORATION (JP) 2023-10-26 US disclosed
CN-116940600-A Resin composition, cured product, laminate, transparent antenna, method for producing transparent antenna, and image display device 株式会社力森诺科 2023-10-24 CN disclosed
CN-116867811-A Resin composition, cured product, laminate, transparent antenna, method for producing transparent antenna, and image display device 株式会社力森诺科 2023-10-10 CN disclosed
EP-4253438-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND MACROMONOMER COPOLYMER Mitsubishi Chemical Corporation (JP) 2023-10-04 EP disclosed
US-20070066780-A1 Masonry-treating agent DAIKIN INDUSTRIES, LTD. (JP) 2007-03-22 US disclosed
US-7166673-B2 Water-dispersible polyisocyanate composition, process for its production, water-base curable composition and its application DAINIPPON INK AND CHEMICALS, INC. (JP) 2007-01-23 US disclosed
EP-1743910-A1 POLYMER FOR MASONRY TREATMENT AND TREATING AGENT Daikin Industries, Ltd. (JP) 2007-01-17 EP disclosed
EP-0806463-B2 Coating composition KANSAI PAINT CO LTD (JP) 2006-09-27 EP disclosed
EP-1640387-A1 MASONRY-TREATING AGNET Daikin Industries, Ltd. (JP) 2006-03-29 EP disclosed
US-20050233483-A1 Method of manufacturing semiconductor device, acid etching resistance material and copolymer KABUSHIKI KAISHA TOSHIBA (JP) 2005-10-20 US disclosed
EP-0806463-B1 Coating composition KANSAI PAINT CO LTD (JP) 2002-09-25 EP disclosed
US-5891961-A VINYL RESIN HAVING A STRUCTURE OF 2-(2'-HYDROXYPHENYL)-BENZOTRIAZOLE IN THE RESIN SKELETON AND A CROSSLINKING AGENT KANSAI PAINT CO., LTD (JP) 1999-04-06 US disclosed
EP-0806463-A2 Coating composition KANSAI PAINT CO., LTD. (JP) 1997-11-12 EP disclosed
JP-H05202347-A ALKALINE WATER-SOLUBLE TACK AGENT AND MASKING TAPE SEKISUI CHEM CO LTD 1993-08-10 JP disclosed