SCHEMBL6919986

SCHEMBL6919986

[CH2]CCOCOC[CH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL220556 0.82
SCHEMBL51690 0.82
SCHEMBL9004393 0.81
SCHEMBL9497462 0.79
SCHEMBL19136736 0.79
SCHEMBL7620160 0.78
SCHEMBL219996 0.76
SCHEMBL4257983 0.76 MEN1 (0.32)
SCHEMBL2096681 0.75
SCHEMBL6971580 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0995780-B1 Aqueous self-curing copolymer dispersions, process for their preparation and their use as binder for paints SURFACE SPECIALITIES AUSTRIA G (AT) 2003-08-06 EP claimed
US-6515042-B2 Shell-core polymers SOLUTIA AUSTRIA GMBH (AT) 2003-02-04 US claimed
US-10626287-B2 Resin composition for underlayer film formation, layered product, method for forming pattern, and process for producing device FUJIFILM CORPORATION (JP) 2020-04-21 US disclosed
US-10246605-B2 Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device FUJIFILM CORPORATION (JP) 2019-04-02 US disclosed
US-10191375-B2 Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit and process for producing device FUJIFILM CORPORATION (JP) 2019-01-29 US disclosed
US-20180002561-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, IMPRINT FORMING KIT, LAMINATE, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2018-01-04 US disclosed
US-9746771-B2 Laminate body FUJIFILM CORPORATION (JP) 2017-08-29 US disclosed
US-20170158905-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, IMPRINT FORMING KIT, AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-06-08 US disclosed
US-20170146907-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, IMPRINT FORMING KIT AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-05-25 US disclosed
US-20170088743-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-03-30 US disclosed
EP-3037880-A1 LAMINATE BODY Fujifilm Corporation (JP) 2016-06-29 EP disclosed
US-20160170303-A1 LAMINATE BODY FUJIFILM CORPORATION (JP) 2016-06-16 US disclosed
EP-0214935-B1 STERICALLY HINDERED SILICON ESTER STABILIZERS CIBA-GEIGY AG (CH) 1993-03-31 EP disclosed
EP-0214935-A2 Sterically hindered silicon ester stabilizers CIBA-GEIGY AG (CH) 1987-03-18 EP disclosed
US-4636573-A FOR POLYMERS CIBA-GEIGY CORPORATION, 444 SAW MILL RIVER ROAD, ARDSLEY, NY, A CORP OF NY 1987-01-13 US disclosed