SCHEMBL6924950

SCHEMBL6924950

C=C(C)C(=O)OCCN(C(N)=O)c1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
POLB P06746 1/20 0.41
APEX1 P27695 1/20 0.41
SMN1; SMN2 Q16637 3/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
CYP3A4 P08684 1/20 0.40
CYP2C9 P11712 1/20 0.40
CYP2C19 P33261 1/20 0.40
ALDH1A1 P00352 4/20 0.39
TSHR P16473 3/20 0.39
GLA P06280 1/20 0.39
TP53 P04637 1/20 0.39
THRB P10828 1/20 0.38
ADRA2C P18825 1/20 0.36
ELANE P08246 1/20 0.36
MTNR1A P48039 1/20 0.35
MTNR1B P49286 1/20 0.35
LMNA P02545 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1326466 0.90 HTT (0.43) HTTTDP1POLBAPEX1SMN1; SMN2
SCHEMBL16678518 0.87 TDP1 (0.37) HTTTDP1POLBAPEX1SMN1; SMN2
SCHEMBL14123782 0.83 TSHR (0.41) HTTTDP1POLBAPEX1SMN1; SMN2
SCHEMBL2481420 0.83 SMN1; SMN2 (0.48) HTTTDP1POLBAPEX1SMN1; SMN2
SCHEMBL1256483 0.82 MTNR1A (0.49) HTTTDP1POLBAPEX1SMN1; SMN2
SCHEMBL31582668 0.82 POLB (0.44) HTTTDP1POLBAPEX1SMN1; SMN2
SCHEMBL8857304 0.81 TDP1 (0.48) HTTTDP1POLBAPEX1SMN1; SMN2
Hydrochloric Acid SCHEMBL1229428 0.81 MTNR1A (0.47) HTTTDP1POLBAPEX1SMN1; SMN2
SCHEMBL1011170 0.81 POLB (0.43) HTTTDP1POLBAPEX1SMN1; SMN2
SCHEMBL14123742 0.80 TSHR (0.38) HTTTDP1POLBAPEX1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6515081-B2 Thermosetting resin, compound containing one functional group which can react with thermosetting resin or its curing agent; sports applications, aerospace applications, industrial applications TORAY INDUSTRIES, INC. (JP) 2003-02-04 US disclosed
US-6399199-B1 EPOXY RESIN, CURING AGENT AND MATRIX RESIN TORAY INDUSTRIES INC. (JP) 2002-06-04 US disclosed
US-20020007022-A1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2002-01-17 US disclosed
EP-0947562-A1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 1999-10-06 EP disclosed