SCHEMBL700157

SCHEMBL700157

C=CONC(N)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9429045 0.77
SCHEMBL4292636 0.74
SCHEMBL20875723 0.74
SCHEMBL1312664 0.73
SCHEMBL28399257 0.71
Ammonia Solution, Strong SCHEMBL3240512 0.71
SCHEMBL27616438 0.69 ALDH1A1 (0.33)
SCHEMBL28820477 0.69
SCHEMBL27558908 0.69
SCHEMBL7306605 0.67 ALDH1A1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 109 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12448546-B2 Assembly for fuel cell, and laminated body TOYOBA CO., LTD. (JP) 2025-10-21 US disclosed
EP-3590703-B1 LAMINATED FILM TOYO BOSEKI (JP) 2025-08-06 EP disclosed
US-12241005-B2 Laminated body TOYOBA CO., LTD. (JP) 2025-03-04 US disclosed
US-12128656-B2 Laminated film TOYOBO CO., LTD. (JP) 2024-10-29 US disclosed
CN-116568744-B Resin composition, pellet, molded article, and method for producing resin composition 三菱化学株式会社 2024-09-17 CN disclosed
CN-115427515-B Resin composition for galvanometer type laser welding, molded article, set for galvanometer type laser welding, in-vehicle camera component, in-vehicle camera module, ultraviolet exposure body, and method for producing molded article 三菱化学株式会社 2024-05-24 CN disclosed
CN-114450827-B Joint body for fuel cell and laminate 东洋纺株式会社 2023-12-01 CN disclosed
EP-4261250-A1 RESIN COMPOSITION, PELLET, MOLDED ARTICLE AND METHOD FOR PRODUCING RESIN COMPOSITION Mitsubishi Chemical Corporation (JP) 2023-10-18 EP disclosed
US-20230303826-A1 RESIN COMPOSITION, PELLET AND MOLDED ARTICLE, AND PROCESS FOR PRODUCING RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2023-09-28 US disclosed
CN-116794930-A Negative polyimide photoresist, method for preparing concave-convex pattern and semiconductor device 常州力得尔电子新材料有限公司 2023-09-22 CN disclosed
EP-0541103-A1 Laminated polyester film DIAFOIL HOECHST CO., LTD. (JP) 1993-05-12 EP disclosed
EP-0307475-B1 FILM FOR THERMAL POROUS PRINTING PAPER TORAY INDUSTRIES, INC. (JP) 1993-03-31 EP disclosed
CN-1064280-A Preparation dissolves in the method for its composition (copolymerization) monomeric (being total to) polymkeric substance ATOCHEM ELF SA (FR) 1992-09-09 CN disclosed
US-5061565-A Comprising a biaxially-stretched polyester having a special energy of crystal fusion; thermosensitivity; resolution; sharpness; uniformity; materials handling TORAY INDUSTRIES, INC. (JP) 1991-10-29 US disclosed
US-5051475-A Surface oriented styrenesulfonic acid polymer for adhesion TORAY INDUSTRIES, INC. (JP) 1991-09-24 US disclosed
US-4908277-A Composite polyester film and surface layer containing oriented styrenesulfonic acid groups TORAY INDUSTRIES, INC. (JP) 1990-03-13 US disclosed
EP-0282955-A2 Polyester film TORAY INDUSTRIES, INC. (JP) 1988-09-21 EP disclosed
US-4551307-A FIBROUS DEVELOPING LAYER CONTAINING INTERACTIVE COMPOSITION KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) 1985-11-05 US disclosed
US-4430436-A QUALITATIVE ANALYSIS; IMMUNOASSAY; HEAT-RESISTANT POLYMER PARTICLES FORMING A THREE-DIMENSIGNAL LATTICE KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) 1984-02-07 US disclosed
US-4427632-A LIGHT TRANSMISSIVE SUPPORT, REAGENT LAYER, DEVELOPING LAYER FORMED BY COATING REAGENT LAYER WITH MACROMOLECULAR POLYMER KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) 1984-01-24 US disclosed