SCHEMBL6430337

SCHEMBL6430337

C=CC(=O)OCC(C)OC(=O)C1CCCCC1C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.49
TAAR1 Q96RJ0 1/20 0.33
RAB9A P51151 1/20 0.33
TP53 P04637 2/20 0.32
CYP3A4 P08684 2/20 0.32
ACE P12821 1/20 0.31
ALDH1A1 P00352 1/20 0.31
MAPK1 P28482 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
HIF1A Q16665 1/20 0.31
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20598681 0.94 TSHR (0.54) TSHRTP53CYP3A4ALDH1A1MAPK1
SCHEMBL1151516 0.89 TSHR (0.41) TSHRTAAR1RAB9ATP53CYP3A4
SCHEMBL28029410 0.85 TSHR (0.46) TSHRTAAR1TP53CYP3A4ACE
SCHEMBL691186 0.83 TSHR (0.46) TSHRRAB9ATP53CYP3A4ALDH1A1
SCHEMBL6432713 0.83 TSHR (0.47) TSHRALDH1A1MAPK1SMN1; SMN2HPGD
SCHEMBL11806523 0.82 TSHR (0.50) TSHRTAAR1RAB9ATP53CYP3A4
SCHEMBL14454127 0.82 PEPD (0.36) TAAR1RAB9ATP53CYP3A4ACE
SCHEMBL4940022 0.80 ACE (0.34) TSHRTAAR1TP53CYP3A4ACE
SCHEMBL12342316 0.80 RAB9A (0.33) TAAR1RAB9ATP53CYP3A4ACE
SCHEMBL27641855 0.78 TSHR (0.39) TSHRTAAR1TP53CYP3A4ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11685841-B2 Adhesives and related methods AVERY DENNISON CORPORATION (US) 2023-06-27 US claimed
EP-1306897-B1 Method of making electrode-to-electrode bond structure FUJITSU LTD (JP) 2013-12-11 EP disclosed
US-6873056-B2 Electrode-to-electrode bond structure FUJITSU LIMITED (JP) 2005-03-29 US disclosed
US-20040106232-A1 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby FUJITSU LIMITED (JP) 2004-06-03 US disclosed
US-6670264-B2 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby FUJITSU LIMITED (JP) 2003-12-30 US disclosed
EP-1306897-A2 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby FUJITSU LIMITED (JP) 2003-05-02 EP disclosed
US-20030080397-A1 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby FUJITSU LIMITED (JP) 2003-05-01 US disclosed