SCHEMBL701496

SCHEMBL701496

C=C(CC(C)(C)NC(N)=O)OC(=C)CC(C)(C)NC(N)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10056337 0.74 HMGCR (0.44)
SCHEMBL16035548 0.72
SCHEMBL10056290 0.71 GAA (0.46)
SCHEMBL1526412 0.69
SCHEMBL729760 0.69
SCHEMBL7918442 0.69
SCHEMBL3926071 0.67 POLB (0.47)
SCHEMBL9341901 0.67
SCHEMBL3392434 0.67 ALDH1A1 (0.39)
Fluoride SCHEMBL28884982 0.67 EPHX1 (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115443307-A Resin composition, molded article, set, vehicle-mounted camera component, vehicle-mounted camera module, and method for producing molded article 三菱工程塑料株式会社 2022-12-06 CN disclosed
CN-115427515-A Resin composition for galvanometer laser welding, molded article, galvanometer laser welding kit, onboard camera part, onboard camera module, ultraviolet exposure body, and method for manufacturing molded article 三菱工程塑料株式会社 2022-12-02 CN disclosed
CN-114450827-A Fuel cell assembly and laminate 东洋纺株式会社 2022-05-06 CN disclosed
CN-114450152-A Laminated body 东洋纺株式会社 2022-05-06 CN disclosed
US-20210340346-A1 METAL FILM-COATED MOLDED RESIN ARTICLES AND PRODUCTION METHOD THEREFOR MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2021-11-04 US disclosed
CN-113366056-A Resin composition for powder-stacking molding, pellet, powder, method for producing molded article, and molded article 三菱工程塑料株式会社 2021-09-07 CN disclosed
EP-3851553-A1 METAL-COATED MOLDED RESIN ARTICLES AND PRODUCTION METHOD THEREFOR Mitsubishi Engineering-Plastics Corporation (JP) 2021-07-21 EP disclosed
CN-112654728-A Resin molded article with metal film and method for producing same 三菱工程塑料株式会社 2021-04-13 CN disclosed
WO-2021060000-A1 ASSEMBLY FOR FUEL CELL, AND LAMINATE 東洋紡フイルムソリューション株式会社 2021-04-01 WO disclosed
WO-2021059998-A1 MULTILAYER BODY 東洋紡フイルムソリューション株式会社 2021-04-01 WO disclosed
US-5607897-A Polyester film for sublimation-type thermosensitive transfer recording medium DIAFOIL HOECHST COMPANY, LIMITED (JP) 1997-03-04 US disclosed
US-5540974-A MOIST HEAT RESISTANCE, WORKABILITY DIAFOIL HOECHST COMPANY, LIMITED (JP) 1996-07-30 US disclosed
EP-0707979-A2 Polyester film for sublimation-type thermosensitive transfer recording medium DIAFOIL HOECHST CO., LTD (JP) 1996-04-24 EP disclosed
EP-0282955-B1 Polyester film TORAY INDUSTRIES (JP) 1994-08-10 EP disclosed
EP-0602583-A2 Metallized polyester film capacitor DIAFOIL HOECHST CO., LTD (JP) 1994-06-22 EP disclosed
EP-0307475-B1 FILM FOR THERMAL POROUS PRINTING PAPER TORAY INDUSTRIES, INC. (JP) 1993-03-31 EP disclosed
US-5061565-A Comprising a biaxially-stretched polyester having a special energy of crystal fusion; thermosensitivity; resolution; sharpness; uniformity; materials handling TORAY INDUSTRIES, INC. (JP) 1991-10-29 US disclosed
US-5051475-A Surface oriented styrenesulfonic acid polymer for adhesion TORAY INDUSTRIES, INC. (JP) 1991-09-24 US disclosed
US-4908277-A Composite polyester film and surface layer containing oriented styrenesulfonic acid groups TORAY INDUSTRIES, INC. (JP) 1990-03-13 US disclosed
EP-0282955-A2 Polyester film TORAY INDUSTRIES, INC. (JP) 1988-09-21 EP disclosed