Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 5/20 | 0.48 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.48 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.48 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.48 |
| ▸ | TBXA2R | P21731 | 1/20 | 0.48 |
| ▸ | GALR3 | O60755 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.47 |
| ▸ | BLM | P54132 | 1/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.36 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.33 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.32 |
| ▸ | CTSK | P43235 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2355051 | 0.93 | TSHR (0.54) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL1822921 | 0.92 | TSHR (0.42) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL1821138 | 0.92 | TSHR (0.42) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL27646123 | 0.90 | TSHR (0.44) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL251201 | 0.84 | TSHR (0.47) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL140964 | 0.84 | TSHR (0.47) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| Water SCHEMBL8208129 | 0.83 | TSHR (0.45) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL28755870 | 0.83 | TSHR (0.46) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL60590 | 0.82 | TSHR (0.48) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| Propylene Glycol Diacetate SCHEMBL8503200 | 0.81 | TDP1 (0.54) | TSHRCHRM2CHRM4CHRM1TBXA2R |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 208 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240228739-A1 | COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, AND CURED PRODUCT | ADEKA CORPORATION (JP) | 2024-07-11 | — | — | US | disclosed |
| CN-117413022-A | Composition, method for producing cured product, and cured product | 株式会社ADEKA | 2024-01-16 | — | — | CN | disclosed |
| WO-2023238286-A1 | PHOTOSENSITIVE RESIN COMPOSITION | ラサ工業株式会社 | 2023-12-14 | — | — | WO | disclosed |
| CN-117075425-A | Polysiloxane composition, composition for forming film, laminate, touch panel, and method for forming cured film | 阪田油墨株式会社 | 2023-11-17 | — | — | CN | disclosed |
| CN-117069942-A | Polysiloxane compound, composition for forming film, laminate, touch panel, and method for forming cured film | 阪田油墨株式会社 | 2023-11-17 | — | — | CN | disclosed |
| US-11681222-B2 | Fluorine-containing polymer, purification method, and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2023-06-20 | — | — | US | disclosed |
| US-11678562-B2 | Methods and systems of organic semiconducting polymers | PHILLIPS 66 COMPANY (US) | 2023-06-13 | — | — | US | disclosed |
| CN-114430767-B | Composition for forming film, laminate coated with the composition, touch panel using the laminate, and method for forming cured film | 阪田油墨株式会社 | 2023-04-28 | — | — | CN | disclosed |
| US-11600779-B2 | Methods and systems of organic semiconducting polymers | PHILLIPS 66 COMPANY (US) | 2023-03-07 | — | — | US | disclosed |
| WO-2022249879-A1 | COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, AND CURED PRODUCT | 株式会社ADEKA | 2022-12-01 | — | — | WO | disclosed |
| US-20020009668-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |
| EP-1164434-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |
| EP-1162506-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-12 | — | — | EP | disclosed |
| US-20010041769-A1 | Polysiloxane, method of manufacturing same, silicon-containingalicyclic compouns, and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2001-11-15 | — | — | US | disclosed |
| EP-1142928-A1 | Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin compounds | JSR Corporation (JP) | 2001-10-10 | — | — | EP | disclosed |
| EP-1085379-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-03-21 | — | — | EP | disclosed |
| US-6180316-B1 | SUITABLE FOR USE AS CHEMICALLY AMPLIFIED RESIST USED IN MANUFACTURING OF INTEGRATED CIRCUITS | JSR CORPORATION (JP) | 2001-01-30 | — | — | US | disclosed |
| EP-1048983-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 2000-11-02 | — | — | EP | disclosed |
| US-6120858-A | COMPRISING AN EPOXY RESIN, A NOVOLAC RESIN, A CURING ACCELERATOR AND A TITANIUM BLACK PIGMENT | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2000-09-19 | — | — | US | disclosed |
| EP-0930541-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 1999-07-21 | — | — | EP | disclosed |